• Current Photovoltaic Research
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• v.11 no.2
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• pp.44-48
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• 2023

In heterojunction technology (HJT) solar cells, low-temperature curing paste is used because the passivation layer deteriorates at high temperatures of 200℃ or higher. However, manufacturing HJT photovoltaic (PV) modules is challenging due to the weak peel strength between busbar electrodes and cells after soldering process. For this issue, the electrode thicknesses of the busbars of the HJT solar cell were analyzed, and the peel strengths between electrodes and wires were measured after soldering using an infrared (IR) lamp. As a result, the electrodes printed by the screen printing method had a difference in thickness due to screen mask. Also, as the thickness of the electrode increased, the peel strength of the wire increased.

• Solar Energy
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• v.13 no.2_3
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• pp.79-90
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• 1993

A theoretical study is conducted for the design of solar air heaters using porous material. Radiative characteristics of glazing and porous absorbing media are found through spectral transmittances measured by the Visible spectrometer and the FT-IR. Using those characteristics the efficiencies of collectors are calculated one-dimensionally with the use of the Two-Flux radiation model. The efficiencies increase, as the air flow rates or albedos in the visible range increase, and as albedos in the IR range decrease. The optimum thickness of the porous medium of 15-mesh stainless steel wire screens is 0.001m, which represents the opacity of one.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.10a
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• pp.299-302
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• 2011

Recently, Voice over Internet protocol(VoIP) in IP-based wired and wireless voice, as well as by providing multimedia information transfer. Wired and wireless VoIP is easy on illegal eavesdropping of phone calls and VoIP call control signals on the network. In addition, service misuse attacks, denial of service attacks can be targeted as compared to traditional landline phones, there are several security vulnerabilities. In this paper, VoIP equipment in order to obtain information on the IP Phone is scanning. And check the password of IP Phone, and log in successful from the administrator's page. Then after reaching the page VoIP IP Phone Administrator Settings screen, phone number, port number, certification number, is changed. In addition, IP Phones that are registered in the administrator page of the call records check and personal information is the study of hacking.

• Journal of Advanced Navigation Technology
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• v.12 no.4
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• pp.317-323
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• 2008

The technical progress of wireless communication in an information-oriented society is heading for the wireless internet service. Handphone is limited in a low capacity memory, size of screen, wireless internet. But it can do service in mobile, nontheless of the time, space. This paper says that online studying in wire internet is capable of servicing in mobile environment. The way of SMS transmission in the agency is linked in the SMS agency, but the way of SMS exclusive modem does service in linking with personal computer. This paper says that the SMS service is possible with SMS exclusive modem, mirroring of the client demand in database.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 한국전산유체공학회:학술대회논문집
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• 2011.05a
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• pp.488-493
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• 2011

The object of this study is to develope the program for analyzing the fluid flow and heat transfer of PMSM electric motor. The program will be mainly used for inexperienced users of CFD analysis. So it has to be performed using the geometry data and the heat source of each part only. Interface program for converting the given data to the instruction of pre-processor is developed. The conjugate heat transfer between a flow passage of the motor and inner parts consisting of rotor and stator is regarded. In order to reduce the computational time and memory storage, cyclic boundary condition is applied. For the numerical simulation, MRF(Multi-Reference Frame) method is used to consider rotating operation of the rotor and heat source is applied to the copper, wire, and magnetic parts in the motor. On the screen of computer, the users can show the velocity distributions and the contours such as pressure, turbulent kinetic energy, turbulent dissipation rate and temperature.

• Nuclear Engineering and Technology
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• v.38 no.1
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• pp.93-98
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• 2006

