1 |
M. Pushpavanm, Bulletin of EIectrochemistry 15,5-6 (1999) 211-214.
|
2 |
B. C. Baker, A. C. West, J. Electrochem. Soc.,144, 1 (1997) 164
DOI
ScienceOn
|
3 |
H. T. Kim, Effect of additives on the eiectrocrystalli-zation of Zn, Zn-Ni alloy electrodeposition fromchloride-based electrolyte, (1998) 62
|
4 |
J. P. Bonino, P. Pouderous, C. Rossignol, A. Rousset,Plating & Surface Finishing, (1992) 62
|
5 |
M. Paunovic, M. Schlesinger, Fundamentals ofelectrochemical deposition, Wiley, New York, (1998) 167
|
6 |
J. H. Lee, Bul. Kor. Inst. Met. & Mater., 12, 6(1999) 658-666
|
7 |
C. Cheung, F. Djunada, U. Erb, G. Palumbo, Nanostructured Materials 5, 5 (1995) 513
DOI
ScienceOn
|
8 |
K. Sridharan, K. Sheppard, J. Applied Electrochemistry, 29 (1997) 1198-1206
|
9 |
J. S. Lee, S. T. Oh, J. H. You, Bulletin of Korean Ins. Met. & Mat., 14, 7 (2001) 24-34.
|
10 |
J. S. Kim, Repair technique of steam generatortubes using electroforming, Report No. KAERI/AR-601/2001, (2001) 27
|
11 |
E. Grunwald : Procedee modeme de protectie asuprafetelor, MICHODPT, Bucuresti, (1969)
|
12 |
K. J. Vetter, F. Gom, Electrochim. Acta 18 (1973)321
DOI
ScienceOn
|
13 |
E. Raub, N. Baba, M. Stabyer, Advance Copy(E15),6th Intemat. Metal Finishing Conference, London,(1964) 96
|
14 |
L. Oniciu, L. Muresan, J. Applied Electrochemistry,21 (1991) 565
DOI
|
15 |
T. C. Franklin, Surf. Coat. Tech., 30 (1987) 415
DOI
ScienceOn
|
16 |
N. Kaneko, N. Shinohara, H. Nezum Electrochim.Acta 38, 10 (1993) 1351
DOI
ScienceOn
|