• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.347-347
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• 2007

• The Magazine of the IEIE
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• v.29 no.5
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• pp.119-127
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• 2002

• Information and Communications Magazine
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• v.9 no.4
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• pp.31-39
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• 1992

• Electrical & Electronic Materials
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• v.27 no.11
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• pp.20-30
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• 2014

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.189-192
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• 2008

A 5.8-inch wide-QQVGA flexible full-color active-matrix OLED display was fabricated on a plastic substrate. Low-voltage-operation organic TFTs and high-efficiency phosphorescent OLEDs were used as the backplane and emissive pixels, respectively. The fabricated display clearly showed color moving images when the driving voltage was below 15 V.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.123-126
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• 2008

We report the improved AMOLED with a-Si TFT backplane based on our unique structure. Our new structure is called Dual-plate OLED Display (DOD). It can also achieve not only higher uniformity of luminance in large-sized display due to low electrical resistance of common electrode but also wider viewing angle.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.119-122
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• 2008

In this paper, we describe the current status and issues of the oxide thin-film transistors (OTFTs), which attract much attention as an emerging new backplane technology replacing conventional silicon-based TFTs technologies. First, the unique benefits of OTFTs will be presented as a backplane for large-sized AMOLED including note-book PC, second TV and HD-TV. And then, the state-of-the-art transistor performance and uniformity characteristics of OTFTs will be highlighted. The obtained a-IGZO TFTs exhibited the field-effect mobility of $18\;cm^2/Vs$, threshold voltage of 1.8 V, on/off ratio of $10^9$, and subthreshold gate swing of 0.28 V/decade. In addition, the world largest-sized 12.1-inch WXGA active-matrix organic light emitting diode (AMOLED) display is demonstrated using indium-gallium-zinc oxide (IGZO) TFTs.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.898-901
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• 2005

We propose a novel pixel structure using bootstrapped voltage programming for amorphoussilicon TFT backplane of AM-OLED (Active Matrix-Organic Light Emitting Diode) displays. The proposed structure is composed of two TFTs and one capacitor. It operates at low drive voltage ($0{\sim}5V$) which can reduce power consumption comparing with the conventional pixel circuit structure using same OLED material. Also, it can easily control dark level and use commercial mobile LCD ICs. In this paper, we describe the operating principle and the characteristics of the proposed pixel structure and verify the performance by SPICE simulation comparing with the conventional pixel structure.

• Vacuum Magazine
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• v.1 no.2
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• pp.24-29
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• 2014

Display is a key component in electronic devices. OLED is growing very fast recently due to the explosion of the smart phone market although still LCD is the dominating display technology in the display market at the moment. Also needs for the large area and high resolution TVs and flexible displays are increasing these days. Especially flexible display is expected to be one of the key technologies in mobile devices requiring small device size and large display size. Contrary to the conventional displays, flexible display requires organic materials for the substrate, the active driving element and also for the display element. Plastic film as a substrate, organic semiconductor as an active component of the transistor and organic light emitting materials or electronic paper as a display element are studied actively. In this article, mainly backplane technologies such as substrates and the transistor materials for flexible display will be introduced.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.49 no.11
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• pp.637-642
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• 2000

IEEE 1149.1 boundary scan architecture is used as a standard in board-level system testing. The simplicity of this architecture is an advantage in system testing, but at the same time, it it makes a limitation of applications. Because of several problems such as 3-state net conflicts, or ambiguity issues, interconnect testing for multi-drop multi-board systems is more difficult than that of single board systems. A new approach using IEEE 1149.1 boundary scan architecture for multi-drop multi-board systems is developed in this paper. Adding boundary scan cells on backplane bus lines, each board has a complete scan-chain for interconnect test. This new scan-path insertion method on backplane bus using limited 1149.1 test bus less area overhead and mord efficient than previous approaches.