• Structural Engineering and Mechanics
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• v.48 no.4
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• pp.479-500
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• 2013

This paper presents the experimental as well as analytical study conducted on layer-bonded scrap tire rubber pad (STRP) isolators to develop low-cost seismic isolators applicable to structures in developing countries. The STRP specimen samples were produced by stacking the STRP layers one on top of another with the application of adhesive. In unbonded application, the STRP bearings were placed between the substructure and superstructure without fastening between the contact surfaces which allows roll-off of the contact supports. The vertical compression and horizontal shear tests were conducted with varying axial loads. These results were used to compute the different mechanical properties of the STRP isolators including vertical stiffness, horizontal effective stiffness, average horizontal stiffness and effective damping ratios. The load-displacement relationships of STRP isolators obtained by experimental and finite element analysis results were found to be in close agreement. The tested STRP samples show energy dissipation capacity considerably greater than the natural rubber bearings. The layer-bonded STRP isolators serve positive incremental force resisting capacity up to the shear strain level of 150%.

• KEPCO Journal on Electric Power and Energy
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• v.4 no.1
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• pp.39-45
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• 2018

Ammonia Adsorbed Fly Ash (AAFA) samples produced from coal fired plants equipped with SNCR (Selective Non-Catalytic Reduction) of nitrogen oxides with urea have been chemically analyzed, and their physical and dissolution properties have been investigated. XRD results for the ammonia component in AAFA ascertained that ABS (ammonium bisulfate) and AS (ammonium sulfate) were deposited on fly ash as $SO_3$ reacted with unreacted ammonia at SNCR. SEM and EDS images showed that fine ashes on large fly ash surface of sphere type were agglomerated, due to adhesive role of ammonium salts attached fly ashes. Dissolution test results of ammonium salts absorbed on AAFA in distilled water or sea water showed that the proportion of un-ionized $NH_3$ to $NH_4{^+}$ were primarily a function of pH and temperature. Increasing pH and temperature causes an increase in the fraction of un-ionized $NH_3$. At pHs of 9.6 and 10.7, un-ionized $NH_3$ and $NH_4{^+}$ ions are present in equal amounts at distilled water and sea water, respectively.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.3
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• pp.570-575
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• 2002

It is well-known that the bond strength between CFRP(Carbon Fiber Reinforced Plastic) and aluminum is significantly affected by the surface treatment of the CFRP and the aluminum. This study investigates the surface treatment of CFRP to improve the T-peel strength of CFRP/aluminum composites. The surface of %CFRP([0^0]_{14})$ was treated by the ion assisted reaction method under oxygen environment. T-peel strength tests were performed based on the procedure of ASTM D1876-95. The T-peel strength of surface-treated CFRP/aluminum composites was compared with that of untreated CFRP/aluminum composites. The results showed that the T-peel strength of surface-treated CFRP/aluminum composites was about 5.5 times higher than that of untreated CFRP/aluminum composites. SEM examination showed that the improvement of T-peel strength was attributed to the uniform spread and fracture of epoxy adhesive.

• Transactions on Electrical and Electronic Materials
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• v.14 no.1
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• pp.20-23
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• 2013

When applying superconducting wire to power machines, an investigation needs to be carried out on the characteristics of wire phase changes in connection with the insulating layer. This study examined trends in the increase of the wire's resistance and the characteristics of its recovery from quenching by a current-applied cycle at temperatures of 90 K, 180 K, and 250 K. The procedure was conducted based on the thickness and presence (or absence) of the insulating wire layers. To achieve this, YBCO thin-film wires with the same critical temperatures were prepared with copper and stainless steel stabilizing layers. At levels (-one, three, and five-), with superior performance, polyimide pressure-sensitive adhesive tape was attached to the wires at a very low temperature. The eight prepared test samples were wound around the linear frames. The wire's voltage and current created from the phase change characteristics were measured at the wire's prescribed temperature, using the four-point probe method. The wire's resistance and recovery characteristics were examined for each cycle at temperatures of 90 K, 180 K, and 250 K.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.2
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• pp.1-13
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• 2011

