• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.5
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• pp.514-520
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• 2009

In configuring an automated polishing system, a monitoring scheme to estimate the surface roughness is necessary. In this study, a precision polishing process, magnetic abrasive finishing (MAF), along with an in-process monitoring setup was investigated. A magnetic tooling is connected to a CNC machining to polish the surface of stavax(S136) die steel workpieces. During finishing experiments, both AE signals and force signals were sampled and analysed. The finishing results show that MAF has nano scale finishing capability (upto 8nm in surface roughness) and the sensor signals have strong correlations with the parameters such as gap between the tool and workpiece, feed rate and abrasive size. In addition, the signals were utilized as the input parameters of artificial neural networks to predict generated surface roughness. Among the three networks constructed -AE rms input, force input, AE+force input- the ANN with sensor fusion (AE+force) produced most stable results. From above, it has been shown that the proposed sensor fusion scheme is appropriate for the monitoring and prediction of the nano scale precision finishing process.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.2
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• pp.38-45
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• 2005

Chemical mechanical polishing(CMP) has been widely accepted for the planarization of multi-layer structures in semiconductor fabrication. But a variety of defects such as abrasive contamination, scratch, dishing, erosion and corrosion are occurred during CMP. Especially, dishing and erosion defects increase the metal resistance because they decrease the interconnect section area, and ultimately reduce the lift time of the semiconductor. Due to this reason dishing and erosion must be prohibited. The pattern density and size in chip have a significant influence on dishing and erosion occurred by over-polishing. The fixed abrasive pad(FAP) was applied and tested to reduce dishing and erosion in this paper. The abrasive concentration decrease of FAP results in advanced pattern selectivity which can lead the uniform removal in chip and declining over-polishing. Consequently, reduced dishing and erosion was observed in CMP of tungsten pattern wafer with proposed FAP and chemicals.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.250-253
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• 2002

The operation of surface and edge finishing is the last and essential process of parts machining, because a product is completed as an assembly. Therefore, the quality of the finished parts has a direct effect upon the performance of the product. Especially, the edge quality depending on the burr control process is very important. A number of deburring processes have been developed for macro burrs such as barreling, brushing, chemical methods, etc. However, micro burr removal when piercing a very thin plate is very difficult, because this badly deteriorates the surface quality of the processed part. When ultrasonic wave is propagated in liquids, it forms an infinitude of micro bubbles. These bubbles generate extremely strong force, which removes micro burrs. In ultrasonic micro deburring, the problem is that burrs are not removed completely, because only components of the explosive force directly act on the burrs, which is not enough. An attempt was made to remove the burrs using ultrasonic vibration in water with SiC as an abrasive agent. Because of the abrasive, smoother edges have been achieved. There are many control parameters in ultrasonic deburring such as abrasive size, ultrasonic frequency and amplitude, distance between tool and workpiece, tilt angle of workpiece etc. This study focuses on how distance and tilt angle influence deburring effect. A number of experiments for these parameters have been carried out, and then the effect of each parameter analyzed.

• Journal of the Korean Ceramic Society
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• v.43 no.5 s.288
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• pp.277-283
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• 2006

A porous material with a surface layer was fabricated from glass abrasive sludge and expanding agents. The glass abrasive sludges were mixed with expanding agents and compacted into precursors. These precursors were sintered in the range of $700-900^{\circ}C$ for 20 min. The sintered porous materials had a surface layer with smaller pores and inner parts with larger pores. The surface layer and closed pores controlled water absorption. As the expanding agent fraction and the sintering temperature increased, the porosity and pore size increased. The porous materials with $Fe_2O_3$ and graphite as the expanding agents had a low absorption ratio of about 3% or lower while the porous material with $CaCO_3$ as the expanding agent had a higher absorption ratio and more open pores.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.3
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• pp.61-67
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• 2004

In micro hole punching process the burr occurs inevitably, but the burr must be minimized in order to improve the quality and accuracy of the product. In this study, magnetic field-assisted polishing technique is applied to remove the burr which exists in nozzles for ink-jet printer head and proved to be a feasible for deburring by experiment. The deburring characteristics of sheet metals was investigated changing with polishing time and magnetic abrasive size. After the deburring, the burr size has remarkably reduced and roundness of the hole also has improved.

