• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.25-32
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• 2011

We have studied on the slicing and polishing processes of R-plane sapphire wafers for the substrates of UHB nonpolar a-plane GaN LED. The fabrication conditions of the R-plane and c-plane wafers were influenced by the large anisotropic properties (mechanical properties) of the sapphire. The slicing process was more affected by the anisotropic properties of R-plane than the polishing process. When the slicing direction was $45^{\circ}$ to the a-flat, the slicing time was shorter and the quality of as-slicing wafers was better than the slicing direction of normal to the a-flat. The MRR(Material removal rate) of mechanical polishing processes such as lapping and DMP(Diamond mechanical polishing) did not show significant differences between the R-plane and c-plane. The MRR of the c-plane was about two times higher than that of R-planes at the CMP(Chemical mechanical polishing) process due to the formation of hydrolysis reaction layers on the surface of the c-plane.

• Journal of Korean Academy of Oral and Maxillofacial Radiology
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• v.16 no.1
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• pp.59-68
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• 1986

The purpose of this investigation was to locate the central plane of the image layer on the panoramic machine relative to a specific point on the machine. In the study of the central plane of the image layer of panoramic radiograph, using the Morrita Company PANEX-EC a series of 33 exposures were taken with the 4-5 experimental pins placed in the holes of the plastic model plate, then evaluated by human eye. The author analyzed the central plane of the image layer by Mitutoyo-A-221 and calculated horizontal and vertical magnification ratio in the central plane of the image layer determined experimentally. The results were as follows: 1. The location of the central plane of the image layer determined experimentally was to lateral, compared with manufactural central plane. 2. Horizontal magnification ratio in the central plane of the image layer determined experimentally was 9.25%. 3. Vertical magnification ratio in the central plane of the image layer determined experimentally was 9.17%.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.1
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• pp.436-440
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• 2014

To verity the effect of PCB plane layer to the output characteristics of the Switched Mode Power Supply (SMPS), this paper compared with a generic one-layer PCB and a double-side PCB. This paper specially focused on the voltage, the current and the high frequency noise of the output characteristic of the SMPS, using a double-side PCB which has same layout and was installed a ground plane on the opposite side. This double-side PCB was assembled by all same components which used on the SMPS using the single-side PCB. The experiment results show the SMPS using the ground plan PCB can efficiently reduce the high frequency noise to 50mV at 100MHz from 150mV in the single-side PCB. And the results also show the high harmonics frequency was reduced as well.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.37.1-37.1
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• 2011

1990년 나카무라 연구팀에서 청색이 개발된 이래로 LED는 눈부시게 발전해 왔으며, 청색 LED로 인하여 조명용 백색 LED가 급격히 발전하고 있다. 현재까지 개발되고 있는 조명용 백색 LED는 통상적으로 c축 방향의 사파이어 기판위에 GaN film을 성장하여 제작하지만 원천적으로 생기는 자발분극과 압전분극 영향 때문에 양자우물에서의 밴드를 기울게 만들고 이것은 캐리어 재결합율을 감소시켜 그 결과 양자 효율을 낮춘다. 이러한 근본적인 문제를 해결하기 방안은 사파이어 기판에서 c-plane이외의 결정면에서 무분극(혹은 반극성) GaN LED를 성장하여 양자효율을 극대화하여 고효율 LED를 구현할 수 있음. 본 연구에서는 Carbonization mask를 이용하여 r-plane sapphire기판상에 a-plane GaN의 ELOG성장 방법에 대하여 연구하였다. Carbonization mask를 이용하면 기존에 사용되던 SiOx 나 SiNx 막을 사용하지 않고 mask를 만들 수 있다는 장점을 가지고 있으며, 이러한 mask를 이용하여 r-plane sapphire위에 ELOG법을 이용한 a-plane GaN을 성장할 수 있음을 실험을 통해 보이려 한다. ELOG 성장이 이루어 지는지 확인을 위하여 SEM을 통하여 ELOG가 되는 과정을 분석하였으며, 표면의 거칠기를 알아보기 위하여 AFM측정을 시행하였다. 실험 결과 약 20 um 두께로 성장되면서 merge가 되는 것을 확인 하였다.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2000.06a
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• pp.87-92
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• 2000

In order to improve the instability of Plane journal bearing, it is introduced the leaf spring damper(LSD). The effects of dynamic characteristics of LSD on the stability of a plane journal bearing were investigated theoretically. The improvements on the stability of a plane journal bearing with LSD. are compared with the results of a floating ring journal bearing and of journal bearing without LSD. It found that a plane journal bearing with LSD will be an effective way in the improvement on the stability of rotor system.

