• Title/Summary/Keyword: bisphenol-A

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Curing and Rheological Behavior of Epoxy Resin Compositions for Underfill (언더필용 에폭시 수지 조성물의 경화 및 유변학적 거동)

  • Kim, Yoon-Jin;Park, Min;Kim, Jun-Kyung;Kim, Jin-Mo;Yoon, Ho-Gyu
    • Elastomers and Composites
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    • v.38 no.3
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    • pp.213-226
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    • 2003
  • The cure and rheological behavior of diglycidyl ether of bisphenol F/nadic methyl anhydride resin system with the kinds of imidazole were studied using a differential scanning calorimeter (DSC) and a rotational rheometer. The isothermal traces were employed to analyze cure reaction. The DGEBF/ anhydride conversion profiles showed autocatalyzed reaction characterized by maximum conversion rate at $20{\sim}40 %$ of the reaction. The rate constants ($k_1,\;k_2$) showed temperature dependance, but reaction order did not. The reaction order (m+n) was calculated to be close to 3. There are two reaction mechanisms with the kinds oi catalyst. The gel time was determined by using G'-G" crossover method, and the activation energy was obtained from this results. From measurement of rheological properties it was found that the logarithmic 1:elation time of fused silica filled DBEBF epoxy compounds linearly increased with the content of filler and decreased with temperature. The highly filled epoxy compounds showed typical pseudoplastic behavior, and the viscosity of those decreased with increasing maximum packing ratio.

Cure Kinetics of a Bisphenol-A Type Vinyl-Ester Resin Using Non-Isothermal DSC

  • Ahn, WonSool
    • Elastomers and Composites
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    • v.53 no.1
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    • pp.1-5
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    • 2018
  • In the current research, the curing kinetics of a mixture system consisting of a Bisphenol-A type vinyl ester resin and styrene monomer was studied. Methylethylketone peroxide and cobalt octoate were used as the polymerization initiator and accelerator respectively. Thermograms with several different heating rates were obtained using non-isothermal differential scanning calorimetry. Activation energy values analyzed by the Flynn-Wall-Ozawa isoconversional method showed a three-step change with conversion ${\alpha}$: a slight decrease initially for ${\alpha}$ < 0.1, a constant value of 47.9 kJ/mol in the range 0.1 < ${\alpha}$ < 0.7, and a slow increase for 0.7 < ${\alpha}$. When assuming a constant activation energy of 47.9 kJ/mol, an autocatalytic model of the Sestak-Berggren equation was considered as the proper mathematical model of the conversion function, indicating an overall order of 1.2.

Low- Temperature Decomposition of Epoxy Resin

  • Katsuhiko Saido;Hiroyuki Taguchi;Yoichi Kodera;Takeshi Kuroki;Park, Jeong-Hun;Chung, Seon-Yong
    • Macromolecular Research
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    • v.12 no.5
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    • pp.490-492
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    • 2004
  • We report a new method using a heating medium for the thermal decomposition of epoxy resin (EP) at temperatures ranging from 50 to 200$^{\circ}C$. EP decomposition also occurred below 50$^{\circ}C$ during a 6-day period to generate bisphenol A (BPA) at concentrations as high as 5 ppm. When polyethylene glycol was used as a heating medium, we determined the kinetics of the EP decomposition at low temperature. We determined the apparent activation energy of the overall decomposition to be 40.8 kJ/mol and the frequency factor to be 2.3${\times}$10$^3$ by monitoring the rate of BPA formation. Thus, EP is clearly unstable upon the application of heat.