• Broadcasting and Media Magazine
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• v.11 no.4
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• pp.104-117
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• 2006

In this Paper, we analyze the application of Interactive Data Broadcasting in DMB(Digital Multimedia Broadcasting) in the accordance with convergence of service and technology. With the acceleration of digital convergence in the Ubiquitous period substantial development of digital media technology and convergence of broadcasting and telecommunication industry are being witnessed. Consequently these results gave rise to newly combined-products such as DMB(Digital Multimedia Broadcasting), WCDMA(Wide-band code division multiple access), Wibro(Wireless Broadband Internet), IP-TV (Internet protocol TV) and HSDPA(High speed downlink packet access). The preparatory stage for the implementation of Interactive Data Broadcasting Service will be reached by the end of December, 2006. DMB is the first result of a successful convergence service between Broadcasting and Telecommunication in new media era. Multimedia technology and services are the core elements of DMB. The Data Broadcasting will not only offer various services of interactive information such News, Weather, Broadcasting Program etc, but also be linked with characteristic function of mobile phone such as calling and SMS(Short Message Service) via Return Channel.

• Journal of Industrial Technology
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• v.22 no.A
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• pp.37-42
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• 2002

The shearing process for the sheet metal is normally used in the precision elements such as a frame of TFT-LCD or lead frame of IC chips. In these precision elements, the burr formation prevents the system assembly and needs the additional burr removing process. In this study, we have developed the novel ultrasonic deburring system to remove the small burr came from shearing of the sheet metal effectively. The deburring tool is driven by the stepping motor and alumina and SiC particles are used as abrasives. Ultrasonic power and the flowing resistance of the abrasives make ti possible to abrasive the burr.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.409-412
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• 2007

A lot of research for system-on-panel(SOP) have been done to integrate display systems including data driver, gate driver, timing controller, DC-DC converter, and smart functions such as embedded touch screen, ambient brightness sensing and luminance control, finger printing on the glass. Recently, the cost of an one-chip driver IC with various functions has decreased rapidly, and new mobile display interface technologies have been introduced. So it is necessary to examine the feasibility of SOP for practical mobile applications. In this paper, we will re-examine LTPS technologies for mobile displays in terms of various aspects and discuss the practical limitations on SOP technology and future technology trend of mobile displays.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2052-2054
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• 2005

TFT-LCD requires to use poly silicon for High resolution and High integration. Thin film make of Poly silicon on the excimer laser-induced crystallization of PECVD(plasma-enhanced chemical vapor deposition)-grown amorphous silicon. In the thin film hydrogen affects to a device performance from bad elements like eruption, void and etc. So dehydrogenation prior to laser exposure was necessary. In this study, use RTP(Rapid Thermal Process) at various temperature from $670^{\circ}C$ to $750^{\circ}C$ and fabricate poly-silicon. it propose optimized RTP window to compare grain size to use poly silicon's SEM pictures and crystallization to analyze Raman curved lines.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.246-246
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• 1999

TFT-LCD 제조공정의 발전에 따라, 박막층(a-Si, SiNx, gate 전극, ITO 등)에 대한 습식공정을 대치하는 건식식각이 선호되고 있다. scan signal의 전파지연시간을 단축시키는 장점을 갖는 Al gate 전극의 건식식각의 경우, 높은 식각속도와 slope angle의 조절, 그리고 식각균일도가 요구된다. 이러한 Al gate 전극물질로는 Al에 Ti이나 Nd와 같은 금속을 첨가하여 post annealing 동안에 발생하는 hillock을 방지하고 더불어 낮은 resistivity(<10$\mu$$\Omega$cm)와 열과 부식에 대한 높은 저항성을 얻을 수 있다. 그러나 Al-Nd alloy 박막은 식각속도와 photoresist에 대한 식각선택도가 낮아 문제로 지적되고 있다. 본 실험에서는 고밀도 플라즈마원의 일종인 자화된 고밀도 유도결합형 플라즈마를 이용하여 식각가스 조합, inductive power, bias voltage 그리고 공정압력 등의 다양한 공정변수에 따른 Al-Nd film의 기본적인 식각특성 변화를 관찰하였다. 식각시 chloring gas를 주요 식각가스로 사용하고 BCl, HBr 등을 10mTorr의 일정한 압력을 유지하는 조건하에서 첨가하였으며 inductive power는 5100W~800W, bias voltage는 -50V~-200V까지 변화를 주었다. 식각공정의 전후를 통하여 Al-Nd 박막표면의 조성변화를 관찰하기 위하여 X-ray photoelectron spectroscopy(XPS)를 이용하였으며 공정변수에 따른 식각후 profile 관찰은 scanning electron microscopy(SEM)을 통하여 관찰하였다. Al-Nd 식각속도는 100% Cl2 플라즈마에 비해 BCl3의 양이 증가할수록 증가하였으며 75%의 BCl3 gas를 첨가하였을 때 가장 높은 식각속도를 얻을 수 있었다. 또한 SEM을 이용한 표면분석으로 roughness가 감소된 공정조건을 찾을 수 있었다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.7
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• pp.1393-1398
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• 2009

