• Title/Summary/Keyword: X-ray source arrangement

Search Result 2, Processing Time 0.02 seconds

Image Quality Evaluation according to X-ray Source Arrangement Type and the Number of Projections in a s-IGDT System (s-IGDT 시스템의 X-선원 배열 형태 및 투영상 개수에 따른 영상 화질 평가에 관한 연구)

  • Lee, Dahye;Nam, KiBok;Lee, Seungwan
    • Journal of radiological science and technology
    • /
    • v.45 no.2
    • /
    • pp.117-125
    • /
    • 2022
  • Although stationary inverse-geometry digital tomosynthesis (s-IGDT) is able to reduce motion artifacts, image acquisition time and radiation dose, the image quality of the s-IGDT is degraded due to the truncations arisen in projections. Therefore, the effects of geometric and image acquisition conditions in the s-IGDT should be analyzed for improving the image quality and clinical applicability of the s-IGDT system. In this study, the s-IGDT images were obtained with the various X-ray source arrangement types and the various number of projections. The resolution and noise characteristics of the obtained s-IGDT images were evaluated, and the characteristics were compared with those of the conventional DT images. The s-IGDT system using linear X-ray source arrangement and 40 projections maximized the image characteristics of resolution and noise, and the corresponding system was superior to the conventional DT system in terms of image resolution. In conclusion, we expect that the s-IGDT system can be used for providing medical images in diagnosis.

Characteristics of Cu Thick Films Deposited by High Rate Magnetron Sputtering Source (고속 스퍼터링 소스를 이용한 구리 후막 제조 및 특성 평가)

  • Jeong, Jae-In;Yang, Ji-Hun
    • Proceedings of the Korean Institute of Surface Engineering Conference
    • /
    • 2008.11a
    • /
    • pp.13-14
    • /
    • 2008
  • A high rate magnetron sputtering source (HRMSS) was employed to deposit thick copper films. The HRMSS was manufactured by changing the magnet size, arrangement, and field intensity. For the preparation of thick copper films, the copper sputtering conditions using HRMSS were characterized based on the deposition parameters such as discharge characteristics, I-V characteristics of the source, and change of deposition rate. The deposition rate of copper turned out to be more than 5 times than that of conventional magnetron sputtering source. Thick copper films having thickness of more than $20{\mu}m$ were prepared by using HRMSS. The morphology and orientation of the films were investigated by scanning electron microscopy and x-ray diffraction.

  • PDF