• Tribology and Lubricants
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• v.17 no.3
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• pp.179-184
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• 2001

In order to improve the instability of plane journal bearing, it is introduced the leaf spring damper(LSD). The effects of dynamic characteristics of LSD on the stability of a plane Journal bearing were investigated theoretically. The improvements on the stability of a plane journal bearing with LSD are compared with the results of a floating ring journal bearing and of journal bearing without LSD. It found that a plane journal bearing with LSD will be an effective way in the improvement on the stability of rotor system.

• Structural Engineering and Mechanics
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• v.34 no.2
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• pp.143-157
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• 2010

This paper presents theoretical solutions for the three-dimensional (3D) stress field in an infinite isotropic elastic plate containing a through-the-thickness circular hole subjected to far-field in-plane loads by using Kane and Mindlin's assumption. The dangerous position, where the premature fracture or failure of the plate will take place, the expressions of the tangential stress at the surface of the hole and the out-of-plane stress constraint factor are found in a concise, explicit form. Based on the present theoretical solutions, a comprehensive analysis is performed on the deviated degree of the in-plane stresses from the related plane stress solutions, stress concentration and out-of-plane constraint, and the emphasis has been placed on the effects of the plate thickness, Poisson's ratio and the far-field in-plane loads on the stress field. The analytical solution shows that the effects of the plate thickness and Poisson's ratio on the deviation of the 3D in-plane stress components is obvious and could not be ignored, although their effects on distributions of the in-plane stress components are slight, and that the effect of the far-field in-plane loads is just on the contrary of that of the above two. When only the shear stress is loaded at far field, the stress concentration factor reach its peak value about 8.9% higher than that of the plane stress solutions, and the out-of-plane stress constraint factor can reach 1 at the surface of the hole and is the biggest among all cases considered.

• Journal of the Korean Association of Oral and Maxillofacial Surgeons
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• v.40 no.3
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• pp.123-129
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• 2014

Objectives: The aim of this study was to verify the concordance of the measurement values when the same cephalometric analysis method was used for two-dimensional (2D) cephalometric radiography and three-dimensional computed tomography (3D CT), and to identify which 3D Frankfort horizontal (FH) plane was the most concordant with FH plane used for cephalometric radiography. Materials and Methods: Reference horizontal plane was FH plane. Palatal angle and occlusal plane angle was evaluated with FH plane. Gonial angle (GA), palatal angle, upper occlusal plane angle (UOPA), mandibular plane angle (MPA), U1 to occlusal plane angle, U1 to FH plane angle, SNA and SNB were obtained on 2D cephalmetries and reconstructed 3D CT. The values measured eight angles in 2D lateral cephalometry and reconstructed 3D CT were evaluated by intraclass correlation coefficiency (ICC). It also was evaluated to identify 3D FH plane with high degree of concordance to 2D one by studying which one in four FH planes shows the highest degree of concordance with 2D FH plane. Results: ICCs of MPA (0.752), UOPA (0.745), SNA (0.798) and SNB (0.869) were high. On the other hand, ICCs of gonial angle (0.583), palatal angle (0.287), U1 to occlusal plane (0.404), U1 to FH plane (0.617) were low respectively. Additionally GA and MPA acquired from 2D were bigger than those on 3D in all 20 patients included in this study. Concordance between one UOPA from 2D and four UOPAs from 3D CT were evaluated by ICC values. Results showed no significant difference among four FH planes defined on 3D CT. Conclusion: FH plane that can be set on 3D CT does not have difference in concordance from FH plane on lateral cephalometry. However, it is desirable to define FH plane on 3D CT with two orbitales and one porion considering the reproduction of orbitale itself.

• Journal of the korean Society of Automotive Engineers
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• v.15 no.2
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• pp.121-129
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• 1993

Plane strain punch stretching test (PSST) was developed to evaluate stamping formability of sheet materials. In this test, the rectangular specimen of sheet material is uniformly stretched up to fracture by raising a specially designed punch to certainly assure plane strain stretching deformation along the longitudinal direction of the specimen. The stamping formability was evaluated by limit punch height(LPH) in plane strain punch stretching test compared to limit dome height(LDH) in hemispherical punch stretching test. LPH-value in PSST well ranks the stamping formability of various material and correlates with press performance. Moreover by using ultrasonic thickness gauge the plane strain intercept-limit plane strain(FLCo)-in forming limit curve can be accurately determined from thickness measurement around the fracture area. The FLCo derived from thickness measurement well correlates with the results from circle grid analysis for the deformed circle grid marked on the surface of the specimen.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.6
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• pp.80-86
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• 1995

A method of eliminating the branch problem in driving crank center point plane for 3 position synthesis of 4 bar mechanism is introduced. By studying various transformation characteristics from the circle point plane into the center poi t plane, the curves in the center point plane transformed from the filemon line in circle point plane are analytically obtained, which will seperate the whole center point plane into many sub-areas for the selec- tion of the center point of the driving crank. And a simple method to identify which of the sub-areas will cause the branch problem is also presented. The method will allow the selection of the center point of driving crank without the branch problem.