• Elastomers and Composites
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• 제28권4호
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• pp.274-282
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• 1993

Resorcinol-tannin-formaldehyde-latex(RTFL) adhesive was prepared to bond SBR to nylon in reinforced rubber composites. A key factor of adhesive contributes to the adhesion strength between SBR and nylon was the toughness of adhesive itself. Although the stiffness and strength of adhesive film decreased slightly with increasing level of tannin substitution for resorcinol in a standard RFL adhesive, the maximum toughness of adhesive film, which showed yield behavior and high dissipative capacity, was obtain by 60% tannin substitution. However, a marked softening and reduction in toughness occurred at sufficiently high substitution. Also, the adhesive film, which was heat-treated to simulate cure, showed higher strength than the unheated film. Thus, the properties of tannin containing adhesives could be optimized by using 40/60 weight ratio of the resorcinol/tannin in RTFL adhesive composition as well as heat treatment of adhesive film.

• 한국정밀공학회지
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• 제33권3호
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• pp.231-234
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• 2016

Pouch film is manufactured by laminating aluminum foil, polyamide film and polypropylene film with an adhesive or extrusion resin. However, a surface treatment is required for the aluminum because bonding does not occur easily between the aluminum foil and the polymer film. Thus, for this study, surface treatment experiments were performed in order to confirm the effect on adhesion strength. First, a variety of surface treatment solutions were coated on aluminum foil, and contact angle and surface morphology analysis was carried out for the surface-treated aluminum. For lamination of the surface-treated aluminum foil with polyamide film, a polyurethane base adhesive was prepared for the adhesive strength test specimens. The adhesive strength between the aluminum foil and the polyamide film of the resulting specimens was measured (UTM). With such an experiment, it was possible to evaluate the effect on adhesive strength of the various surface treatments.

• 접착 및 계면
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• 제5권2호
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• pp.1-7
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• 2004

A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

• 접착 및 계면
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• 제5권2호
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• pp.31-42
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• 2004

Many animals possess on their legs adhesive pads, which have undergone evolutionary optimization to be able to attach to variable substrates and to control adhesive forces during locomotion. Insect adhesive pads are either relatively smooth or densely covered with specialized adhesive hairs. Theoretical models predict that adhesion can be increased by splitting the contact zone into many microscopic, elastic subunits, which provides a functional explanation for the widespread 'hairy' design. In many hairy and all smooth attachment systems, the adhesive contact is mediated by a thin film of liquid secretion between the cuticle and the substrate. By using interference reflection microscopy (IRM), the thickness and viscosity of the secretion film was estimated in Weaver ants (Oecophylla smaragdina). 'Footprint' droplets deposited on glass are hydrophobic and form low contact angles. IRM of insect pads in contact showed that the adhesive liquid is an emulsion consisting of hydrophilic, volatile droplets dispersed in a persistent, hydrophobic phase. I tested predictions derived from film thickness and viscosity by measuring friction forces of Weaver ants on a smooth substrate. The measured friction forces were much greater than expected assuming a homogenous film between the pad and the surface. The findings indicate that the rubbery pad cuticle directly interacts with the substrate. To achieve intimate contact between the cuticle and the surface, secretion must drain away, which may be facilitated by microfolds on the surface of smooth insect pads. I propose a combined wet adhesion/rubber friction model of insect surface attachment that explains both the presence of a significant static friction component and the velocity-dependence of sliding friction.

• 한국염색가공학회지
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• 제16권3호
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• pp.14-21
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• 2004

In this research, we accomplished in order to improving color fastness of sublimation for Poly (vinyl alcohol) (PVA)-iodine polarized film. The poor iodine sublimation problem has greatly improved by $O_2$ low temperature plasma treatment. We obtained the followings: (1) plasma treatment has contributed in adhesive ability via peel strength, AFM image and roughness were investigated, But the improvement in adhesive strength was not linearly proportional to the treatment time. (2) $O_2$ plasma treated PVA-iodine polarized film was good enough as to maintain the transmittance and polarization even after iodine cone. of 0.05mol/L and dipping time of 50sec. (3) $O_2$ low temperature plasma treated PVA-iodine polarized film has obtain high durability because of good adhesive strength.

• 비파괴검사학회지
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• 제32권4호
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• pp.393-400
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• 2012

최근 나노 박막은 MEMS/NEMS, 광학 코팅, 반도체 산업 등 다양한 분야에서 사용이 되고 있다. 박막은 마모, 침식, 부식, 고온 산화를 방지하기 위한 목적으로 사용될 뿐 아니라 특성화된 자기, 유전적 특성을 만들기 위한 목적으로 사용된다. 많은 연구자들이 이러한 박막 구조의 특성(밀도, 입자 크기, 탄성 특성, 필름/기지 계면의 특성)을 평가하기 위하여 많은 연구를 진행하고 있다. 이들 중에 박막과 기지 사이의 접합 특성을 평가하는 것이 많은 연구자들의 주 관심사가 되어 왔다. 본 연구에서는 나노 박막의 접합 특성을 평가하기 위하여 각기 다른 접합 특성을 가지는 폴리머 박막 시험편을 제작하였다. 제작된 시험편의 접합 특성을 측정하기 위하여 초음파현미경의 V(z) 곡선법을 이용하여 표면파의 속도를 측정하였다. 또한 계면을 포함하는 시험편의 표면을 전파하는 표면파의 속도와 접합력의 상관관계를 확인하기 위해 나노 스크래치 시험을 적용하였다. 그 결과 초음파현미경을 이용하여 측정된 표면파의 속도와 나노스크래치 시험을 이용한 임계하중이 일치하는 경향성을 나타내었다. 결론적으로 초음파현미경의 V(z) 곡선법은 나노 스케일 박막 계면에서의 접합 상태를 평가할 수 있는 기법으로 그 가능성을 나타내었다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2005년도 추계학술발표대회 논문집
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• pp.57-60
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• 2005

Composite-to-aluminum joins were tested to get failure loads and modes for three types of joins; adhesive bonding, bolt fastening, and adhesive-bolt hybrid joining. Film type adhesive FM73 and paste type adhesive Cytec EA9394S were used for aluminum and composite bonding to make a double-lap joint. A digital microscope camcorder was used to monitor the failure initiation and propagation. It was found that the hybrid joining is an effective method to strengthen the joint when the mechanical fastening is stronger than the bonding as in the case of using the paste type adhesive. On the contrary, when the strength of the bolted joint is lower than the strength of the bonded joint as in the joint with the film type adhesive, the bolt joining contribute little to the hybrid joint strength.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1640-1644
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• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.1448-1452
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• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin-film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the tangential forces simultaneously as the probe tip of the equipment approaches to the interface between thin-film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ${\sim}$ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester, the feasibility test was performed to evaluate the adhesive strength of thin-film.