• Journal of Welding and Joining
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• v.17 no.5
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• pp.107-115
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• 1999

The objective of this research was to study the formation of the thick hardened layer with the addition of metal powder(Cu) and ceramics powders(TiC) on the aluminum 5083 alloys by plasma transferred arc process(PTA process) and to characterize the effect of overlaying conditions on the overlaid layer formation. This was followed by investigating the microstructures of the overlaid layers and mechanical properties such as hardness and wear resistance. The overlaid layer containing copper powder was alloyed and intermetallic compound($CuAl_2$) was formed. The overlaid layers with high melting point TiC powders, however, did not react with base metal. Wear resistance of the alloyed layer was remarkably improved by the formation of $CuAl_2$, precipitate phase, which prevented wear of base aluminum alloys and at higher wear speed, accelerated sliding of the counter part. Wear resistance of the composite layer was also remarkably improved because TiC powder act as a load barring element and Fe debris fragments detached from the counter part act as a solid lubricant on the contact surface.

• International Journal of Advanced Culture Technology
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• v.3 no.1
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• pp.153-160
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• 2015

This article is aimed to study the effects of resistance spot welding (RSW) on the lap joint properties between AA1100 aluminum alloy and SGACD zinc coated steel and its properties. The summarized experimental results are as follows. The summarized experimental results are as follows. The optimum welding parameters that produced maximum tensile shear strength of 2200 N was a welding current of 95 kA, a holding time of 10 cycles, and a welding pressure of 0.10 MPa. Increasing of welding current, increased the tensile shear strength of the joint and also increased the amount of aluminum dispersion at the joint interface. The lap joint of steel over the aluminum (Type I) showed the higher joint tensile shear strength than a lap joint of aluminum over the steel (Type II). The indentation depth and the ratio of the indentation depth to the plate thickness decreased when the welding current was increased in the type I lap joint and also decreased when the welding current was decreased in the type II lap joint. The interface structure showed the formation of the brittle $FeAl_3$ intermetallic compound that deteriorated the joint strength.

• Bulletin of the Korean Chemical Society
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• v.15 no.2
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• pp.132-138
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• 1994

Bis(diethylamino)aluminum hydride was utilized in a systematic study of the approximate rates and stoichiometry of the reaction of excess reagent with 55 selected organic compounds containing representative functional groups under standardized conditions (THF, $0^{\circ}C$, reagent to compound=4 : 1) in order to define the characteristics of the reagent for selective reductions. The reducing action of BEAH was also compared with that of the parent aluminum hydride. The reducing action of the reagent is quite similar to that of aluminum hydride, but the reducing power is much weaker. Aldehydes and ketones were readily reduced in 1-3 h to the corresponding alcohols. However, unexpectedly, a ready involvement of the double bond in cinnamaldehyde was realized to afford hydrocinnamyl alcohol. The introduction of diethylamino group to the parent aluminum hydride appears not to be appreciably influential in stereoselectivity on the reduction of cyclic ketones. Both p-benzoquinone and anthraquinone utilized 2 equiv of hydride readily without evolution of hydrogen, proceeded cleanly to the 1,4-reduction products. Carboxylic acids and acid chlorides underwent reduction to alcohols slowly, whereas cyclic anhydrides utilized only 2 equiv of hydride slowly to the corresponding hydroxylacids. Especially, benzoic acid with a limiting amount of hydride was reduced to benzaldehyde in a yield of 80%. Esters and lactones were also readily reduced to alcohols. Epoxides examined all reacted slowly to give the ring-opened products. Primary and tertiary amides utilized 1 equiv of hydride fast and further hydride utilization was quite slow. The examination for possibility of achieving a partial reduction to aldehydes was also performed. Among them, benzamide and N,N-dimethylbenzamide gave ca, 90% yields of benzaldehyde. Both the nitriles examined were also slowly reduced to the amines. Unexpectedly, both aliphatic and aromatic nitro compounds proved to be relatively reactive to the reagent. On the other hand, azo- and azoxybenzenes were quite inert to BEAH. Cyclohexanone oxime liberated 1 equiv of hydrogen and utilized 1 equiv of hydride for reduction, corresponding to N-hydroxycyclohexylamine. Pyridine ring compounds were also slowly attacked. Disulfides were readily reduced with hydrogen evolution to the thiols, and dimethyl sulfoxide and diphenyl sulfone were also rapidly reduced to the sulfides.