• Journal of Korea Foundry Society
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• v.14 no.5
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• pp.447-454
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• 1994

Wear resistance and wear mechanism of hypereutectic Al-($15{\sim}40$)wt%Si alloys were investigated. Primary Si particles under $20{\mu}m$ size were formed in hypereutectic Al-Si alloy powders due to rapid solidification. But the Si particles of extruded bars were finely distributed in smaller size than that of atomized powders. The wear mechanism of hypereutectic Al-Si alloys was divided into three types of wear phenomena, which were abrasive wear, delamination wear and severe adhesive wear according to sliding speed and load. At low sliding speed and load, wear mechanism was abrasive wear, so Al-15wt%Si alloy showed the best wear resistance. At high sliding speed and load, wear mechanism was adhesive wear, and Al-40wt%Si alloy showed the best wear resistance.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.10
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• pp.1049-1055
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• 2004

Chemical Mechanical Polishing (CMP) is referred to as a three body tribological system, because it includes two solids in relative motion and the CMP slurry. On the assumption that the abrasives between the pad and the wafer could be a major reason not only for the friction force but also for material removal during polishing, the friction force generated during CMP process was investigated with the change of abrasive size and concentration of CMP slurry. The threshold point of average coefficient of friction (COF) with increase in abrasives concentration during interlayer dielectric (ILD) CMP was found experimentally and verified mathematically based on contact mechanics. The predictable models, Mode I (wafer is in contact with abrasives and pad) and Mode II (wafer is in contact with abrasives only), were proposed and used to explain the threshold point. The average COF value increased in the low abrasives concentration region which might be explained by Mode I. In contrast the average COF value decreased at high abrasives concentration which might be regarded to as Mode II. The threshold point observed seemed to be due to the transition from Mode I to Mode II. The tendency of threshold point with the variation of abrasive size was studied. The increase of particle radius could cause contact status to reach transition area faster. The correlation between COF and material removal rate was also investigated from the tribological and energetic point of view. Due to the energy loss by vibration of polishing equipment, COF value is not proportional to the material removal rate in this experiment.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.63-63
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• 2003

The nanotopography of silicon wafers has emerged as an important factor in the STI process since it affects the post-CMP thickness deviation (OTD) of dielectric films. Ceria slurry with surfactant is widely applied to STI-CMP as it offers high oxide-to-nitride removal selectivity. Aiming to control the nanotopography impact through ceria slurry characteristics, we examhed the effect of surfactant concentration and abrasive size on the nanotopography impact. The ceria slurries for this study were produced with cerium carbonate as the starting material. Four kinds of slurry with different size of abrasives were prepared through a mechanical treatment The averaged abrasive size for each slurry varied from 70 nm to 290 nm. An anionic organic surfactant was added with the concentration from 0 to 0.8 wt %. We prepared commercial 8 inch silicon wafers. Oxide Shu were deposited using the plasma-enhanced tetra-ethyl-ortho-silicate (PETEOS) method, The films on wafers were polished on a Strasbaugh 6EC. Film thickness before and after CMP was measured with a spectroscopic ellipsometer, ES4G (SOPRA). The nanotopogrphy height of the wafer was measured with an optical interferometer, NanoMapper (ADE Phase Shift)

• Journal of Ocean Engineering and Technology
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• v.17 no.1
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• pp.55-60
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• 2003

The effect of size and volume fraction of ceramic particles, with sliding velocity on the wear properties were investigated for the metal matrix composites fabricated by the pressureless infiltration process. The metal matrix composites exhibited about 5.5 - 6 times the wear resistance compared with AC8A alloy at high sliding velocity, and by increasing the particle size and decreasing the volume fraction, the wear resistance was improved. The wear resistance of metal matrix composites and AC8A alloy exhibited different aspects. Wear loss of AC8A alloy increased with sliding velocity, linearly : whereas, metal matrix composites indicated more wear loss than AC8A alloy at the slow velocity region. However, a transition point of wear loss was found at the middle velocity region, which shows the minimum wear loss. Further, wear loss at the high velocity region exhibited nearly the same value as the slow velocity region. In terms of wear mechanism, the metal matrix composites generally exhibited abrasive wear at slow to high sliding velocity； however, AC8A alloy showed abrasive wear at low sliding velocity and adhesive and melt wear at high sliding velocity.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2002.10a
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• pp.379-384
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• 2002

The effect of size and volume fraction of ceramic particles with sliding velocity on the wear properties were investigated for the metal matrix composites fabricated by pressureless infiltration process. The particulate metal matrix composites exhibited about 5.5 - 6 times of excellent wear resistance compared with AC8A alloy at high sliding velocity, and as increasing the particle size and decreasing the volume fraction the wear resistance was improved. The wear resistance of metal matrix composites and AC8A alloy exhibited different aspects. Wear loss of AC8A alloy increased with sliding velocity linearly. whereas metal matrix composites indicated more wear loss than AC8A alloy at slow velocity region, however a transition point of wear loss was found at middle velocity region which show the minimum wear loss, and wear loss at high velocity region exhibited nearly same value with slow velocity region. In terms of wear mechanism, the metal matrix composites exhibited the abrasive wear at slow to high sliding velocity generally, however AC8A alloy showed abrasive wear at low sliding velocity and adhesive and melt wear at high sliding velocity.