Conventionally, etching is first considered for microelectronics fabrication process and is specially important in process of a-Si:H thin film transistor for LCD. In this paper, we stabilize properties of device by development of wet and dry etching process. The a-Si:H TFTs of this paper is inverted staggered type. The gate electrode is lower part. The gate electrode is formed by patterning with length of 8 ${\mu}$m${\sim}$16 ${\mu}$m and width of 80${\sim}$200 ${\mu}$m after depositing with gate electrode (Cr) 1500 ${\AA}$under coming 7059 glass substrate. We have fabricated a-SiN:H, conductor, etch-stopper and photo resistor on gate electrode in sequence, respectively. The thickness of these thin films is formed with a-SiN:H (2000 ${\mu}$m), a-Si:H(2000 ${\mu}$m) and n+a-Si:H (500 ${\mu}$m), We have deposited n-a-Si:H, NPR(Negative Photo Resister) layer after forming pattern of Cr gate electrode by etch-stopper pattern. The NPR layer by inverting pattern of upper gate electrode is patterned and the n+a-Si:H layer is etched by the NPR pattern. The NPR layer is removed. After Cr layer is deposited and patterned, the source-drain electrode is formed. In the fabricated TFT, the most frequent problems are over and under etching in etching process. We were able to improve properties of device by strict criterion on wet, dry etching and cleaning process.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.71-71
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• 1999

현재 소자 제작에 응용되는 수소화된 비정질 실리콘은 PECVD 방법으로 제작하는 것이 보편적인 방법이다. 그러나 비정질 실리콘 박막 트랜지스터는 band gap edge 근처에서 국재준위가 많아 mobility가 작으며 상온에서 조차 불안정하여 신뢰성이 높지 않고, 도핑된 비정질 실리콘의 높은 비저항 등의 단점으로 인하여 고속 회로에 응용이 불가능하다. 반면 다결정질 실리콘 박막 트랜지스터는 a-Si:H TFT 에 비해 재현성이 우수하고 high resolution, high resolution, high contrast LCD에 응용할 수 있다. 하지만, 다결정 실리콘의 grain boundary로 인해 단결정에 비해 많은 defect 들이 존재하여 전도성을 감소시킨다. 따라서 Mobility를 증가시키기 위해서 grain size를 증가시키고 grain boundary 내에 존재하는 trap center를 감소시켜야 한다. 따라서 본 실험에서는 PECVD 장비로 초기 기판을 plasma 처리하여 다결정 실리콘 박막을 제작하여, 기판 처리에 대한 다결정 실리콘 박막의 성장의 특성을 조사하였다. 실험 방법으로는 PECVD 시스템을 이용하여 SiH4 gas와 H2 gas를 선택적으로 증착시키는 LBL 방법을 사용하여 $\mu$c-Si:H 박막을 제작하였다. 비정질 층을 gas plasma treatment 하여 다결정질 실리콘의 증착 initial stage 관찰을 주목적으로 관찰하였다. 다결정 실리콘 박막의 구조적 성질을 조사하기 위하여 Raman, AFM, SEM, XRD를 이용하여 grain 크기와 결정화도에 대해 측정하여 결정성장 mechanism을 관측하였다. LBL 방법으로 증착시킨 박막의 Raman 분석을 통해서 박막 증착 초기에 비정질이 증착된 후에 결정질로 상태가 변화됨을 관측할 수 있었고, SEM image를 통해서 증착 회수를 증가시키면서 grain size가 작아졌다 다시 커지는 현상을 볼 수 있었다. 이 비정질 층의 transition layer를 gas plasma 처리를 통해서 다결정 핵 형성에 영향을 관측하여 적정한 gas plasma를 통해서 다결정질 실리콘 박막 증착 공정을 단축시킬 수 있는 가능성을 짐작할 수 있었고, 또한 표면의 roughnes와 morphology를 AFM을 통하여 관측함으로써 다결정 박막의 핵 형성에 알맞은 증착 표면 특성을 분석 할 수 있었다.

