• Title/Summary/Keyword: Zn plating

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Electrodeposition of Zn-Mn Alloys on Steel from acidic chloride bath (염산욕에서 제조된 강판표면의 Zn-Mn 합금에 대한 연구)

  • Kang, Soo Young
    • Journal of the Korea Convergence Society
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    • v.9 no.10
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    • pp.271-276
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    • 2018
  • In the industry, Zn galvanizing on the steel using the principle of sacrificial anode is used. The steel have some problem, specially corrosion problem. To solve corrosion problem, Zn-Mn alloy plating has been studied as one of the measures to increase the corrosion resistance rather than pure zinc plating. It is possible to be applied to automotive parts requiring high corrosion resistance even though the plating cost is high. In this study, Zn-Mn alloys were electrodeposited from an acidic chloride bath. The influence of the electrolytic conditions on the composition of the alloy plating in the chloride bath was investigated. As the current density of the cathode increases, Zn content of electrodeposit decrease and Mn content of electrodeposit increase. As the temperature of the electrolyte increases, Zn content of electrodeposit decrease and Mn content of electrodeposit increase. The results are explained by the cathode overvoltage curve of Mn and Zn.

Effect of current density, temperature and electrolyte concentration on Composition of Zn-Ni Electrodeposits (Zn-Ni도금의 합금화에 미치는 전류밀도, 온도와 전해액농도의 영향)

  • Kang, Soo Young
    • Journal of the Korea Convergence Society
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    • v.8 no.11
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    • pp.307-312
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    • 2017
  • In the industry, galvanizing using the principle of sacrificial anode is used Zn-Ni alloy plating was developed as one of the measures to increase the corrosion resistance rather than pure zinc plating. The alloy plating layer has a corrosion resistance of 4-5 times that of the pure zinc plating layer, so that it is applied to automotive parts requiring high corrosion resistance even though the plating cost is high. The amount of Zn-Ni alloy plating solution is a sulfuric acid bath, a chlorinated bath, an alkali bath, and an ammonia bath. Here, the influence of the electrolytic conditions on the composition of the alloy plating in the chloride bath was investigated. The results are explained by the cathode overvoltage and the diffusion coefficient. In general, as the overvoltage of the cathode increases, the concentration polarization becomes more important than the activation polarization. The concentration polarization is determined by element diffusion in the diffusion layer. That is, as the overvoltage of the cathode increases, the Zn content having a large diffusion coefficient increases.

Study on Electroless Black Ni-Zn Plating Using Hydrazine as a Reducing Agent (히드라진에 의한 무전해 흑색 니켈-아연 합금 도금에 대한 연구)

  • 오영주;정원용;이만승
    • Journal of the Korean institute of surface engineering
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    • v.36 no.5
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    • pp.393-397
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    • 2003
  • The effects of the composition and additives on the blackening and deposition rate of electroless Ni-Zn plating have been examined. Hydrazine resulted in lower sheet resistance of the deposit than sodium hypophosphite. Zinc concentration more than 15 wt% and small amount of ammonium sulfate in the deposits were needed in obtaining Ni-Zn deposit with a black color. An optimum condition was obtained for the black Ni-Zn deposit at an appreciable deposition rate.

NiZn Ferrite Coating for Electrical Insulation of MnZn Ferrite Cores

  • Kitamoto, Y.;Yajima, H.;Nakayama, Y.;Abe, M.
    • Journal of the Korean Ceramic Society
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    • v.38 no.6
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    • pp.506-508
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    • 2001
  • The ferrite plating with applying power ultrasound waves of 19.5 kHz and 600W enabled us to encapsulate entirely MnZn ferrite cores for transformers with Ni$\sub$x/Zn$\sub$y/Fe$\sub$3-x-y/O$_4$coating. Supplying a NH$_4$OH solution during the plating broke the limit of the solubility of Ni ions to ferrite-plated films. The electrical resistivity of the NiZn ferrite coating increased with increasing the Ni and Zn content, reaching 2.3${\times}$10$\^$5/Ωcm at the composition of Ni$\sub$0.24/Zn$\sub$0.30/Fe$\sub$2.46/O$_4$. The saturation magnetization was 540 emu/㎤. As a result, the MnZn ferrite cores were successfully encapsulated with the NiZn ferrite coatings for an insulation layer.

