• Title/Summary/Keyword: Width of Liquid Layer

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A Study on the Width of Liquid Layer of Ni/B/Ni Diffusion Bonding System (Ni/B/Ni 액상확산접합계의 액상폭에 관한 연구)

  • ;;Kang, C. S.
    • Journal of Welding and Joining
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    • v.13 no.4
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    • pp.147-154
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    • 1995
  • In order to study the bonding mechanism of Ni/B/Ni transient liquid phase bonding system, width of liquid layers were calculated, where in this system melting point of insert material(B) is higher than bonding temperature and melting point of base metal(Ni). Caclulated values were compared with experimental ones which were measured by bonding Ni/B/Ni system at 1433-1474K under vacuum atmosphere. As results, the width of initial liquid layer of Ni/B/Ni system was calculated as $W_{IL}$ = $W_{o}$[1 + {2.100..rho.$_{S/}$ ( $X_{3}$ + $X_{4}$)..rho.$_{Ni}$ }-.rho.$_{S/}$.rho. Ni/], and it was nearly same with experimental values. Maximum width of liquid layer, width of liquid layer during isothermal solidification and isothermal solidification time were calculated also.o.o.o.

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A Characteristic of Microstructures in Bonding Interlayer of Brazed Titanium to Copper (브레이징한 Ti/Cu 접합계면부의 미세조직 특성)

  • 김우열;정병호;이성렬
    • Journal of Welding and Joining
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    • v.13 no.3
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    • pp.106-115
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    • 1995
  • To know the bonding phenomena of Ti/Cu brazed joint, a characteristic of microstructures in bonding interlayer of vacuum brazed pure Ti to Cu has been studied in the temperature range from 1088 to 1133K for various bonding times using Ag-28wt%Cu filler metal. Also intermediate phases formed in bonded interlayer and behavior of layer growth have been investigated. The obtained results in this study are as follows: 1) Liquid insert metal width at the each brazing temperature was proportional to the square root of brazing time, and it was considered that the liquid insert metal width was controlled by the diffusion rate process of primary .alpha.-Cu formed at the Ti side. 2) Intermediate phases formed near the Ti interface were .betha.-Ti and intermetallic compounds TiCu, Ti$_{2}$Cu, Ti$_{3}$Cu, and TiCu. 3) .betha.-Ti formed in Ti base metal durig brazing transformed to lamellar structure, .alpha.-Ti + Ti$_{2}$Cu. The structure came from the eutectoil decomposition reaction in cooling. And the width of .betha.-Ti layer was proportional to the square root of brazing time, and it was considered that the growth of .betha.-Ti layer was controlled by interdiffusion rate process in .betha.-Ti. 4) The layer growth of TiCu, Ti$_{3}$Cu$_{4}$ and TiCu, phases formed near the Ti interface was linerface was linearly proportional to the brazing time, and it was considered that the layer growth of these phases was controlled by the chemical reaction rate at the interface.

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Bonding Phenomena during Transient Liquid Phase Bonding of CMSX-4, High Performance Single Crystal Superalloy (고성능 단결정 초내열합금 CMSX-4의 액상확산접합현상)

  • 김대업
    • Journal of Welding and Joining
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    • v.19 no.4
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    • pp.423-428
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    • 2001
  • The bonding phenomena of Ni base single crystal superalloy. CMSX-4 during transient liquid phase(TLP) bonding was investigated using MBF-80 insert metal. Bonding of CMSX-4 was carried out at 1,373∼1,548K for 0∼19.6ks in vacuum. The (001) orientation of each test specimen was aligned perpendicular to the bonding interface. The dissolution width of base metal was increased when the bonding temperature and holding time were increased. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process. Borides were formed in the bonded layer during TLP bonding operation. The solid phase grew epitaxially into the liquid phase from substrates and single crystallization could be readily achieved during the isothermal solidification.

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YBa$_2$Cu$_3$O$_{7-x}$films fabricated on IBAD templates by MOCVD process (MOCVD 공정으로 IBAD 템플릿 위에 제조된 YBa$_2$Cu$_3$O$_{7-x}$ 박막)

