• Journal of Surface Science and Engineering
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• v.32 no.3
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• pp.265-275
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• 1999

Titanium nitride and related overlayers produced by arc ion plating (AIP) are applied as commercial coatings in world-wide scale since the middle of 80s. Due to the achievements of low temperature deposition (LTD), they begin now to be used as wear and corrosion-resistant coatings for machine parts, besides applications on cemented carbide and high speed steel cutting tools. On the other side, TiN can be now applied successfully to brass, Al-alloy, ZnAl alloy articles as decorative coating through LTD. Various nitrides, carbonitrides, borides and other refractory compounds, such as (Ti, Al)N, TiCN, CrN, are used as the coatings for special heavy-duty working conditions instead of TiN since 90s. More and more multilayer coatings are applied now substituting single layer ones. Duplex processes are under development.

• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.363-367
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• 2012

DLC (diamond liked carbon) coating of the tungsten carbide (WC) alloy core surface for molding a glass aspheric lens improves the quality of glass lens and the molding core and is characterized by high hardness, high elasticity, abrasion resistance and chemical stability. In this study, the effect of DLC coating of a thin film by means of the filtered AIP (arc ion plating) technique was examined on Ra and shape of the coated surface. Roughness before and after DLC coating was measured and the result showed that the roughness was improved after coating as compared to before coating. It was observed that DLC coating of the WC alloy core surface for molding had an effect on improving the roughness and shape of the core surface. It is considered that this will have an effect on improving abrasion resistance and the service life of the core surface.

• Journal of Surface Science and Engineering
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• v.24 no.2
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• pp.88-95
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• 1991

The tin-lead alloy was electrodeposited in the low range of peak current density in order to investigate the change of composition and microstructure of them. The Pb content of alloy deposits, which was decreased with increasing average current density, was relatively lower than that of D.C. plated alloy deposit. The preferred orientation of alloy deposit was changed with increasing peak current density and the surface morphology of alloy deposits was closely related to the preferred orientation of them.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.567-572
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• 2001

In order to investigate the fracture behaviors(penetration modes) and resistance to penetration during ballistic impact of Titanium alloy laminates and nitrified Titanium alloy laminates which were treated by PVD(Physical Vapor Deposition) method, ballistic tests were conducted. Evaporation, sputtering, and ion plating are three kinds of PVD method. In this research, Ion plating was used to achieve higher surface hardness and surface hardness test were conducted using a Micro vicker's hardness tester. Resistance to penetration is determined by the protection ballistic limit($V_{50}$), a statistical velocity with 50% probability for complete penetration. Fracture behaviors and ballistic tolerance, described by penetration modes, are respectfully observed at and above ballistic limit velocities, as a result of $V_{50}$ test and Projectile Through Plates (PTP) test methods. PTP tests were conducted with $0^{\circ}$ obliquity at room temperature using 5.56mm ball projectile. $V_{50}$ test with $0^{\circ}$ obliquity at room temperature were conducted with projectiles that were able to achieve near or complete penetration during PTP tests. Surface hardness, resistance to penetration, and penetration modes of Titanium alloy laminates are compared to those of nitrified Titanium alloy laminates.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.97-97
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• 2017

This study investigated the corrosion protection by electrodeposited copper layer on AZ31 Mg alloy with and without additional silver layer by immersion test, salt spray test, OCP transient and potentiodynamic polarization experiment. The single electrodeposited Cu layer on AZ31 Mg alloy showed a nodular structure with many imperfections of crevices between the nodules, which resulted in the fast initiation of pitting corrosion within first few hours of immersion. Double-layer coating of Cu and outer Ag layer slightly increased the initiation time for pitting corrosion. Triple-layer coatings of Cu/Ag/Cu exhibited the most efficient corrosion protection of AZ31 Mg alloy, compared to the single- and double-layer coatings. Surface morphology of the outer Cu layer in the triple-layer was changed from the nodular structure to fine particle structure with no crevices due to the presence of an additional Ag layer. Thus, the improved corrosion resistance of AZ31 Mg alloy by electrodeposited Cu/Ag or Cu/Ag/Cu layers is readily ascribed to the decreased number of imperfections in the electrodeposited layers due to the additional silver layer. It is concluded that the additional silver layer provides many nucleation sites for the second Cu plating, resulting in the formation of finer and denser structure than the first Cu electrodeposit.

• Korean Chemical Engineering Research
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• v.45 no.6
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• pp.633-637
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• 2007

Electroless plating of Co-alloy thin films as capping layers for Cu interconnection has been investigated using alkali-free precursors such as $(NH_4)_2Co(SO_4)_2{\cdot}6H_2O$, $(NH_4)_2WO_4$, $(NH_4)H_2PO_4$, etc. The characteristics of the Co-alloy thin films were discussed by analyses of the effects of pH, Co-precursor concentration, and deposition temperature on the thickness and surface morphology of the films. The thickness of the Co-alloy thin films increased with increasing pH, Co-precursor concentration, and deposition temperature, similarly to the results of electroless plating of Co-alloy thin films using alkali-containing chemicals. The SEM images of the surface of the Co-alloy thin films showed that the proper ranges of pH and deposition temperature were 8.5~9.5 and $75{\sim}85^{\circ}C$, respectively. This work found a feasibility that Co-alloy thin films as capping layers for Cu interconnection could be electroless plated using alkali-free chemicals.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.71-76
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• 2008

The mechanical properties of Ni-Fe alloy were varied with the current type, current density and bath conditions such as concentrations and temperature. The effect of electroplating parameters on the surface hardness, mechanical strength, residual stress and wear properties were investigated. The mechanical properties of electrodeposits with PC plating is superior to those with DC plating. Ni-Fe electrodeposits with PC has approximately 50% lower residual stress than that of DC plating. The tensile strength of PC electroplated specimen was 15% higher than that of DC electroplated specimen. The wear resistance of PC specimen was 30% improved relative to that of DC specimen.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.04a
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• pp.89-89
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• 2006

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.2-2
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• 2007

• Journal of Surface Science and Engineering
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• v.50 no.3
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• pp.155-163
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• 2017

In this study, the effects of the concentration of metal ions and the applied current density in the Sn-Ag plating solutions were examined in regards to the resulting composition and morphology of the solder bumps' surface. Furthermore the effect of any impurities present in the methanesulfonic acid used as a base acid in the Sn-Ag solder plating solution on the stability of plating solution as well as the characteristics of the Sn-Ag alloys films was also explored. As expected, the uniform bump was obtained by means of removing impurities in the plating solution. Consequently the resultant solder bump was obtained in an optimal current density of the range of $1A/dm^2$ to $15A/dm^2$, which has acceptable bump shape and surface roughness with 12inch wafer trial results.