• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.5
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• pp.551-556
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• 2018

The material normally used in hot dip galvanizing facilities is SM45C (carbon steel for mechanical structure, KS standard), mainly because of its price. During this process, the oxidation of the plating facility occurs due to the heat of the Zn fumes coming from the molten zinc. Since the cycle time of the current facilities is 6 months, much time and money are wasted. In this study, the corrosive properties of various materials (Inconel625, STS304, SM45C) were investigated by oxidation in a high temperature and Zn fumes environment. The possibility of applying the hot-dip galvanizing equipment was investigated for each material. The Zn fumes were generated by directly bubbling Ar gas into Zn molten metal in a 650 degree furnace. High-temperature, Zn fumes corrosion was conducted for 30 days. The sample was removed after 30 days and the oxidation of the surface was confirmed with EDS and SEM, and the corrosion properties were examined using potentiodynamic polarization tests.

• Journal of the Korean institute of surface engineering
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• v.20 no.3
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• pp.118-126
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• 1987

The Zn-Al composite electroplating was studied by using chloride zinc bath containing metal hydroxides $(Zn(OH)_2,\;Al(OH)_3))$ and aluminium powder. The size of Al powder codeposited in the beaker bath with Al powder of-400 mesh was under 10${\mu}m$. The Zn-Al composite was electro-deposited at 40$^{\circ}C$ in the ranges of current density of 5-50 A/$dm^2$ in the flowing electrolyte. The content of aluminium particles codeposited increased slightly with increasing flow rate of electrolyte from 0.5 m/sec to 1.0 m/sec, and decreased with increasing current density from 5 A/$dm^2$ to 50 A/$dm^2$. The content of aluminium particles codeposited by using the electrolyte containing zinc hydroxide(0.1M) was 2~4 wt%. The Al powder was codeposited mainly near the surface layer of the electrodeposits. The dissolution rate of aluminium particles in the electrolyte containing 0.1M $Zn(OH)_2$ and Boric acid was 0.41 g/l. day in comparison with 1.5 g/l. day dissolution rate in pure chloride bath.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.17-21
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• 2013

Sn whiskers are one of the serious causes of the failure of electronics. Sn whiskers grow spontaneously from Sn-based, lead-free finished surfaces, even at room temperature. A primary factor of these Sn whiskers growth is compressive stress, which enhances the diffusion of Sn or other elements. The sources of compressive stress are the growth of non-uniform large intermetallic compounds along the interface between the Sn grain boundary and Cu substrate. Recent studies revealed the methods for reducing Sn whisker growth. This paper gives an overview about recent researches for mitigation methods of Sn whisker growth during nearly room temperature storage.

• Journal of the Korean institute of surface engineering
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• v.50 no.5
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• pp.373-379
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• 2017

Dry processes like evaporation and sputtering in vacuum chamber are difficult to make a uniform, large area and high quality film on thin PET substrate because of PET degradation and bad adhesion. On the other hand, wet processes like electro or electroless plating have complex processes and require high environmental cost. In this study, we successfully prepared $2{\mu}m$ Zn/Cu/Ni multilayers coated on $12{\mu}m$ polyethylene terephthalate (PET) substrate by using dry-wet mixing processes. Their surface electric resistances were evaluated around $0.2{\Omega}$ by using 4 probe measurements. Furthermore, their corrosion resistance also evaluated by natural potential test and compared with other wet, dry and mixing process samples.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.98-104
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• 2023