The radial uniformity of neutron irradiation in silicon ingots for neutron transmutation doping (NTD) at HANARO is examined by both calculations and measurements. HANARO has two NTD holes named NTD1 and NTD2. We have been using the NTD2 hole for 5 in. NTD commercial service, and we intend to use two holes for 6 in. NTD. The objective of this study is to predict the radial uniformity of 6 in. NTD at the two holes. The radial neutron flux distributions inside single crystal and noncrystal silicon loaded at the NTD2 hole are calculated by the VENTURE code. For NTD1, the radial distributions of the reaction rate for a 6 in. NTD with a neutron screen are calculated by MCNP, and measured by gold wire activation. The results of the measurements are compared with those of the calculations. From the VENTURE calculation, it is confirmed that the neutron flux distribution in the single crystal silicon is much flatter than that in the non-crystal silicon. The non-uniformities of the measurements for radial neutron irradiation are slightly larger than those of the calculations. However, excluding local dips in the measurements, the overall trends of the distributions are similar. The radial resistivity gradient (RRG) for a 5 in. silicon ingot is estimated to be about $1.5\%$. For a 6 in. ingot, the RRG of a silicon ingot irradiated at HANARO is predicted to be about $2.1\%$. Also, from the experimental results, we expect that the RRG would not be larger than $4.4\%$.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2001.04a
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• pp.81-81
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• 2001

초지 공정은 wire, roll, pump등의 회전체로 이루어진 공정이 거의 대부분이기 때문에 주기적으로 변동하는 성분들이 많고, QCS(Quality Control System) 및 DCS(Distributed Co n ntrol System)상에 서 의 자동 Control Logic에 의 한 불안정 (Fluctuation)요소도 내 재 되 어 있 어 이에 대한 분석이 필요하다. 이러한 주기적인 변동은 제품의 여러 물성(평량, 두께, 광택 도등) 에 영향을 미치게 되어 품질의 균일성이나 프로파일에 영향을 미치게 된다. 따라서 공정상이나 품질에서 주기적으로 변동하는 성분을 추출하여 공정 각 성분과 연관을 시키변 품질에 나타나는 주기적 성분의 요인이 어느 부분에서 기인하는 지를 직접적으로 찾아낼 수 있고 이의 개선을 통해 품질의 균일성 및 프로파일 향상을 꾀할 수 있다. 본 연구에서는 Air padded type 헤드박스 초지기에서 DAQ(Data Acquisition) System 을 이용하여 각 공정별로 MD(Machine Direction)방향으로의 변동을 측정하고 제품의 물성 변동과 비교하였다. DAQ System은 각 공정상의 전기적 신호를 높은 주파수 영역까지 다채널로 동시에 받 아 들일 수 있는 장치로 이 시스템을 활용하여 공정상의 Machine chest 농도, Stock box 유량 및 레벨, Fan pump RPM, Cleaner압력, Screen압력, H!B압력 및 레벨, Silo level등 공 정요소의 변동상태와 상호영향을 분석하였다. 이러한 공정 각 요소의 변동과 MD 방향의 제품 물성 값(Tapio, Paper Variation Analyzer에 대한 비교 분석결과 제품 평량에서 주기적인 변동성분을 확인할 수 있었고 이중 큰 비 중을 차지하는 것이 fνB 레벨 변동주기와 일치하는 것을 찾아낼 수 있었다. 이에 근거하여 D DCS system의 control 요소인 튜닝 parameter(P,I 값)들을 미 세 조정 하여 제 품의 MD방향 평량 변동 진폭을 기존 수준의 30% 수준으로 감소시킬 수 있었다. 그 결과 COV(표준편차/ 평량)값을 0.8-1.2%에서 0.6-0.8%수준으로 낮출 수 있었고 이에 따라 CD (Cross Direction) 방향의 제품 Profile도 함께 개선되는 효과를 거둘 수 있었다.

• The Journal of the Acoustical Society of Korea
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• v.37 no.2
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• pp.92-98
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• 2018

This paper is a study on the generation mechanism of propeller singing based on the cavitation tunnel test, underwater impact test, finite element analysis and computational flow analysis for the model propeller. A wire screen mesh, a propeller and a rudder were installed to simulate ship stern flow, and occurrence and disappearance of propeller singing phenomenon were measured by hydrophone and accelerometer. The natural frequencies of propeller blades were predicted through finite element analysis and verified by contact and non-contact impact tests. The flow velocity and effective angle of attack for each section of the propeller blades were calculated using RANS (Reynolds Averaged Navier-Stokes) equation-based computational fluid analysis. Using the high resolution analysis based on detached eddy simulation, the vortex shedding frequency calculation was performed. The numerical predicted vortex shedding frequency was confirmed to be consistent with the singing frequency and blade natural frequency measured by the model test.