• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.69-72
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• 2002

The geometry parameter of tool such as rake angle and clearance angle is defined clearly to solve the difference in communication between design and measurement stage. Using the developed simulation program, wheel is properly determined and end mill can be manufactured accurately. The performance test with well defined end mill provides sufficient information to decide optimal geometry. For machining hardened steel, end mills are designed and manufactured. Optimal rake angle and clearance angle is obtained from performance test. A specific software for automatic end mill production is developed far simulation and fur generation of NC code as Cad/CAM system.

• 센서학회지
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• 제28권4호
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• pp.251-255
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• 2019

We propose a two-step lithography process to minimize edge-bead issues caused by thick photoresist (PR) coating. In the conventional PR process, the edge bead can be efficiently removed by applying an edge-bead removal (EBR) process while rotating the silicon wafer at a high speed. However, applying conventional EBR to the production of desired PR mold with unique negative patterns cannot be used because a lower rpm of spin coating and a lower temperature in the soft bake process are required. To overcome this problem, a two-step lithography process was developed in this study and applied to the fabrication of a polydimethylsiloxane (PDMS) film having super-hydrophobic characteristics. Following UV exposure with a first photomask, the exposed part of the silicon wafer was selectively removed by applying a PR developer while rotating at a low rpm. Then, unique PR mold structures were prepared by employing an additional under-exposure process with a second mask, and the mold patterns were transferred to the PDMS. Results showed that the fabricated PDMS film based on the two-step lithography process reduced the height difference from 23% to 5%. In addition, the water contact angle was greatly improved by spraying of hydrophobic nanosilica on the dual-scaled PDMS surface.

• 한국광학회지
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• 제21권6호
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• pp.241-246
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• 2010

본 논문에서는 근접장 패턴의 깊이와 종횡비(aspect ratio) 향상을 위해 전기장이 적용된 노광후굽기(electric field enhanced postexposure baking) 공정을 제안하였다. 전기장이 적용된 노광후굽기 공정 중 광산(photoacid) 분포를 기술하기 위하여 픽(Fick)의 확산 제 2법칙에 기반을 둔 지배방정식을 구성하였다. 수치해석(numerical calculation)을 통해 전기장의 세기가 0 에서 $8.0{\times}10^6\;V/m$ 로 증가함에 따라 광산의 수직적 이동거리가 늘어나는 것에 반해 수평적 이동거리는 거의 변화가 없음을 확인하였고, 이 때 근접장 패턴 형상을 얻었다. 이를 통해 근접장 패턴의 깊이, 종횡비, 패턴의 측벽 각(sidewall angle)이 향상됨을 알 수 있었다.