The recent spotlight on electronic touch-screen display, a rapid breakthrough in the information society is evolving. Touch panel input device such as a keyboard or mouse without the use of, the on-screen character or a specific location or object on the person's hand touches a particular feature to identify the location of a panel is to be handled. The touch screen on the touch panel is used in the Ag paste is used mostly for low-curable paste. The thermal-curing paste according to the drying process of thermal energy consumption and improve the working environment of organic solvents have problems. In this study, Ag paste used in the non-thermal curing friendly and cost-effective UV curable paste was prepared. Current commercially available thermal-curable binder, was used instead of the flow characteristics of UV-curable oligomers and monomers with functional groups to give a single conductive Ag paste with the addition of a pattern could be formed. Ag paste as a result, thermal-curing adhesive, hardness, resistance and excellent reproduction of fine patterns and was available with screen printing environmentally friendly could see its potential as a patterning technology.

• Structural Engineering and Mechanics
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• v.68 no.2
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• pp.171-182
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• 2018

For the first time, nonlocal damped vibration and buckling analyses of arbitrary tapered bidirectional functionally graded solid circular nano-plate (BDFGSCNP) are presented by employing modified spectral Ritz method. The energy method based on Love-Kirchhoff plate theory assumptions is applied to derive neutral equilibrium equation. The Eringen's nonlocal continuum theory is taken into account to capture small-scale effects. The characteristic equations and corresponding first mode shapes are calculated by using a novel modified basis in spectral Ritz method. The modified basis is in terms of orthogonal shifted Chebyshev polynomials of the first kind to avoid employing adhesive functions in the spectral Ritz method. The fast convergence and compatibility with various conditions are advantages of the modified spectral Ritz method. A more accurate multivariable function is used to model two-directional variations of elasticity modulus and mass density. The effects of nanoscale, in-plane pre-load, distributed dashpot, arbitrary tapering, pinned and clamped boundary conditions on natural frequencies and buckling loads are investigated. Observing an excellent agreement between results of current work and outcomes of previously published works in literature, indicates the results' accuracy in current work.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.10-12
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• 2006

The successful use of adhesively bonded parts depends on the defect-free bond of the components. Therefore it is necessary to detect relevant faults and defects in an early state of the production. A 100% test should be pursued, but especially at complicated structures the detection of defects is not easy. Possible testing methods, which show a high potential for the NDT of adhesively bonded parts, are thermography based NDT methods. At present mainly two different procedures of active thermography are being used: Pulse and Lock-In Thermography. With pulse thermography the examined material is warmed up with a short energy pulse (light, eddy current or ultrasonic pulse) and the heat response is recorded after a certain time. The result is an infrared image which indicates material defects in different depths. This paper presents a variety of images showing the capability of Lock-In Thermography to image subsurface defects. Several examples of adhesives joints qualify the ultrasonic Lock-In-Thermography for the in-process quality control for adhesive bonded components.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.11-15
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• 2013

The wafer bonding process becomes a flexible approach to material and device integration. The bonding strength in 3-dimensional process is crucial factor in various interface bonding process such as silicon to silicon, silicon to metals such as oxides to adhesive intermediates. A measurement method of bonding strength was proposed by utilizing AFM applied CNT probe tip which indicated the relative simplicity in preparation of sample and to have merit capable to measure regardless type of films. Also, New Tool was utilized to measure of tip radius. The cleaned $SiO_2$-Si bonding strength of SPFM indicated 0.089 $J/m^2$, and the cleaning result by RCA 1($NH_4OH:H_2O:H_2O_2$) measured 0.044 $J/m^2$, indicated negligible tolerance which verified the possibility capable to measure accurate bonding strength. And it could be confirmed the effective bonding is possible through SPFM cleaning.

• Journal of Welding and Joining
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• v.21 no.5
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• pp.555-560
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• 2003

In automobile industry, it is necessary to reduce the weight from the view point of energy and environmental problems in these days. One of the ways for weight reduction is using adhesive aluminum structures. In this study, ultrasonic signals reflected from the adhesively bonded joint layer are used to evaluate the adhesively bonded joints. FFT is performed to determine bond-layer parameters such as effective thickness and frequency for adhesively bonded joint Al 6061 plates in comparison with the measured and theoretical ratios. And the parameters of ultrasonic wave and the J-integral are investigated to evaluate the adhesively bonded joint strength by DCB specimens.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.