• The Korean Journal of Pesticide Science
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• v.16 no.4
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• pp.336-342
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• 2012

This study was carried out in order to compare the residue levels of pesticides among lettuce, kale and perilla leaf depending on the morphological characteristics of plant. Residue levels were investigated at the zero, second, fifth days after last application, 9 species of systemic or non-systemic pesticide were twice applied with 7 days interval by knapsack power sprayer with 2 heads fan shape nozzle. Ratios of leaf area to weight ($cm^2$ $g^{-1}$) were 58 of perilla leaf, 27 of lettuce and 23 of kale. Ratios of leaf area to weight of perilla leaf was 2.1 times higher than that of lettuce. Residue levels of perilla leaf were 1.3 to 2.3 times higher than those of lettuce at the day of spraying and 1.3 to 3.3 times higher at the fifth day. Therefore the differences of pesticide residues between perilla leaf and lettuce were affected by the ratio of leaf area to weight. Residue levels in lettuce were 2.4 to 7.3 times higher than those in kale at the day of spraying because the adhesive effect of pesticide particles on kale leaf was low.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.77-77
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• 1998

Present silicon dioxide (SiOz) 떠m as intennetal dielectridIMD) layers will result in high parasitic c capacitance and crosstalk interference in 비gh density devices. Low dielectric materials such as f f1uorina뼈 silicon oxide(SiOF) and f1uoropolymer IMD layers have been tried to s이ve this problem. I In the SiOF ftlm, as fluorine concentration increases the dielectric constant of t뼈 film decreases but i it becomes unstable and wa않r absorptivity increases. The dielectric constant above 3.0 is obtain어 i in these ftlms. Fluoropolymers such as polyte$\sigma$따luoroethylene(PTFE) are known as low dielectric c constant (>2.0) materials. However, their $\alpha$)Or thermal stability and low adhesive fa$\pi$e have h hindered 야1리ru뚱 as IMD ma따"ials. 1 The concept of a plasma processing a찌Jaratus with 비gh density plasma at low pressure has r received much attention for deposition because films made in these plasma reactors have many a advantages such as go여 film quality and gap filling profile. High ion flux with low ion energy in m the high density plasma make the low contamination and go어 $\sigma$'Oss피lked ftlm. Especially the h helicon plasma reactor have attractive features for ftlm deposition 야~au똥 of i앙 high density plasma p production compared with other conventional type plasma soun:es. I In this pa야Jr, we present the results on the low dielectric constant fluorocarbonated-SiOF film d밑JOsited on p-Si(loo) 5 inch silicon substrates with 00% of 0dFTES gas mixture and 20% of Ar g gas in a helicon plasma reactor. High density 띠asma is generated in the conventional helicon p plasma soun:e with Nagoya type ill antenna, 5-15 MHz and 1 kW RF power, 700 Gauss of m magnetic field, and 1.5 mTorr of pressure. The electron density and temperature of the 0dFTES d discharge are measUI벼 by Langmuir probe. The relative density of radicals are measured by optic허 e emission spe따'Oscopy(OES). Chemical bonding structure 3I피 atomic concentration 따'C characterized u using fourier transform infrared(FTIR) s야3띠"Oscopy and X -ray photonelectron spl:’따'Oscopy (XPS). D Dielectric constant is measured using a metal insulator semiconductor (MIS;AVO.4 $\mu$ m thick f fIlmlp-SD s$\sigma$ucture. A chemical stoichiome$\sigma$y of 야Ie fluorocarbina$textsc{k}$영-SiOF film 따~si야영 at room temperature, which t the flow rate of Oz and FTES gas is Isccm and 6sccm, res야~tvely, is form려 야Ie SiouFo.36Co.14. A d dielec$\sigma$ic constant of this fIlm is 2.8, but the s$\alpha$'!Cimen at annealed 5OOt: is obtain려 3.24, and the s stepcoverage in the 0.4 $\mu$ m and 0.5 $\mu$ m pattern 킹'C above 92% and 91% without void, res야~tively. res야~tively.

• Journal of the Korean institute of surface engineering
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• v.49 no.2
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• pp.166-171
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• 2016

Cathodic protection is widely recognized as the most cost effective and technically appropriate corrosion prevention methodology for the port, offshore structures, ships. When applying the cathodic protection method to metal facilities in seawater, on the surface of the metal facilities a compound of calcium carbonate($CaCO_3$) or magnesium hydroxide($Mg(OH)_2$) films are formed by $Ca^{2+}$ and $Mg^{2+}$ ions among the many ionic components dissolving in the seawater. And calcareous deposit films such as $CaCO_3$ and $Mg(OH)_2$ etc. are formed by the surface of the steel product. These calcareous deposit film functions as a barrier against the corrosive environment, leading to a decrease in current demand. On the other hand, the general calcareous deposit film is a compound like ceramics. Therefore, there may be some problems such as weaker adhesive power and the longer time of film formation uniting with the base metal. In this study, we tried to determine and control the optimal condition through applying the principle of cathodic current process to form calcareous deposit film of uniform and compact on steel plate. The quantity of precipitates was analyzed, and both the morphology, component and crystal structure were analyzed as well through SEM, EDS and XRD. And based on the previous analysis, it was elucidated mechanism of calcareous deposit film formed in the sacrificial anode type (Al, Zn) and current density (1, 3, $5A/m^2$) conditions. In addition, the taping test was performed to evaluate the adhesion.

