• Elastomers and Composites
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• v.28 no.4
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• pp.274-282
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• 1993

Resorcinol-tannin-formaldehyde-latex(RTFL) adhesive was prepared to bond SBR to nylon in reinforced rubber composites. A key factor of adhesive contributes to the adhesion strength between SBR and nylon was the toughness of adhesive itself. Although the stiffness and strength of adhesive film decreased slightly with increasing level of tannin substitution for resorcinol in a standard RFL adhesive, the maximum toughness of adhesive film, which showed yield behavior and high dissipative capacity, was obtain by 60% tannin substitution. However, a marked softening and reduction in toughness occurred at sufficiently high substitution. Also, the adhesive film, which was heat-treated to simulate cure, showed higher strength than the unheated film. Thus, the properties of tannin containing adhesives could be optimized by using 40/60 weight ratio of the resorcinol/tannin in RTFL adhesive composition as well as heat treatment of adhesive film.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.3
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• pp.231-234
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• 2016

Pouch film is manufactured by laminating aluminum foil, polyamide film and polypropylene film with an adhesive or extrusion resin. However, a surface treatment is required for the aluminum because bonding does not occur easily between the aluminum foil and the polymer film. Thus, for this study, surface treatment experiments were performed in order to confirm the effect on adhesion strength. First, a variety of surface treatment solutions were coated on aluminum foil, and contact angle and surface morphology analysis was carried out for the surface-treated aluminum. For lamination of the surface-treated aluminum foil with polyamide film, a polyurethane base adhesive was prepared for the adhesive strength test specimens. The adhesive strength between the aluminum foil and the polyamide film of the resulting specimens was measured (UTM). With such an experiment, it was possible to evaluate the effect on adhesive strength of the various surface treatments.

• Journal of Adhesion and Interface
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• v.5 no.2
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• pp.1-7
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• 2004

A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

• Journal of Adhesion and Interface
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• v.5 no.2
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• pp.31-42
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• 2004

Many animals possess on their legs adhesive pads, which have undergone evolutionary optimization to be able to attach to variable substrates and to control adhesive forces during locomotion. Insect adhesive pads are either relatively smooth or densely covered with specialized adhesive hairs. Theoretical models predict that adhesion can be increased by splitting the contact zone into many microscopic, elastic subunits, which provides a functional explanation for the widespread 'hairy' design. In many hairy and all smooth attachment systems, the adhesive contact is mediated by a thin film of liquid secretion between the cuticle and the substrate. By using interference reflection microscopy (IRM), the thickness and viscosity of the secretion film was estimated in Weaver ants (Oecophylla smaragdina). 'Footprint' droplets deposited on glass are hydrophobic and form low contact angles. IRM of insect pads in contact showed that the adhesive liquid is an emulsion consisting of hydrophilic, volatile droplets dispersed in a persistent, hydrophobic phase. I tested predictions derived from film thickness and viscosity by measuring friction forces of Weaver ants on a smooth substrate. The measured friction forces were much greater than expected assuming a homogenous film between the pad and the surface. The findings indicate that the rubbery pad cuticle directly interacts with the substrate. To achieve intimate contact between the cuticle and the surface, secretion must drain away, which may be facilitated by microfolds on the surface of smooth insect pads. I propose a combined wet adhesion/rubber friction model of insect surface attachment that explains both the presence of a significant static friction component and the velocity-dependence of sliding friction.

• Textile Coloration and Finishing
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• v.16 no.3
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• pp.14-21
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• 2004

In this research, we accomplished in order to improving color fastness of sublimation for Poly (vinyl alcohol) (PVA)-iodine polarized film. The poor iodine sublimation problem has greatly improved by $O_2$ low temperature plasma treatment. We obtained the followings: (1) plasma treatment has contributed in adhesive ability via peel strength, AFM image and roughness were investigated, But the improvement in adhesive strength was not linearly proportional to the treatment time. (2) $O_2$ plasma treated PVA-iodine polarized film was good enough as to maintain the transmittance and polarization even after iodine cone. of 0.05mol/L and dipping time of 50sec. (3) $O_2$ low temperature plasma treated PVA-iodine polarized film has obtain high durability because of good adhesive strength.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.4
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• pp.393-400
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• 2012

In recent years, nano-structured thin film systems are often applied in industries such as MEMS/NEMS device, optical coating, semiconductor or like this. Thin films are used for many and varied purpose to provide resistance to abrasion, erosion, corrosion, or high temperature oxidation and also to provide special magnetic or dielectric properties. Quite a number of articles to evaluate the characterization of thin film structure such as film density, film grain size, film elastic properties, and film/substrate interface condition were reported. Among them, the evaluation of film adhesive to substrate has been of great interest. In this study, we fabricated the polymeric thin film system with different adhesive conditions to evaluate the adhesive condition of the thin film. The nano-structured thin film system was fabricated by spin coating method. And then V(z) curve technique was applied to evaluate adhesive condition of the interface by measuring the surface acoustic wave(SAW) velocity by scanning acoustic microscope(SAM). Furthermore, a nano-scratch technique was applied to the systems to obtain correlations between the velocity of the SAW propagating within the system including the interface and the shear adhesive force. The results show a good correlation between the SAW velocities measured by acoustic spectroscope and the critical load measured by the nano-scratch test. Consequently, V(z) curve method showed potentials for characterizing the adhesive conditions at the interface by acoustic microscope.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.57-60
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• 2005

Composite-to-aluminum joins were tested to get failure loads and modes for three types of joins; adhesive bonding, bolt fastening, and adhesive-bolt hybrid joining. Film type adhesive FM73 and paste type adhesive Cytec EA9394S were used for aluminum and composite bonding to make a double-lap joint. A digital microscope camcorder was used to monitor the failure initiation and propagation. It was found that the hybrid joining is an effective method to strengthen the joint when the mechanical fastening is stronger than the bonding as in the case of using the paste type adhesive. On the contrary, when the strength of the bolted joint is lower than the strength of the bonded joint as in the joint with the film type adhesive, the bolt joining contribute little to the hybrid joint strength.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1640-1644
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• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1448-1452
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• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin-film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the tangential forces simultaneously as the probe tip of the equipment approaches to the interface between thin-film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ${\sim}$ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester, the feasibility test was performed to evaluate the adhesive strength of thin-film.