• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.11-18
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• 2022

Recently, as flexible electronic device-related technologies have received worldwide attention, the development of wiring and bonding technologies using liquid metals is required in order to improve problems such as formability in the manufacturing process of flexible devices and performance and durability in the bending state. In response to these needs, various studies are being conducted to use gallium and gallium-based alloys (eutectic Ga-In and eutectic Ga-In-Sn, etc.) liquid metals, with low viscosity and excellent electrical conductivity without toxicity, as low-temperature bonding materials. In this paper, the latest research trends of low-temperature bonding technology using gallium and gallium-based alloys are summarized and introduced. These technologies are expected to become important base technologies for practical use in the fields of manufacturing flexible electronic devices and low-temperature bonding in microelectronic packages in the future.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.11
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• pp.5879-5884
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• 2013

With the rapid industrialization and economical development, the electricity demands of the industrial facilities and densely populated large cities are continuing to increase in Korea. The increase in the power consumption requires the extension of power facilities, but it is difficult to secure spaces for equipment installation in the limited space of urban areas. In addition, the 154 kV or 345 kV transmission systems in Korea has a short transmission distance, and are connected to one another in network structures that ensure the high reliability and stability of power supply. This structure reduces the impedance during the fault in power system, and increases the magnitude of in the short circuit fault current. The superconducting fault current limiter (SFCL) was devised to effectively address these existing problems. The SFCL is a new-concept eco-friendly protective device that ensures fast operation and recovery time for the fault current and does not need additional fault detection devices. Therefore, many studies are being conducted around the world. In this paper, based on the wiring method the initial fault current characteristics, current limiting characteristics, according to the incident angle and the change in inductance current limiting characteristics were analyzed in a multifaceted methods.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

• Korean Journal of Optics and Photonics
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• v.29 no.1
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• pp.19-27
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• 2018

A change in object distance would generally change the magnification of an optical system. In this paper, we have proposed and designed a double-Gauss optical system with a fixed magnification and image surface regardless of any change in object distance, according to moving the lens groups a little bit to the front and rear of the stop, independently parallel to the direction of the optical axis. By maintaining a constant size of image formation in spite of various object-distance changes in a projection system such as a head-up display (HUD) or head-mounted display (HMD), we can prevent the field of view from changing while focusing in an HUD or HMD. Also, to check precisely the state of the wiring that connects semiconductor chips and IC circuit boards, we can keep the magnification of the optical system constant, even when the object distance changes due to vertical movement along the optical axis of a testing device. Additionally, if we use this double-Gauss optical system as a vision system in the testing process of lots of electronic boards in a manufacturing system, since we can systematically eliminate additional image processing for visual enhancement of image quality, we can dramatically reduce the testing time for a fast test process. Also, the Gaussian bracket method was used to find the moving distance of each group, to achieve the desired specifications and fix magnification and image surface simultaneously. After the initial design, the optimization of the optical system was performed using the Synopsys optical design software.

• Korean Security Journal
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• no.30
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• pp.33-60
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• 2012

False alarm of Electronic security causes various serious side effects such as decrease of electronic security guard's morale caused by unnecessary mobilization, increase of fatigue caused by workload increase, increase of electronic security company owner's management burden and decrease of electronic security service utilization rate caused by customer's distrust. Therefore, the study considered the Korean regulation related with false alarm of electronic security and proposed actual status of false alarm and measure for it. The study proposed systematic resolution assignments and political assignments in relation with the measure for false alarm. Systematic resolution assignments are as follows. First, electronic security company should construct electronic security system accurately from the initial step of security consulting and security planning related with target facility. Second, it is necessary to encourage installation and operation of video monitoring system. Third, sensor wiring should be separated. Fourth, the measures for false alarm depending on main system causes should be prepared. It is necessary to encourage the installation of 'arming disarming alarm sound' generator. In addition, the measures for false arm depending on the characteristics of sensor should be prepared and standardized. Fifth, system maintenance should be reinforced. Political assignments related with the measures for false alarm are as follows. First, it is necessary to reinforce education & training. Individual nurturing & education process should be run by electronic security company or the education focusing on the measure for false alarm should be performed in job training defined in "Security Industry Act". Second, it is necessary to establish and reinforce legal regulation and establish device. If police authority standardizes the documents related with false alarm, provides their forms and requires them for periodical reports or documents, it is expected that good measures for false alarm will be prepared on the basis of actual data in the future. Third, cooperation organization to discuss the measures for false alarm like 'Conference for False Alarm of Electronic Security' should be organized and operated. Fourth, interest and role of electronic security company and electronic security supervisor should be enlarged.