• Journal of the Korean Solar Energy Society
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• v.39 no.4
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• pp.1-9
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• 2019

Modules using 6 inch cells have problems with loss due to empty space between cells. To solve this problem made by shingled structure which can generate more power by utilizing empty space by increasing the voltage level than modules made in 6inch cell. Thus, in this paper, the c-Si cutting cells were produced using nanosecond green laser, and then the ECA was sprayed and cured to perform cutting cell bonding. Three types of ECA materials (B1, B2, B3) with Ag as the main component were used, and experimental conditions varied from 5 to 120 seconds of curing time, 130 to $210^{\circ}C$ of curing temperature, and 1 to 3 of curing numbers. As a results of experiments varying curing time, B1 showed efficiency 19.88% in condition of 60 seconds, B2 showed efficiency 20.15% in 90 seconds, and B3 showed efficiency 20.27% in 60 seconds. In addition, experiments with varying curing temperature, It was confirmed highest efficiency that 20.04% in condition of $170^{\circ}C$ with B1, 20.15% in condition of $150^{\circ}C$ with B2, 20.27% in condition of $150^{\circ}C$ with B3. These are because the Ag particles are densely formed on the surface to make the conduction path. After optimizing the conditions of temperature and curing time, the secondary-tertiary curing experiments were carried out. as the structural analysis, conditions of secondary-tertiary curing showed cracks that due to damp heat aging. As a result, it was found that the ECA B3 had the highest efficiency of 20.27% in condition of 60 seconds of curing time, $150^{\circ}C$ of curing temperature, and single number of curing, and that it was suitable for the manufacture of Solar cell of shingled structure rather than ECA B1 and B2 materials.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.89-94
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• 2021

The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.

• Journal of the Korean Wood Science and Technology
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• v.14 no.1
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• pp.3-44
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• 1986

In order to obtain the basic physical and mechanical properties of steel wire reinforced particleboard, particleboards were formed with large particles through 2.11 mm (12 meshes) and retained on 1.27mm (20 meshes) sieves and small particles through 1.27mm (20 meshes) and retained on 0.42mm (60 meshes) sieves from the plywood mill wastes of meranti (Shorea spp.) in the form of pallmanchips, applying urea-formaldehyde resin as an adhesive on the particle surface in 10 percent on the oven dried weight of particles, and arranging steel wires of 1mm in diameter 5,10,15,20, and 25mm in longitudinal and transverse direction with crossing in the mid of the board depth in single layer boards, 10mm in longitudinal or transverse direction without crossing in two layers and 10mm in longitudinal and transverse directions with and without crossing in three steel wire layers boards. The stepwise 9-minutes-multi-pressing schedule in 5 minutes at 35 kgf/$cm^2$, 2.5 minutes at 25 kgf/$cm^2$. and 1.5 minutes at 15 kgf/$cm^2$ was applied for $300{\times}200{\times}13$mm board at the temperature of 160$^{\circ}C$ in a hot press. Specific gravity, thickness swelling, bending properties of modulus of rupture (MOR), modulus of elasticity(MOE), work to proportional limit, and work to ultimate load, internal bond (IB), and screw holding power(SHP) of the reinforced boards were analyzed on the wire openings and wire layers. The results obtained are summarized as follows; 1) In specific gravity, particleboards with large particles and small particles had higher value with more steel wire placements and more steel layers composition, 2) Particleboards with large particles in accordance with more steel wire liners composition gave very poor thickness swelling. 3) The mechanical properties of particleboards formed with large or small particles were reinforced with more steel wire layers. Therefore, bending strength was improved in modulus of rupture, modulus of elasticity, and work to ultimate load. Especiallv, particleboards with two or three steel wire layers showed the tension lamination effect when the steels in lower steel wire layer were oriented parallel to the board length. 4) The modulus of rupture, modulus of elasticity, and work to ultimate load in bending varied with opening area, distance of lengthwise wires multipled by distance of transverse wires. Particleboards formed with large particles resulted in higher value in modulus of rupture with 1.5-3 $cm^2$ opening area, 1-2cm distance between transverse wires, and 1.5-2.5cm distance between lengthwise wires. Particle boards formed with small particles showed higher value with 0.5-1.5$cm^2$ or 3.75-6.25 $cm^2$ opening area, 0.5 or 2.5cm distance between transverse wires. 5) In modulus of elasticity, particleboards formed with large particles with one steel wire layer suggested higher value with 5-3$cm^2$ opening area, 1-2.5cm distance between transverse wires and also 1-2.5 cm distance between lengthwise wires. Particleboards formed with small particles showed higher value with 0.75-1.25$cm^2$ or 3-6.25$cm^2$ opening area and 0.5 or 2.5cm distance between transverse wires. 6) Particleboards formed with large particles gaved higher value in work to ultimate load with 1-3$cm^2$ opening area. Particleboards formed with small particles showed increasing tendancy with decreasing opening area. 7) In internal bond and screw holding power, particleboards formed with large particles had increasing value in two and three steel wire layers compositions, but particleboards formed with small particles showed no difference. Particleboards formed with large particles containing one steel wire layer showed no difference in internal bond and screw holding power, and particleboards formed with small panicles containing one steel wire layer resulted in increasing value in internal bond and decreasing value in screw holding power in accordance with increase in opening area.