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Non-aqueous Zinc(Zn) Plating to Prevent Hydrogen Release from Test Specimens in Hydrogen Embrittlement Test (수소 취성 시험 평가를 위한 수소 방출 방지용 비수계 아연(Zn) 도금)

  • Jeon, Jun-Hyuck;Jang, JongKwan
    • Journal of the Korean Institute of Gas
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    • v.26 no.3
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    • pp.21-26
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    • 2022
  • Zinc is emerging as a environment-friendly plating material to replace cadmium, which is harmful to the human body, to prevent hydrogen gas penetration or release from metal materials. Electroplating of Zn and Zn alloys, which is usually performed in an aqueous acidic atmosphere, has disadvantages such as low coulombic efficiency, corrosion, and hydrogen release, resulting in industrial use difficult. In this study, a deep-eutectic solvent was synthesized using choline chloride and ethylene glycol. Using this as a solvent, an electrolyte for Zn plating was prepared, and then zinc was plated on the STS 304 substrate. The surface microstructure and roughness were observed using SEM and AFM. The crystal structure of the electro-plated film was analyzed using XRD. Finally, the preventing effects of hydrogen release through Zn-based deep-eutectic plating on the STS 304 substrate were compared with the uncoated substrate.

INTERFACIAL REACTION AND STRENGTH OF QFP JOINTS USING SN-ZN-BI SOLDER WITH VARYING LEAD PLATING MATERIALS

  • Iwanishi, Hiroaki;Imamura, Takeshi;Hirose, Akio;Ekobayashi, Kojirou;Tateyama, Kazuki;Mori, Ikuo
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.481-486
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    • 2002
  • We have investigated the effects of plating materials for Cu lead (Sn-lOPb, AwPdJNi, Sn-3.5Ag, Sn-3Bi and Sn-0.7Cu) on properties of QFP joints using a Sn-8Zn-3Bi solder. The results were compared with the joints using Sn-3. 5Ag-0. 7Cu and Sn-37Pb solders. As a result, the joints with the Sn-3.5Ag, Sn-3Bi and Sn-0.7Cu plated Cu lead had the reliability comparable to those of the Sn-3.5Ag-0.7Cu and Sn-37Pb soldered joints with respect to the joint strength after the high temperature holding tests at 348K to 423k. In particular, the joint with the Sn-3.5Ag plated Cu lead had the best reliability. This is caused by the low growth rate of a Cu-Sn interfacial reaction layer that degrades the joint strength of the soldered joints. Consequently, the Sn-3.5Ag plating was found to be most feasible plating for the Sn-8Zn-3Bi soldered joint.

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A Study of Optimization of Electrodeposited CuSnZn Alloys Electrolyte and Process

  • Hur, Jin-Young;Lee, Ho-Nyun;Lee, Hong-Kee
    • Journal of the Korean institute of surface engineering
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    • v.43 no.2
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    • pp.64-72
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    • 2010
  • CuSnZn electroplating was investigated as alternative to Ni plating. Evaluation of electrolyte and plating process was performed to control physical characteristics of the film, and to collect practical data for application. Hull-cell test was conducted for basic comparison of two commercialized products and developed product. Based on hull-cell test results, long term test of three electrolytes was performed. Various analysis on long term tested electrolyte and samples have been done. Reliable and practical data was collected using FE-SEM (FEI, Sirion), EDX (ThermoNoran SIX-200E), ICP Spectrometer (GBC Scientifi c, Integra XL), FIB (FEI, Nova600) for anlysis. Physical analysis and reliability test of the long term tested film were also carried out. Through this investigation plating time, plating speed, electrolyte composition, electrolyte metal consumption, hardness and corrosion resistance has been compared. This set of data is used to predict and control the chemical composition of the film and modify the physical characteristics of the CuSnZn alloy.

Effect of Additives on Deposition Rate and Stability of Electroless Black Ni-Zn-P Plating (무전해 Ni-Zn-P 도금의 속도 및 안정성에 미치는 첨가제의 영향)

  • 오영주;황경진;정원용;이만승
    • Journal of the Korean institute of surface engineering
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    • v.36 no.4
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    • pp.317-323
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    • 2003
  • The effect of additives such as complexing agents, stabilzers and boric acid on the bath stability and the deposition rate of electroless black Ni-Zn plating has been examined. The deposits obtained became black and showed an amorphous structure. The significant increasing in the deposition rate was not found when only glycine and citric acid were used as complexing agents. The deposition rate increased up to 3 and 4 times by adding malic acid and glycolic acid as an additional complexing agent, respectively. The stabilizers and the boric acid, however, had little influence on the deposition rate.