• 한국세라믹학회지
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• 제36권10호
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• pp.1040-1047
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• 1999

After alumina sol was prepared by Yoldas process supported membranes were fabricated by adding ce and Re solution and SiO2 sol into alumina sol. The particle size of alumina sol was 11 nm and it was monodispersed transparent and stable for long time. The pore size of un-doped membrane started to increase to about 7,5nm at 1000$^{\circ}C$ and it was grown to twice (about 15nm) at 1100$^{\circ}C$ However the pore size of doped alumina was uniform to 1100$^{\circ}C$. The effect of retardation of grain growth was superior in SiO2 addition to that of Ce and Ru Because SiO2 doped samples transformed to needed-like phase and densified at 1200$^{\circ}C$ their application in membranes was limited. Ce and Ru doped sample showed vermicular structure identical to the un-doped ones at 1200$^{\circ}C$ But the particle size was smaller than that of un-doped ones.

• 한국세라믹학회지
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• 제29권1호
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• pp.23-28
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• 1992

Alumina ceramics was reinforced by in-situ formation of La-${\beta}$-aluminate in ${\alpha}$-alumina matrix. The powder mixture of which composition is (100-12x)Al2O3+x(La2O3+11Al2O3) was prepared for the formation of La-${\beta}$-aluminate in ${\alpha}$-alumina matrix. The amount of La-${\beta}$-aluminate in the matrix was controlled by varing x which is number of moles. The dense composite was produced by sintering at 1600$^{\circ}C$ in air or hot-pressing at 1550$^{\circ}C$ under 30 MPa. Bending strength and fracture toughness were increased, resulting from the grain growth inhibition and the crack deflection and crack bridging mechanism when La-${\beta}$-aluminate was produced in ${\alpha}$-alumina matrix.

• 한국세라믹학회지
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• 제52권6호
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• pp.403-409
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• 2015

Porous alumina ceramics are involved in many industrial applications due to the exceptional properties of these products. This study addresses the preparation of porous alumina ceramics using hollow microspheres as a pore-forming agent and slip casting as a green-body-forming technique. A uniform distribution of pores is a basic requirement of a porous material. This study investigates three different slurry systems, i.e., as-prepared alumina slurry, alumina slurry electrostatically dispersed by hydrochloric acid (HCl), and slurry dispersed by the commercial dispersant 'Darvan C-N'. At a low viscosity, the hollow microspheres in the slurry tend to float, which causes a non-uniform pore distribution. To avoid this phenomenon, the viscosity of the slurry was increased to the extent that the movement of hollow microspheres ceased in the slurry. As a result, a uniform pore distribution was achieved.

• 한국세라믹학회지
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• 제34권11호
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• pp.1173-1181
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• 1997

Effects of particle size distribution of alumina ceramics on behaviors of tape casting were investigated with emphases on the rheological characteristic of slurry, green density, green sheet strength, and sintering density. For the control of particle size distribution of alumina, the commercial grade low soda alumina, which had different mean particle size of 3.58 ${\mu}{\textrm}{m}$ and 0.42 ${\mu}{\textrm}{m}$, were chosen and blended together. As results, the mixing of 80 wt% fine powder and 20 wt% coarse powder(designated to FC20) led to the increase of packing density and strength of green sheet, and made it easy to handle during processing without lowering of sintering density. Besides, the pseudoplastic behavior of slurry decreased with increase of the fraction of coarse alumina powder.

• 한국세라믹학회지
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• 제29권3호
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• pp.167-176
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• 1992

Zirconia-toughnened alumina(ZTA) powders that were uniformly coated with zirconia and yttria on the surface of alumina particles were prepared in order to inhibit the grain growth of alumina. Alumina particles were ultrasonically dispersed in the ethanol solution of Zr-n-propoxide, and then the Zr-alkoxide was hydrolyzed. Hydrated zironia as thin film was stabilized to tetragonal crystalline form by doping yttria as a stabilizer. The prepared ZTA powders had the good sinterability even at the lower temperature. As a result, the sintered bodies showed the enhanced fracture toughness compared with pure alumina. The relative density and fracture toughness(KIC) of the ZTA bodies sintered at 1550$^{\circ}C$ were 98% and 5 MPa$.$m1/2 respectively.

• 한국표면공학회지
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• 제43권5호
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• pp.248-254
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• 2010

Porous $Al_2O_3$ film can be utilized as template for fabrication of nano-structured materials. Porous anodic alumina layer as template was prepared by anodization of aluminum in oxalic acid, and the pore diameter and barrier-type alumina layer can be controlled for proper anodizing parameter by widening process in $H_3PO_4$ solution. The $SiO_2$ nanodot and Ni nanowire was fabricated using anodic alumina template and their characteristics were investigated using SEM and TEM with EDS. Especially the growth mechanism of $SiO_2$ nanodot in alumina membrane compared with thinning of the alumina barrier layer during anodization was also investigated.

• 한국대기환경학회지
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• 제16권2호
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• pp.199-208
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• 2000

In this study we investigated on the possibility of platinum and silver catalysts as de-NOx catalyst for activity test of supported metal oxide catalysts. the study was performed with the change of amount of metal and support types. The catalyst was prepared the activity of alumina supported silver catalyst produced by dry and wet impregnation method respectively and the resistance of sulfur for optimum supported silver catalyst,. As a result the activity of alumina supported platinum catalyst was showed at low temperature region but the case of silver catalyst activated at high temperature region. So we finally chose alumina supported silver catalyst as de-NOx target catalyst because alumina supported catalyst showed higher activity than alumina supported platinum catalyst.

• 한국세라믹학회지
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• 제36권11호
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• pp.1243-1251
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• 1999

Densification behavior and microstructural evolution during the liquid-phase sintering of alumina-anorhite system were investigated as a function of MgO addition. When MgO component was added in either alumina or anorthite glass powder the aspect ratio of alumina grains decreased and concurrently the are of flat interface which was formed as a result of contact solid alumina gains rather increased. Consequently addition of MgO component in the Al2O3-amorthite system brought about suppression of the rearrangement of solid grains during the liquid phase sintering and then densification of specimens was also retarded.

• 한국세라믹학회지
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• 제34권6호
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• pp.601-610
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• 1997

In cofiring of multilayered alumina with tungsten, the change of camber with lamination condition was experimented and the effect of sintering shrinkage of alumina and tungsten was investigated. From the exact measurement of sintering shrinkage of tungsten thick film, as lamination pressure increased, the sintering shrinkage of alumina decreased but that of tungsten thick film was not changed. So it was though that the main factor which induced the sintering shrinkage difference between ceramics and metal with lamination condition was the change of sintering shrinkage of ceramics. In case of high lamination pressure, high green sheet density, the cofired specimen showed low camber due to low shrinkage difference between alumina and tungsten and there was a linear relation between camber and shrinkage difference. It was found that this shrinkage difference could change the thickness of tungsten film and the microstructure within via hole during cofiring.

• Journal of Welding and Joining
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• 제16권2호
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• pp.122-128
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• 1998

This investigation was performed to collect fundamental informations concerning the behavior of glass solders on ceramic joining process. The wettability of glasses on two types of alumina was evaluated by sessile drop method. SiO$_2$-CaO-Al$_2$O$_3$system glasses were selected as solder glasses, and alumina that have different purities were used for substrate materials. It is indicated that contact angles of glasses on 99% purity of alumina substrate do not change as increasing time at elevated temperature, however the contact angles on the 92% purity of alumina substrate exhibit the strong time dependency. The time-dependent property on 92% alumina was due to the interlayer reactions occurred between the glass solder and impurities on the substrate.