• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.9
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• pp.855-862
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• 2005

An experimental investigation has been carried out for aluminum foam heat sink inserted into the annulus to examine the feasibility as a heat sink for high performance forced water cooling in the annulus. The local wall temperature distribution, inlet and outlet pressures and temperatures, and heat transfer coefficients were measured for heat flux of 13.6, 18.9, 25.1, 31.4 $kw/m^2$ and Reynolds number ranged from 120 to 2000. Experimental results show that the friction factor is higher than clear annulus without aluminum foam, while the significant augmentation in Nu is obtained. This technique can be used for the compactness of the heat exchanger.

• Journal of Power Electronics
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• v.16 no.4
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• pp.1598-1611
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• 2016

In some special occasions with strict size requirements, such as mine hoists, improving the design accuracy of the forced-air cooling systems of NPC three-level inverters is a key technology for improving the power density and decreasing the volume. First, a fast power-loss calculation method was brought. Its calculation principle introduced in detail, and the computation formulas were deduced. Secondly, the average and dynamic power losses of a 1MW mine hoist acting as the research target were analyzed, and a forced-air cooling system model based on a series of theoretical analyses was designed with the average power loss as a heat source. The simulation analyses proves the accuracy and effectiveness of this cooling system during the unit lifting period. Finally, according to an analysis of the periodic working condition, the maximum power-loss range of a NPC three-level inverter under multi cycle operation was obtained and its dynamic power loss was taken into the optimized cooling system model as a heat source to solve the power device damage caused by instantaneous heat accumulation. The effectiveness and feasibility of the optimization design based on the dynamic power loss calculation of the maximum power-loss range was proved by simulation and experimental results.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.3
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• pp.214-220
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• 2002

A small air conditioner using thermoelectric module has been designed and built. Three types of cooling methods, such as air cooling, closed-loop water cooling, and evaporative cooling, for hot side of thermoelectric module have been investigated. Among three types of cooling method, the evaporative cooling method is seen to be the most effective to achieve the steady state operation of a thermoelectric air conditioner The system performance with evaporative cooling method are also studied in detail for several oprating parameters, such as input power to the thermoelectric module, water or air flow rate at the hot side, and air flow rate at the cold side. The results obtained indicate that the cooling capacity of a system is increased with an increase in the input power to the thermoelectric module while the system COP is decreased. It is also found that the optimal air flow rate as well as water flow rate at the hot side is needed for the best system performance at a liven operating condition. Both the system COP and cooling capacity are increased as the air flow rate at cold side is increased.

• The Transactions of the Korean Institute of Power Electronics
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• v.6 no.6
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• pp.572-581
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• 2001

A heat pipe heat sink device which is to evacuate maximum heat of about 1800W from a powersemiconductor was designed and manufactured One set of cooling device os composed of an Aluminum block (130${\times}$160${\times}$35mm) 4 PFC heat pipes $(d_0 22.23mm)$ and 126 Aluminium fins (250${\times}$58${\times}$0.8mm) Experimental data obtained at a power of 1~2kW revealed that the total thermal resistance of the device varied 0.02~0.018$^{\circ}C$/W along with increasing air velocity from 2m/s to 3 m/s. The result represented a good satisfaction of requirement condition to maintain temperature rise of semiconductor lowe that $40^{\circ}C$ at 1800W and air velocity of 3 m/s Some important resistance such as convective resistances at both fins and heat pipes showed good agreement between mathematical predictions and measurement data.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.26 no.5
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• pp.224-230
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• 2014

The purpose of this paper is to investigate the performance of supplemental cooling and heating system equipped with the 1 kW thermoelectric module. The system consist of 96 thermoelectric modules, heat sink with louver fin and water cooling jacket which is attached on the hot side of the thermoelectric module. The cooling and heating performance test of the thermoelectric system is conducted with various conditions, such as intake voltage, air inlet temperature, air flow volume, water inlet temperature and water flow rate at calorimeter chamber in consideration of environmental conditions in realistic vehicle drive. The experimental results of a thermoelectric system shows that the cooling capacity and COP is 1.03 kW, and 1.0, and heating capacity and COP is 1.53 kW, and 1.5 respectively.