• Journal of the Korean Society of Radiology
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• v.10 no.1
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• pp.1-6
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• 2016

Recently, the various digital X-ray imaging devices using CCD and TFT LCD-based flat panel digital X-ray sensor are being used. In particular, a number of studies on photon counting sensor technique have been reported. In this study, the incident X-rays fluence on the photon counting sensor material was measured to estimate photon detection efficiency which is the quantitative performance evaluation factor of photon counting sensor. The result of measuring the photon fluence by using RQA-M2 Radiation beam quality of IEC 61223-1-2 recommendations, the incident photon fluence could be defined as about $4 photons/(0.01mm)^2{\cdot}{\mu}Gy$ within $10{\mu}m$ pin-hole area, and about $50photons/(0.03mm)^2{\cdot}{\mu}Gy$ within $30{\mu}m$ pin-hole area, and about $698photons/(0.1mm)^2{\cdot}{\mu}Gy$ within $100{\mu}m$ pin-hole area. Consequently, with the previously setup of the incident fluence, the measuring of actual photon counting efficiency by observing the output waveform of the photon counting sensor material was considered possible.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.56-56
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• 1999

For advanced TFT-LCD manufacturing processes, dry etching of thin-film layers(a-Si, $SiN_x$, SID & gate electrodes, ITO etc.) is increasingly preferred instead of conventional wet etching processes. To dry etch Al gate electrode which is advantageous for reducing propagation delay time of scan signals, high etch rate, slope angle control, and etch uniformity are required. For the Al gate electrode, some metals such as Ti and Nd are added in Al to prevent hillocks during post-annealing processes in addition to gaining low-resistivity($<10u{\Omega}{\cdot}cm$), high performance to heat tolerance and corrosion tolerance of Al thin films. In the case of AI-Nd alloy films, however, low etch rate and poor selectivity over photoresist are remained as a problem. In this study, to enhance the etch rates together with etch uniformity of AI-Nd alloys, magnetized inductively coupled plasma(MICP) have been used instead of conventional ICP and the effects of various magnets and processes conditions have been studied. MICP was consisted of fourteen pairs of permanent magnets arranged along the inside of chamber wall and also a Helmholtz type axial electromagnets was located outside the chamber. Gas combinations of $Cl_2,{\;}BCl_3$, and HBr were used with pressures between 5mTorr and 30mTorr, rf-bias voltages from -50Vto -200V, and inductive powers from 400W to 800W. In the case of $Cl_2/BCl_3$ plasma chemistry, the etch rate of AI-Nd films and etch selectivity over photoresist increased with $BCl_3$ rich etch chemistries for both with and without the magnets. The highest etch rate of $1,000{\AA}/min$, however, could be obtained with the magnets(both the multi-dipole magnets and the electromagnets). Under an optimized electromagnetic strength, etch uniformity of less than 5% also could be obtained under the above conditions.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.668-672
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• 2003

In order to reach the high electrical quality of organic thin film transistors (OTFTs) such as high mobility and on-off current ratio, it is strongly desirable to study the enhancement of electrical properties in OTFTs. Here, we report the novel method of hydrogen $(H_{2})$ plasma treatment to improve electrical properties in inverted staggered OTFTs based on pentacene as active layer. To certify the effect of this method, we compared the electrical properties of normal device as a reference with those of device using the novel method. In result, the normal device as a reference making no use of this method exhibited a field effect mobility of 0.055 $cm^{2}/Vs$, on/off current ratio of $10^{3}$, threshold voltage of -4.5 V, and subthreshold slope of 7.6 V/dec. While the device using the novel method exhibited a field effect mobility of 0.174 $cm^{2}/Vs$, on/off current ratio of $10^{6}$. threshold voltage of -0.5 V, and subthreshold slope of 1.49 V/dec. According to these results, we have found the electrical performances in inverted staggered pentacene TFT owing to this novel method are remarkably enhanced. So, this method plays a key role in highly improving the electric performance of OTFTs. Moreover, this method is the first time yet reported for any OTFTs