• 한국안전학회지
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• 제16권3호
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• pp.35-40
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• 2001

An internal finishing process applying Magnetic Abrasive Finishing (MAF) was proposed to produce smooth inner surfaces of tubes at a high rate. Since this process uses the tube rotation system, it has been considered applicable only to tubes which are rotatable at high speeds. Here development of the stainless tube(STS 304) rotation system to extend the scope of the application of the internal finishing process applying MAF was made. By the stainless tube(STS 304) rotation system, the abrasive magnetically attracted by the poles is rotated along the inner surface of the tube by magnetic force together with fixed poles, finishing the inner surface of the tube. The main results obtained are as follows : 1) The magnet abrasive finishing minimized influence due to external force because non-contact finishing, 2) The profile of surface roughness decreased very good in 11.4m/min range because abrasive size and speed, 3) The profile of surface roughness by flux density decreased in finishing speed 28m/min, 4) The profile of surface roughness by fled rate decreased in 0.16mm/rev and 0.18mm/rev.

• 한국정밀공학회지
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• 제15권2호
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• pp.53-60
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• 1998

In this study, it is experimented to find factors effecting surface roughness using the system of experiments. in the mirror surface finishing system. (1) The film feed and oscillation frequency in $40{\mu}m$ abrasive film, grinding speed in $30{\mu}m$, and machining time in $15{\mu}m$15 are the main factors effecting the surface roughness. (2) Applying the optimal finishing condition to $40{\mu}m$, $30{\mu}m$, $15{\mu}m$ abrasive finishing film in sequence, it is possible to obtian about Ra 10 nm surface roughness on SM45C workpiece. (3) Application of the system of experments to the micro abrasive grain film finishing was very effective method in the extraction of main factor and optimal condition.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.963-966
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• 2000

Abrasive jet machining(AJM) process is similar to the sand blasting, and effectively removes hard and brittle materials. AJM has applied to rough working such as deburring and rough finishing. As the needs for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro groove cutting of glass. Diameter of hole and width of line in this groove cutting is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro groove cutting in glass, but the size of machined groove was increased about 2~4${\mu}{\textrm}{m}$. therefore, this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD parts.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 추계학술대회
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• pp.313-317
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• 2003

Micro-Channel ultra-precision polishing is a new technology used in magnetic field-assisted relishing. In this paper, an electromagnet or the i18 of test system was designed and manufactured. A size of magnetic abrasive is used on 25~75${\mu}{\textrm}{m}$ and for the polish a micro-channel upper part. A surface of channel which is not even is manufactured using magnetic abrasive finishing at upper surface of micro-channel. As a result, the surface roughness rose by 80％ after upper surface of micro- channel was polished up 8 minutes by polishing.

• 동력기계공학회지
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• 제10권1호
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• pp.46-51
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• 2006

Present study was investigated the effect of the particle of the counterface of unidirectional carbon fiber reinforced composite. The friction coefficient of composite and the specific wear rate different sliding velocity were measured for this materials. The friction track of counterface was observed by an optical microscope and scanning electron microscope. There were insignificant effects of the specific wear rate under lower Sic abrasive particle, however it showed high effect on $30{\mu}m$ abrasive particle size. There were significant effects of friction and wear behavior of the fiber direction under 0.3m/s sliding speed. Major failure mechanisms can be classified such as microfracture, plowing, microcutting, cutting and cracking.

