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Kim, Dong-Pyo;Kim, Chang-Il
- Transactions on Electrical and Electronic Materials
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- v.4 no.2
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- pp.29-34
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- 2003
Ferroelectric YMnO$_3$ thin films were etched with Ar/C1$_2$ and CF$_4$/C1$_2$ Plasma. The maximum etch rate of YMnO$_3$ thin film was 300 $\AA$/min at a Cl$_2$/Ar gas mixing ratio of 8/2, an RF power of 800 W, a do bias of-200 V, a chamber pressure of 15 mTorr, and a substrate temperature of 3$0^{\circ}C$. From the X-ray photoelectron spectroscopy (XPS) analysis, yttrium was not only etched by chemical reactions with Cl atoms, but also assisted by Ar ion bombardments in Ar/C1$_2$ plasma. In CF$_4$/C1$_2$ plasma, yttrium formed nonvolatile YF$_{x}$ compounds and remained on and the etched surface of YMnO$_3$. Manganese etched effectively by forming volatile MnCl$_{x}$ and MnF$_{y}$. From the X-ray diffraction (XRD) analysis, the (0004) diffraction peak intensity of the YMnO$_3$ thin film etched in Ar/Cl$_2$ plasma shows lower than that in CF$_4$/Cl$_2$ plasma. It indicates that the crystallinty of the YMnO$_3$ thin film is more easily damaged by the Af ion bombardment than the changes of stoichiometry due to nonvolatile etch by-products.cts.s.
https://doi.org/10.4313/TEEM.2003.4.2.029 인용 PDF KSCI

Kim, In-Pyo;Park, Jae-Hwa;Kim, Kyoung-Tae;Kim, Chang-Il;Jang, Eui-Goo;Eom, Joon-Chul
- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2002.11a
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- pp.159-162
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- 2002
Ferroelectric $YMnO_{3}$ thin films were etched with $Ar/Cl_{2}$ and $CF_{4}/Cl_{2}$ inductivly coupled plasma (ICP). The maximum etch rate of $YMnO_{3}$ thin film was $300{\AA}/min$ at a $Ar/Cl_{2}$ gas mixing ratio of 2/8, a RF power of 800 W, a dc bias of 200 V, a chamber pressure of 15 mTorr, and a substrate temperature of ${30^{\circ}C}$. From the X-ray photoelectron spectroscopy (XPS) analysis ， yttrium not only etched by chemical reactions with Cl radicals, but also assisted by Ar ion bombardments in $Ar/Cl_{2}$ plasma. In $CF_{4}/Cl_{2}$ plasma, yttrium are remained on the etched surface of $YMnO_{3}$ and formed of nonvolatile YFx compounds Manganese etched effectively by chemical reactions with Cl and F radicals. From the X-ray diffraction (XRD) analysis, the (0004) diffraction peak intensity of the $YMnO_{3}$ thin film etched in $Ar/Cl_{2}$ plasma shows lower value than that in $CF_{4}/Cl_{2}$ plasma. It is indicates that the crystallinty of $YMnO_{3}$ thin film is more easily damaged by the Ar ion bombardment than the changes of stoichiometry due to nonvolatile etch by-products.
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김재윤;김부근;김강언;정수태;조상희
- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 1999.05a
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- pp.657-660
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- 1999
In this paper, we have investigated YMnO$_3$ bulk ceramics, which was made by Mixed oxide method, with Y/Mn ratios of 0.80/1.20, 0.90/1.10, 0.95/1.05, 1.00/1.00, 1.05/0.95 and 1.10/0.90. The samples crystall structure with Y/Mn ratios of 0.95/1.05 was hexagonal structure. The physical properties of YMnO$_3$ ceramics were divided into two groups, the sample with Y/Mn ratios of 0.80/1.20, 0.90/1.10 and 0.95/1.05 is classified to Mn rich sample, and with Y/Mn ratios of 1.00/1.00, 1.05/0.95 and 1.10/0.90 is classified to Y rich sample. The sintering and dielectric properties of this sample were summarized as following sintering density of Mn rich sample was increased. Dissipation factor of Mn rich sample was small The dielectric constant, dissipation factor of sample with Y/Mn ratio (0.90/1.10) were 37, 0.017 respectively at measured 1MHz
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