• 한국표면공학회지
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• 제27권5호
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• pp.292-302
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• 1994

Alloy deposits of 80Sn-20Pb, electroplated on Cu-based leadframe alloy from an organic sulfonate bath were aged at $150^{\circ}C$ to form intermetallic phases between substrate and deposit, and effects of the deposit morphology, influenced by deposition conditions, on the fracture resistance of the 80Sn-20Pb deposit aged at $150^{\circ}C$ were examined. The growth rate of intermetallic compound layer on aging depended on the microstructure of deposit ; it was fastest in deposit formed using pulse current in bath without grain refining additive, but slowest in deposit formed using dc current in bath containing grain refining additive in spite of similar structure with equivalent grain size. The grain refining additive incorporated in electrodeposit appears to inhibit diffusion of atoms on aging, resulting in slow growth of intermetallic layer in the thickness direction but substantial growth in the lateral one. Density of surface cracks that were occurring when samples were subjected to the $90^{\circ}$-bending test increased with increasing the thickness of intermatallic layer on aging. For the same aged samples, the surface crack density of the sample electrodeposited from a bath containing the grain refining additive was the least due to the inhibiting effect of the additive incorporated into the deposit during electrolysis on atomic diffusion.

• 마이크로전자및패키징학회지
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• 제13권2호
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• pp.9-13
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• 2006

COF에 사용되는 구리배선은 폴리이미드 필름에 subtractive 방법을 이용하여 만들어지고 있으나 선폭이 작아짐에 따라 subtractive 방법은 폭방향으로 에칭 현상으로 인하여 사용에 제한이 되고 있다. Semi-additive 방법은 리소그래피 공정과 전기도금범을 사용하여 구리배선을 만드는 방법으로 $10-40{\mu}m$의 좁은 선폭에 대한 연구를 하였다. AZ4620과 PMER900의 두꺼운 PR을 사용하였으며 전기도금법을 이용하여 구리 배선을 형성하였다. 기존의 용액은 높은 잔류응력으로 인하여 구리도금층에 crack이 발생하였으며 via filling에 사용된 도금액을 사용한 경우 잔류응력이 낮아서 crack이 없는 구리배선을 얻을 수 있었다. 기지층의 에칭시 배선의 폭방향으로의 에칭 현상은 관찰되지 않았다.

• 멤브레인
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• 제22권4호
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• pp.258-264
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• 2012

본 연구에서는 응고조와 도프조성에 따른 투과특성을 알아보기 위해 첨가제로 PEG, PVP를 사용하였고, 상전이법을 이용하여 PSf 평막을 제조하였다. 고분자의 농도, 첨가제의 농도 그리고 응고조의 조성을 달리하여 제막하였다. 평막의 모폴로지와 수투과도를 각각 FE-SEM과 수투과 테스트 장치를 이용하여 측정하였다. 가장 높은 수투과도(986 L/mh)는 PSf 15 wt%, PEG 25 wt% 그리고 응고조로 물이 사용되었을 경우 나타났다. PSf/PEG조성일때 응고조에 DMAc의 함량이 증가할수록 순수투과도는 급격히 감소하였다. 그러한 결과 첨가제의 함량과 응고조의 조성의 변화가 모폴로지와 수투과 특성에 영향을 미치는 것을 확인하였다.

• 한국표면공학회지
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• 제31권4호
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• pp.191-198
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• 1998

The effect of the additives on the Zn-Ni alloy electrocrystallization from a chloride bath was investigated by means of electrochemical methodes, scanning electron microscopy and measurement of surface appearancd, X-ray diffraction patterns. The additives thestd ware the Saccharin, surfactant of naptalene-derivative and mixed additive, The resistance of electrodeposit increased by adding the additives, whera the effect of additives on resistance was different with current density roughness, apperarance and morphology of deposit were also influenced by the type of additive. The deposir with fine, compact grains as well as good surface roughness and appearance was obtained from the mixed-additive added bath.

• 한국표면공학회지
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• 제46권4호
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• pp.153-157
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• 2013

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.

• Corrosion Science and Technology
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• 제3권3호
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• pp.112-117
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• 2004

This work investigated the material properties of Ni-P-B alloy electrodeposits obtained from a Ni sulfamate bath as a function of the contents of the P and B sources($H_3PO_3$ and dimethyl amine borane complex(DMAB), respectively) with/without additives. Chemical composition, residual stress, microstructure and micro hardness were investigated using ICP(inductively coupled plasma) mass spectrometer, flexible strip, XRD, TEM and micro Vickers hardness tester, respectively. From the results of the compositional analysis, it was observed that P and B are incorporated competitively during the electrodeposition and the sulfur from the additive is codeposited into the electrodeposit. The measured residual stress value increased in the order of Ni, Ni-P, Ni-B and Ni-P-B electrodeposits indicating that boron affects the residual tensile stress greater than phosphorus. As the contents of the alloying element sources of P and B increased, crystallinity and the grain size of the electrodeposit decreased. The effect of boron on crystallinity and grain size was also relatively larger than the phosphorus. It can be explained that the boron with a smaller atomic radius contributes to the increase of residual stress in the tensile direction and the larger restraining force against the grain growth more significantly than the phosphorus with a larger atomic radius. Introduction of an additive into the bath retarded crystallization and grain growth, which may be attributed to the change of the grain growth kinetics induced by the additive adsorbed on the substrate and electrodeposit surfaces during electrodeposition.