The feasibility of an efficient process proposed for Cu-Cu flip-chip bonding was evaluated by forming a porous Cu layer on Cu pillar and conducting thermo-compression sinter-bonding after the infiltration of a reducing agent. The porous Cu layers on Cu pillars were manufactured through a three-step process of Zn plating-heat treatment-Zn selective etching. The average thickness of the formed porous Cu layer was approximately 2.3 ㎛. The flip-chip bonding was accomplished after infiltrating reducing solvent into porous Cu layer and pre-heating, and the layers were finally conducted into sintered joints through thermo-compression. With reduction behavior of Cu oxides and suppression of additional oxidation by the solvent, the porous Cu layer densified to thickness of approximately 1.1 ㎛ during the thermo-compression, and the Cu-Cu flip-chip bonding was eventually completed. As a result, a shear strength of approximately 11.2 MPa could be achieved after the bonding for 5 min under a pressure of 10 MPa at 300 ℃ in air. Because that was a result of partial bonding by only about 50% of the pillars, it was anticipated that a shear strength of 20 MPa or more could easily be obtained if all the pillars were induced to bond through process optimization.

• Resources Recycling
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• v.13 no.2
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• pp.3-8
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• 2004

A basic study on the recovery of heavy metals such as Zn, Ni, Cu and Fe ions from wastewater was carried out with the spent iron oxide catalyst, which was used in the Styrene Monomer(SM) production company. The heavy metals could be recovered more than 98％ with the spent iron oxide catalyst. The alkaline components of the spent catalyst could be precipitated the metal ions of the wastewater as metal hydroxides at the higher pH 10.6 in Ni, pH 8.0 in Cu, pH 6.5 in Fe, pH 8.5 in Zn. But the metal ions are adsorbed physically on the surface of the spent catalyst in the range of the pH of the metal hydroxides and pH 3.0, which is the isoelectric point of the iron oxide catalyst.

• Transactions of the Korean hydrogen and new energy society
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• v.29 no.6
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• pp.549-558
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• 2018

The overall efficiency depend on the overpotential of the oxygen evolution reaction in alkaline water electrolysis. Therefore, it is necessary to research to reduce the oxygen evolution overpotential of electrodes. In this study, Ni-Zn-Fe electrodes were prepared by electroplating and the surface area was increased by Zn leaching process. Electroplating variables were studied to optimize the plating parameters(electroplating current density, pH value of electroplating solution, Ni/Fe content ratio). Ni-Zn-Fe electrode, which is electroplated in a modified Watts bath, showed 0.294 V of overpotential at $0.1A/cm^2$. That result is better than that of Ni and Ni-Zn plated electrodes. As the electroplating current density of the Ni-Zn-Fe electrode increased, the particle size tended to increase and the overpotential of oxygen evolution reaction decreased. As reducing pH of electroplating solution from 4 to 2, Fe content in electrode and activity of oxygen evolution reaction decreased.

• Korean Journal of Materials Research
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• v.5 no.7
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• pp.794-801
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• 1995

To connect the driver IC and Al coated glass, a method has been developed to plate electrolessly Ni on Al/PR system. It Is necessary to pretreat Al to remove oxide film before plating. In order to find pretreatment process which does not damage photoresist or glass, alkaline and fluoride zincate process have been investigated. Because photoresist and aluminum thin film can easily dissolve in alkaline solution, it is considered that the fluoride zincate process was a suitable one. After immersion in the zincate solution containing 1.5 g/$\ell$ ammonium bifluoride and 100 g/$\ell$ zinc sulfate, electroless nickel plating could be performed. The additive in the zincate solution and thiourea in the plating solution increased smoothness of the plated surface. Acld dip could improve the uniformit of the surface.

• Proceedings of the Korean Magnestics Society Conference
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• 2003.12a
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• pp.275-275
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• 2003

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.206-206
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• 2013

산악자전거 서스펜션 포크 프레임의 소재 개발을 위해 Si, Mn, Mg, Cr, Zn 원소의 첨가량을 조정한 500MPa 인장강도를 가지는 압출성형과 용접성이 우수한 알루미늄 합금을 개발하였다. 개발한 고비강도 경량 알루미늄합금 위에 고경도, 고기능성과 같은 우수한 기계적 물성을 가진 TiN 박막을 Arc ion plating 공정으로 코팅하여 알루미늄합금의 내부식성, 내구성을 향상시켰다.