• 한국정밀공학회지
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• 제25권9호
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• pp.32-37
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• 2008

Freestanding hydride vapor phase epitaxy grown GaN(Gallium Nitride) substrates subjected to various polishing methods were characterized for their surface and subsurface conditions, Although CMP(Chemical Mechanical Polishing) is one of the best approaches for reducing scratches and subsurface damages, the removal rate of Ga-polar surface in CMP is insignificant($0.1{\sim}0.3{\mu}m$/hr) as compared with that of N-polar surface, Therefore, conventional MP(Mechanical Polishing) is commonly used in the GaN substrate fabrication process, MP of (0001) surface of GaN has been demonstrated using diamond slurries with different abrasive sizes, Diamond abrasives of size ranging from 30nm to 100nm were dispersed in ethylene glycol solutions and mineral oil solutions, respectively. Significant change in the surface roughness ($R_a$ 0.15nm) and scratch-free surface were obtained by diamond slurry of 30nm in mean abrasive size dispersed in mineral oil solutions. However, MP process introduced subsurface damages confirmed by TEM (Transmission Electronic Microscope) and PL(Photo-Luminescence) analysis.

• Korea-Australia Rheology Journal
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• 제13권2호
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• pp.89-95
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• 2001

Effects of particulate size and frictional characteristics were examined on the melting behavior of PP(polypropylene) in a twin screw extruder. Powder and pellet types of PP were used and each component was blended with PE(polyethylene) wax and clay, respectively. It was observed that small size particulates, 1.e. powder systems exhibit accelerated melting behavior; and it was also found that the abrasive auditive acts as an effective agent for fast melting of PP powder. Retardation of melting due to the reduced friction was observed in both types of PP, contrary to the result found in a batch mixer. The tendency observed in variation of torque and exit temperature was explained in terms of frictional effect and length of compacted region formed during evolution of melting.

• 한국정밀공학회지
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• 제7권2호
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• pp.113-123
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• 1990

To study deleterious effects of contaminants contained in lubricating systems, the effects of fine alumina particle concentration and size on the critical failure load, friction and wear characteristic were examined on boundary lubrication condition using the four ball machine. The following conclusions are deduced: The abrasive is found to cause a transition from mild wear to severe wear at less severe conditions than with clean oil. In mild wear region the friction and wear increase with particle size and concentration, but in severe wear region do not exhibit any definite trend. In relation to film thinckness there is a threshold of particle size beyond which the failure load no longer decreases with particle size.

• 한국터널지하공간학회 논문집
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• 제17권2호
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• pp.141-151
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• 2015

터널굴착의 효율성 증진 및 굴착시 발생하는 진동 저감을 위해 연마재 투입형 워터젯 시스템을 이용한 새로운 형태의 암반 굴착 방식이 개발되어 적용 중에 있다. 연마재 투입형 워터젯 시스템을 이용한 암반 굴착 방식에 있어서, 적절한 양의 연마재를 투입하는 것은 절삭 성능뿐만 아니라 전체 공정의 경제성 향상을 위해서도 매우 중요하다. 본 연구에서는, 다양한 공정 변수들 중 터널 굴착용 워터젯 시스템에서 특히 중요한 공정 변수들인 기하학적 변수(연마재 탱크(또는 호퍼) 높이, 연마재 투입관의 구배, 연마재 투입관의 길이, 연마재 투입관의 굴곡도), 연마재 변수(연마재 입자 크기), 젯 에너지 변수(수압, 유량)이 연마재 투입량 및 연마재가 믹싱 챔버 내로 흡입될 때 발생하는 흡입 압력에 미치는 영향을 규명하기 위하여 다양한 조건에서 실험을 수행하고 그 결과를 분석하였다. 또한, 실험적 연구를 통하여 연마재 투입량이 절삭 성능에 미치는 영향을 논의하였다. 본 연구 결과를 바탕으로 주요 공정 변수들을 조절하여 적절한 연마재 투입량을 유지하면 터널 굴착용 워터젯의 절삭 성능을 극대화할 수 있을 것으로 기대된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.50-53
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• 2003

CMP (chemical mechanical polishing) process remained to solve several problems in deep sub-micron integrated circuit manufacturing process. especially consumables (polishing pad, backing film, slurry, pad conditioner), one of the most important components in the CMP system is the slurry. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are important in determining polish rate and planarization ability of a CMP process. However, the cost of abrasives is still very high. So, in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.