• 한국표면공학회지
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• 제25권4호
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• pp.173-180
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• 1992

The effects of the stabilizing additives such as NaCN, 2-MBT and Thiourea on bath decom-position, plating rate and surface morphology have been studied. Bath stability was increased in the order of an additive-free bath, and NaCN-, 2-MBT-, and Thiourea-stabilized baths. The sta-bilizing effects may be attributed to the stability of Cu(II) -complexes. The plating rate is the re-verse order of the bath stability. Accelerative effect of 2-MBT in proper quantity(0.3mg/$\ell$) may be explained by visualizing it absorbed through benzene ring or sulfur atom on portions of the sub-strates. The strong bond of the complexing part of the molecule to nearby chelated copper ions would tend to accelerate plating by making it easier for the Cu2+ -ligand bond to be broken. Sur-face morphologies of copper deposits depend on the bath additives. Electroless copper deposits from the 2-MBT stabilized baths are finer than the deposits from the NaCN- and Thiourea- stabi-lized baths due to the strong adsorption on the substrates.

• 한국표면공학회지
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• 제36권6호
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• pp.437-443
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• 2003

The effects of additive(grain refiner, GR) on process efficiency of the Ni-Fe-P alloy electrodeposition and the material properties of the deposit were investigated. Electrochemical properties of the deposits were investigated using polarization and electrochemical impedance techniques, and the material properties of the deposits were characterized through inductively coupled plasma(ICP), spiral contractometer, XRD, SEM and TEM. When the additive was added into the electrodeposition bath, current efficiency, Ni content and corrosion resistance of the deposit increased, whereas residual stress, surface roughness and grain size of the deposit decreased.

• 동의생리병리학회지
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• 제20권3호
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• pp.642-650
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• 2006

As an effective non-pharmacological method of pain relief, hydrotherapy was widely used. And bath additive has been used for enhancing the efficacy of hydrotherapy, In the present study, as a bath additive, the analgesic activity of HAC, which composed of Corydalis turtschaninovii, Atractylodes japonica, and Harpagophytum procumbens(HAC), was investigated in the ventrolateral periaqueductal gray (VIPAG), lateral PAG (IPAG), central nuclei of amygdala (CeA), and the paraventricular nucleus of the hypothalamus (PVN) in mice, using writhing test and immunohistochemistry for c-Fos. Male C57BU6 mice weighing $25{\;}{\pm}{\;}2g$ (8 weeks of age) were used for this experiment. The animals were divided into five groups: the control group, the acetic acid treatment group, the acetic acid treatment and 0.01 g/L HAC-immersed group, the acetic acid treatment and 0.1 g/L HAC-immersed group, and the acetic acid treatment and 1.0 g/L HAC-immersed group. To induce somato-visceral pain in the experimental animals, a single intraperitoneal (i.p.) injection of acetic acid was administrated to each animal, and the animals of the control group received injections of equivalent doses of normal saline. The animals of the HAC-immersed groups were immersed the water with HAC powder at the respective doses deep enough to cover the mice body, and those of the control group and the acetic acid treatment group immersed the water without HAC powder at 10 min immediately after the acetic acid injection. Our present study has shown that the HAC reduced the acetic acid-induced abdominal constrictions and the acetic acid-Induced increase of numbers of c-Fos-positive cells in the VIPAG, IPAG, PVN, and CeA. The most potent analgesic effect appeared with the treatment of 1.0 g/L KB-immersed group. Based on our present results, it is very possible that HAC can be a potent therapeutic bath additive for alleviating pain without the fear of addiction to the drugs and side-effects associated with the prescription of multiple analgesic drugs.

• 한국표면공학회지
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• 제39권1호
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• pp.13-17
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• 2006

The effects of an organic additive, naphthalene trisulfonic acid (NTSA), contained in the nickel sulfamate bath on the surface properties of the electrodeposited nickel layer were investigated through electrochemical technique, x-ray diffraction analysis, and microscopic observation. The addition of NTSA facilitated the oxidation process of electrodeposited nickel layer during anodic scan and also increased the hardness and internal stress of the nickel film as the applied current density became higher. It seems that NTSA modulated the deposit structure during electrodeposition and so induced higher distribution of (110) orientation with respect to (200). With the increase of the NTSA in the bath, nickel layer was formed in small grain size, which resulted in enhanced surface evenness and brightness.