• Transactions of Materials Processing
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• v.4 no.1
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• pp.39-47
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• 1995

The compression molding of SMC (sheet molding compund) at room temperature was analyzed based on rigid-viscoplastic approach by three dimensional finite element program. The developed program was tested by solving the three dimensional compression of wedge type specimens of aluminum alloys at various processing conditions. The simulation results were compared well to the experimental results available in the literature. based on this comparison the program was proved to be valid and was further applied in solving compression molding of SMC, which is a thermosetting material reinforced with chopped fiber glass. To investigate the effects of friction conditions and mold closing speeds for compression molding of SMC charge at room temperature, compressions of the cylindrical and rectangular shaped SMC were analyzed for various friction conditions and mold closing speeds. The calculated load values were compared to the experimental results for the compression molding of cylindrical specimen.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.555-560
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• 2002

Brazing of Al to Cu using AI-Si-Mg-Bi brazing alloy has been carried out in the vacuum furnace. In the bonded interlayer, there were two kinds of intermetallic compounds. One of these intermetallic compounds was e phase and the other was b phase. The growth of b phase was controlled by diffusion Al into Cu. Deformation behavior of Al-Cu brazing joint was brittle without deformation of the base metal. Shear strength of the joint was only about 20MPa. The shear specimen broken in the intermetallic compound, which was mainly e phase. Shear strength did not depend on the bonding temperature.

• Journal of the Semiconductor & Display Technology
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• v.3 no.4
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• pp.33-37
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• 2004

As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.77-78
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• 2006

We fabricated photonic crystals on GaAs and GaN substrates. After anodizing the aluminium thin film in electrochemical embient, the porous alumina was implemented to the mask for reactive ion beam etching process of GaAs wafer. And photonic crystals in GaN wafer were also fabricated using electron beam nano-lithography process. The coated PMMA thin film with 200 nm-thickness on GaN surface was patterned with triangular lattice and etched out the GaN surface by the inductively coupled plasma source. The fabricated GaAs and GaN photonic crystals provide the enhanced intensities of light emission for the wavelengths of 858 and 450 nm, respectively. We will present the detailed dimensions of photonic crystals from SEM and AFM measurements.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.67-70
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• 2000

Mechanical properties of (10%$AI_20_3{\cdot}SiO_2$+5%Ni)/Al hybrid composites fabricated by the reaction squeeze casting were compared with those of (15%$AI_20_3{\cdot}SiO_2$)/Al composites. Intermetallic compound formed by reaction between molten aluminum and reinforcing powder was uniformly distributed in the Al matrix. These intermetallic compounds were identified as $Al_3$NI using EDS and X-ray diffraction analysis. Microhardness and flexural strength of hybrid composites were higher than that of (15%$AI_20_3{\cdot}SiO_2$)/Al Composite. In-Situ fracture tests were Conducted on (15%$AI_20_3{\cdot}SiO_2$)/Al Composites and (10%$AI_20_3{\cdot}SiO_2$+5%Ni)/Al hybrid composites to identify the microfracture process. It was identified from the in-situ fracture test of (10%$AI_20_3{\cdot}SiO_2$+5%Ni)/Al composites, microcracks were initiated mainly at the short fiber / matrix interfaces. As the loading was continued, the crack propagated mainly along the separated interfacial regions and the well developed shear bands. It was identified from the in-situ fracture test of (10%$AI_20_3{\cdot}SiO_2$+5%Ni)/Al hybrid composites, microcracks were initiated mainly by the short fiber/matrix interfacial debonding. The crack proceeded mainly through the intermetallic compound clusters

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.534-538
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• 2002

Dissimilar friction stir welding of aluminum (AI) alloy 1050 and magnesium (Mg) alloy AZ31 was successfully done in the limited welding parameters. The dissimilar weld showed good quality and facility compared to conventional fusion weld. Transverse cross section perpendicular to the welding direction had no defects. The weld was divided into base material of Al alloy, an irregular shaped stir zone and base material of Mg alloy. The irregular shaped stir zone was roughly located around the initial weld center. The weld interface near plate surface shifted from initial weld centerline to the advancing side. Hardness profile of the weld was heterogeneous, and the hardness value of the stir zone was raised to about 150 Hv to 250 Hv. The mixed phase was identified to intermetallic compound $Mg_{17}$Al$_{12}$ using x-ray diffraction method, energy dispersive x-ray spectroscopy (EDX) and electron probe micro analysis (EPMA). The formation of intermetallic compound $Mg_{17}$Al$_{12}$ during FSW causes the remarkable increase in hardness value in the stir zone.one.

• Corrosion Science and Technology
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• v.7 no.4
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• pp.212-218
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• 2008

Inorganic ion exchange compounds (IECs) including hydrotalcites and bentonite clays are a well known classes of layered mixed metal hydroxides or silicates that demonstrate ion exchange properties. These compounds have a range of applications from water purification to catalyst supports. The use of synthetic versions of these compounds as environmentally friendly additives to paints for storage and release of inhibitors is a new and emerging application. In this paper, the general concept of storage and release of inhibiting ions from IEC-based particulate pigments added to organic coatings is presented. The unique aspects of the IEC structure and the ion exchange phenomenon that form the basis of the storage and release characteristic are illustrated in two examples comprising an anion exchanging hydrotalcite compound and a cation exchanging bentonite compound. Examples of the levels of corrosion protection imparted by use of these types of pigments in organic coatings applied to aluminum alloy substrates is shown. How corrosion inhibition translates to corrosion protection during accelerated exposure testing by organic coatings containing these compounds is also presented.