• Advances in Computational Design
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• v.6 no.1
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• pp.31-42
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• 2021

This research aims to demonstrate the optimal geometrical design of splayed multiple cross-sectional pin fin heat sinks (SMCSPFHS), which are a type of side-inlet-side-outlet heat sink (SISOHS). The optimiser strength Pareto evolutionary algorithm2 (SPEA2)is employed to explore a set of Pareto optimalsolutions. Objective functions are the fan pumping power and junction temperature. Function evaluations can be accomplished using computational fluid dynamics(CFD) analysis. Design variablesinclude pin cross-sectional areas, the number of fins, fin pitch, thickness of heatsink base, inlet air speed, fin heights, and fin orientations with respect to the base. Design constraints are defined in such a way as to make a heat sink usable and easy to manufacture. The optimum results obtained from SPEA2 are compared with the straight pin fin design results obtained from hybrid population-based incremental learning and differential evolution (PBIL-DE), SPEA2, and an unrestricted population size evolutionary multiobjective optimisation algorithm (UPSEMOA). The results indicate that the splayed pin-fin design using SPEA2 issuperiorto those reported in the literature.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.3
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• pp.227-234
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• 2000

An experimental study was performed for understanding the limiting power and heat transfer characteristics of an MHP having the diameter of 3 or 4 mm which could be applied to cooling of miniature electronic equipment such as the notebook PC CPU etc. The experimental parameters which are inclination, structure of the wick, the length of the condenser and the total heat pipe were considered. The MHP with a woven-wired wick has the advantages of the improvement in capillary limit, the effective attachment tightly toward wall and the convenience in construction of wick. Cooling performance of the present MHP was compared with that of MHP with grooved, fine fiber and sintered type wick which were applied by existing enterprises. With respect to the inclination of$ -5^{\circ}$ , an MHP having the diameter of 3 or 4 mm shows the limiting power of 6~14 W. Therefore, it is expected that the MHP of the present study has sufficient applicability of cooling of notebook PC of which the amount of heat generated is about 12 W.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.1
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• pp.73-80
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• 2006

Present study is concerned with an experimental study on the cooling characteristics of heat-generating components arranged in channels which are made by printed circuit boards. To assess the thermal performance of the heat-generating components arranged by $5\times11$ in flow channel, three variables are used: the velocity of the fluid at the entrance, the height of channel, and row number of the component. The cooling characteristics of the heat-generating components such as the surface temperature rise, the adiabatic temperature rise, the adiabatic heat transfer coefficient, and the effect of thermal wake are compared with the result of the experiment and the numerical analysis. Based on the experiment analysis, some conclusions can be drawn: First of all, the experiment and numerical analysis are identical comparatively; the heat transfer coefficient increases as H/B decreases. Howeve., when H/B is over 7.2, the effect of H/B is rather trivial. The effect is the biggest at the first component from the entrance, and it decreases until the fully developed flow, where it becomes very consistent. The thermal wake function calculated for each row decreases as H/B increases.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.6
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• pp.509-517
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• 2006

Present study is concerned with an experimental study on the cooling characteristics of heat-generating components arranged in channels which are made by printed circuit boards. To estimate the thermal performance of the heat-generating components arranged by $5\times11$ in channel flow, three variables are used: the inlet velocity, the height of channel, and row number of the component. The cooling characteristics of the heat-generating components such as the surface temperature rise, the adiabatic temperature rise, the adiabatic heat transfer coefficient, and the effect of thermal wake are compared with the result of the experiment and the numerical analysis. The experimental result is in a good agreement with the numerical analysis. The heat transfer coefficient increases as the Reynolds number increases, while the thermal wake function calculated for each row decreases as the Reynolds number increases. In addition, it is found that Nu-Re correlation equation is Identical to the previous studies, and the empirical correlation equation between the thermal wake function and Re is presented.

• Journal of Advanced Marine Engineering and Technology
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• v.34 no.8
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• pp.1100-1106
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• 2010

LED(Light Emitting Diode) has the defects of low efficiency and reducement of life cycle as its temperature increases. This research is about an efficient temperature control of the LED. For LED temperature control, it is shown that a heat sink, fan, a one-chip microprocessor and the PID control algorithm are a good cooling system through experiments. Finally. by using the fan as a cooling device and controlling it appropriately, it is proved that the intensity of illumination and the desired temperature can be achieved with consumption of only 2% of the driving power of the LED system through control experiments.