• 한국분말재료학회지
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• 제8권3호
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• pp.179-185
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• 2001

Through the observation of wear scar of two ceramic materials, microstructural wear mechanisms was investigated. As for the $Al_2O_3$-5 vol% SiC nanocomposite, the grain boundary fracture was suppressed by the presence of SiC nano-particles. The intragranular SiC particles have inhibited the extension of plastic deformation through the whole grain. Part of plastic deformation was accommodated around SiC particles, which made a cavity at the interface between SiC and matrix alumina. On the other hand, gas-pressure sintered silicon nitride showed extensive grain boundary fracture due to the thermal fatigue. The lamination of wear scar was initiated by the dissolution of grain boundary phase. These two extreme cases showed the importance of microstructures in wear behavior.

• 한국대기환경학회지
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• 제19권2호
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• pp.157-165
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• 2003

A combined process of non-thermal plasma and catalytic technique has been investigated to treat $CH_3$CN gas in the atmosphere. A planar type dielectric barrier discharge (DBD) reactor has been used to generate the non-thermal plasma that produces various chemically active species, such as O, N, OH, $O_3$, ion, electrons, etc. Several different types of the beads. which are Molecular Sieve (MS) 5A, MS 13X, Pt/alumina beads, are packed into the DBD reactor, and have been tested to characterize the effects of adsorption and catalytic process on treating the $CH_3$CN gas in the DBD reactor. The test results showed that the operating power consumption and the amounts of the by-products of the non-thermal plasma process can be reduced by the assistance of the adsorption and catalytic process.

• 반도체디스플레이기술학회지
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• 제3권4호
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• pp.33-37
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• 2004

As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

• 한국주조공학회지
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• 제20권4호
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• pp.247-253
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• 2000

Titanium was melted in the CaO-coated alumina crucible and the reaction between the melt and the coating layer was negligible. The volume fraction of the gas porosity was decreased with increasing pressure and the sound bar castings with no porosity was obtained under the Ar atmosphere of the pressure of $300kN/mm^2$. The surface of the casting obtained from CaO-coated graphite mold was slightly rougher than that from graphite without coating. The reaction product of titanium melt with the layer of CaO was mainly titanium oxide and that with graphite crucible was titanium cabide with small amount of titanium nitride.

• Transactions on Electrical and Electronic Materials
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• 제5권6호
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• pp.233-236
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• 2004

Copper metallization has been used in high-speed logic ULSI devices instead of the conventional aluminum alloy metallization. One of the key issues in copper CMP is the development of slurries that can provide high removal rates. In this study, the effects of slurry chemicals and pH for slurry dispersion stability on Cu CMP process characteristics have been performed. The experiments of copper slurries containing each different alumina and colloidal silica particles were evaluated for their selectivity of copper to TaN and $SiO_{2}$ films. Furthermore, the stability of copper slurries and pH are important parameters in many industries due to problems that can arise as a result of particle settling. So, it was also observed about several variables with various pH.

• 반도체디스플레이기술학회지
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• 제10권3호
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• pp.35-42
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• 2011

This paper describes the characteristics of high speed grinding and the influence of wheel surface speed V and a grindability of the grinding materials. The various fine ceramics pieces was ground by metal and vitrified bonded diamond wheel. The surface roughness of fine ceramics(Zirconia($ZrO_2$), Silicon Carbide(SiC), Silicon Nitride($Si_3N_4$), Alumina($Al_2O_3$)) decreases from $0.05{\mu}m(R_{max})$ to $0.025{\mu}m(R_{max})$ when the wheel speed at grinding point increases the wheel speed. Relation between the temperature at grinding point and surface roughness was linear. Abrasive jet machining(AJM), a specialized from of shot blasting, is considered one of the most helpful micro machining methods for hard and brittle materials such as glasses and ceramics by constant pressure grinding.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.274-278
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• 2002

The purpose of this study was to characterize the reaction of Cu surface with Cu slurry and CMP performance as a function of additives in CMP slurry. The polish rate of Cu was dependent on the kind of organic acids added in slurry. It was considered that polish rate of Cu was dependent on the concentration of carboxylates and mean particle size. When the etchant and oxidant were added in slurry, the highest removal rate and lower etch rate were measured at neutral pH. The addition of etchant, oxidant and pH adjustor played key roles of CMP ability in slurry. As the pH increased, polish rate of Cu was increased by the enhanced the mechanical effects due to effective dispersion of slurry particles. Alumina abrasives was more desirable for 1st step slurry because of high removal rate of Cu and high selectivity ratio among TaN and Cu.

• 한국막학회:학술대회논문집
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• 한국막학회 2003년도 The 4th Korea-Italy Workshop
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• pp.21-24
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• 2003

Methane steam reforming (MSR) was studied in a membrane reactor (MR) with a Pd-based and a porous alumina membranes. MRs showed methane conversion higher than that foresaw by the thermodynamic equilibrium for a traditional reactor (TR). Silica membranes prepared at KRICT were characterized with permeation tests on single gases ($N_2$, $H_2$ and $CH_4$). These silica membranes can be also used for high temperature applications such as $H_2$ separation $CO_2$ hydrogenation for methanol production is another reaction where $H_2O$ selective removal can be performed with these silica membranes.

• Korean Membrane Journal
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• 제11권1호
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• pp.15-20
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• 2009

The periodic water-back-flushing using permeate water was performed to minimize membrane fouling and to enhance permeate flux in tubular ceramic ultrafiltration (UF) system for Gongji stream water treatment in Chuncheon city. The filtration time (FT), which was the water-back-flushing period, 2 min with periodic 15 sec water-back-flushing showed the highest value of dimensionless permeate flux ($J/J_o$), and the lowest value of resistance of membrane fouling ($R_f$), and we acquired the highest total permeate volume ($V_T$) of 6.35 L. Consequently FT 2 min at back-flushing time (BT) 15 sec could be the optimal condition in advanced UF water treatment of Gongji stream. Then the average rejection rates of pollutants by our tubular ceramic UF system were 99.4% for Turbidity, 31.8% for $COD_{Mn}$, 22.6% for $NH_3$-N and 65.9% for T-P.

• Bulletin of the Korean Chemical Society
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• 제10권3호
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• pp.292-297
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• 1989

In this work we have experimentally observed the physisorption isotherms for nitrogen, TMS, cyclohexane, benzene, and n-hexane adsorbed on flat aluminum foil surface and have analyzed them theoretically on the basis of the theory proposed by Chang et al. The results show that the theory by Chang et al. can provide a useful means to describe the physisorption of gases on uniform flat solid surface which is essentially important for analysis of the pore volume distribution in porous solid surface. We have also discussed the application of the results obtained in this work to the analysis of pore volume distribution in porous alumina we reported previously.