• Science of Emotion and Sensibility
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• v.21 no.2
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• pp.101-112
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• 2018

This study was carried out to enhance the competitiveness of blackbox design for domestic and international companies, based on the explosive growth of the blackbox market due to development of blackbox design for vehicle accident prevention and post-treatment. In the past, the blackbox market has produced products indiscriminately to meet the ever-increasing demand of consumers. Therefore, we thought a new design method was necessary to effectively investigate the needs of rapidly changing consumers. In this study, we aimed to identify the best-selling blackbox to understand the design flow, and the optimum area for a blackbox, considering the uniqueness of associated vehicle. Based on discussion with blackbox design experts, we studied the direction of design and the problems with blackbox use, which were reflected in blackbox development. Through this research, two types of design - leading blackbox (A type) and mass production blackbox (B type) - were proposed for compatibility of the blackbox with the car. The leading type of blackbox was positioned so that it was wrapped with the room mirror hinge before the screw was fastened, in order to achieve an integrated design. Therefore, we designed an integrated form and resolved the placement problem of an adhesive blackbox. To blend, the mass production blackbox implemented material and surface processing in the same way with the car, and adopted the slide structure to automatically turn off the main body power when removing the SDcard, reflecting consumer needs. This study considers evolving consumer needs through a case study and collective intelligence and deals with implementation of the whole design process during mass production. In this study, we aimed to strengthen the competitiveness of the blackbox design based on design method and its realization.

• Elastomers and Composites
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• v.46 no.4
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• pp.277-283
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• 2011

In this study, engineering grade and high intensity reflective sheets were prepared with glass beads and their reflection performance and physical properties were investigated. The reflective sheets prepared by using glass beads are divided into enclosed or encapsulated lens type, depending on whether the glass beads are open in air or not. Because of an extra layer on the glass bead surface, the enclosed lens type reflective sheets show very little change in the properties by bad weather conditions, compared to encapsulated lens type reflective sheets. Optimization of the amount of glass beads on the surface was carried out, which determines the retroreflective properties. Enclosed and encapsulated lens type reflective sheets with various colors were prepared and their coefficients of retroreflection were determined. The encapsulated type reflective sheet with white color shows a coefficient of retroreflection of $210.4cd/1x{\cdot}m^2$, which is higher than the enclosed type ($74cd/1x{\cdot}m^2$). Effect of washing on the reflective property and adhesive power of the reflective sheets was investigated, and it is found that the number of glass beads decreased with washing and the aluminum layer deposited was damaged extensively in the encapsulated lens type reflective sheets.

• Archives of design research
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• v.17 no.4
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• pp.241-250
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• 2004

In this research, the copper alloy plates C2200, C5210, C7701, C8113 were selected to make datum and to identify further usage of metal craft experimentation. For its experimentation, the general welding and TIG welding methods were researched; for 2nd experimentation, the Reticulation and Electroforming skill's differences in color and temperature were researched. With these methods 3 different kinds of works are introduced for sample studies. For this research, Dr. Lee, Dong-Woo who works in Poongsan Metal Co, supported 4 kinds of copper alloy metals. Which are Commercial bronze (Cu-Zn), Deoxidiged Copper(Cu-Sn-P), Nickel Silver (Cu-Ni-Zn), and White Bronze (Cu-Ni); they were applied partly and wholly by the method of Laminatin, Reticulation, Fusing, and Electroforming skills. In case of C2200, the brass, the A. C. TIG welding method is better under 2mm slight plate; the D.C. TIG welding is better upper 2mm plate; and 250~300$^{\circ}C$ is recommended for remain heat treatment. In case of C5210, not having Hydrogen in high temperature return period, doesn't need Oxygen in high temperature and hardening in comparative high temperature neither, it is good for welding. It contains Sn 2-9% ad P 0.03-0.4% generally; and in accordance with the growth rate of Sn contain amount, the harden temperature boundary become broad. In case of cold moment after welding, they are recommended that higher speed TIG welding, smaller melting site and less than 200$^{\circ}C$ for pre-heating temperature. In case of C7701, the 10-20% Ni, 15-30% Zn are widely used.. If it is upper 30% Zn, it become (${\alpha}+{\beta}$) system and adhesive power rate become lower, and the productivity become lower in low temperature but the productivity become higher in high temperature. Nickel Silver's resistance of electricity is well; and the heatproof and incorrodibility is good, too. Lastly, in case of C8113, good at persistence in salty and grind; high in strength of high temperature. In case of white brass, contain 10-30% Nickel and hardened in high temperature and become single phrase. For these reason, the crystallization particles easily become large, if the resistance become higher small amount of Pb, P, S separation rate become higher.