  • Jun Byung-Hyuk;Choi Jun-Kyu;Kim Ho-Jin;Kim Chan-Joong
    • Progress in Superconductivity and Cryogenics
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    • v.6 no.3
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    • pp.21-26
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    • 2004
  • Deposition condition of YBa$_2$Cu$_3$$O_{7-x}$ (YBCO) films on moving IBAD templates (CeO$_2$/IBAD-YSZ/SS) was studied in a hot-wall type metal organic chemical vapor deposition (MOCVD) process using single liquid source. The reel velocity was 40 cm/hr and the source mole ratios of Y(tmhd)$_3$:Ba(tmhd)$_2$:Cu(tmhd)$_2$ were 1:2.3:3.1 and 1:2.1:2,9, Two different types of IBAD templates with thin CeO$_2$ and thick CeO$_2$ layers were used, The YBCO films were successfully deposited at the deposition temperatures of 780~89$0^{\circ}C$ ; the a-axis growth was observed together with the c-axis growth up to 83$0^{\circ}C$. while the c-axis growth became dominant above 83$0^{\circ}C$. The top surface of the c-axis film was fairly dense and included a small amount of the a-axis growth, although the peaks of the a-axis grains were not observed in XRD pattern, The YBCO film deposited on IBAD template with thin CeO$_2$ layer showed low critical current of 2.5 A/cm-width. while the YBCO film deposited on IBAD template with thick CeO$_2$ layer showed higher critical current of 50 A/cm-width. This result indicates that thick CeO$_2$ layer is thermally more stable than thin CeO$_2$ layer at the high deposition temperature of the MOCVD process.s.

Tape-Type Liquid Leakage Film Sensor (액체누설 감지용 테이프형 필름센서)

  • Yu, D.K.;Kim, K.S.;Yub, H.K.;Han, G.H.;Jin, D.J.;Kim, J.H.;Han, S.H.;Cho, G.S.
    • Journal of the Korean Vacuum Society
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    • v.20 no.2
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    • pp.146-154
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    • 2011
  • The adhesive-tape of a liquid leak film sensor including the alarm system is developed. The sensing film is composed of three layers such as base film layer, conductive line layer, and protection film layer. The thickness of film is 300~500 um, the width is 3.55 cm, and the unit length is 200 m. On the conductive line layer, three conducting lines and one resistive line are formulated by the electronic printing method with a conducting ink of silver-nano size. When a liquid leaks for the electricity to be conducted between the conductive line and the resistive line, the position of leakage is monitored by measuring the voltage varied according to the change of resistance between two lines. The error range of sensing position of 200 m film sensor is ${\pm}1m$.

Cure Properties in Photopolymer for Stereolithography according to Variance of Laser Beam Size (레이저빔 크기변화에 따른 광조형수지의 경화특성)

  • 이은덕;심재형;백인환
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.2
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    • pp.76-84
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    • 2003
  • Stereolithography is the technique using a laser beam to cure a liquid resin, a photopolymer, with three dimensional computer-aided design (CAD) data. The build parameters of stereolithography such as beam size, scan velocity. hatch spacing, layer thickness and etc. are determined by the accuracy of prototype, the build time and the cured properties of the resin. In particular, beam size is important processing parameter fur the other parameters. Therefore, this study observed the cured property to beam size. For this purpose, according to hatch spacing and beam size, the cure width and depth were measured on single cured line. Also, the cure width and depth were measured at single cured layer As a result of experiments. cure depth which varied from 0.23mm to 0.34mm was directly proportioned to beam radius. on the other hand, cure width which varied from 0.42mm to 1.07mm was inversely proportioned to beam radius. Surface roughness varied from 1.12 to 2.23 m for the ratio of hatch spacing to beam radius.

Effect of the Laser Beam Size on the Cure Properties of a Photopolymer in Stereolithography

  • Sim, Jae-Hyung;Lee, Eun-Dok;Kweon, Hyeog-Jun
    • International Journal of Precision Engineering and Manufacturing
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    • v.8 no.4
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    • pp.50-55
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    • 2007
  • Stereolithography (SLA) is a technique using a laser beam to cure a photopolymer liquid resin with three-dimensional computer-aided design (CAD) data, The accuracy of the prototype, the build time, and the cured properties of the resins are controlled by the SLA process parameters such as the size of the laser beam, scan velocity, hatch spacing, and layer thickness, In particular, the size of the laser beam is the most important parameter in SLA, This study investigated the curing properties of photopolymers as a function of the laser beam size, The cure width and depth were measured either on a single cure line or at a single cure layer for various hatch spacings and laser beam sizes, The cure depth ranged from 0.23 to 0.34 mm and was directly proportional to the beam radius, whereas the cure width ranged from 0.42 to 1.07 mm and was inversely proportional to the beam radius, The resulting surface roughness ranged from 1.12 to $2.23{\mu}m$ for a ratio of hatch spacing to beam radius in the range 0.5-2.0 at a beam radius of 0.17 mm and a scan velocity of 125 mm/sec.

Photoreflectance of A $I_x$Ga${1-x}$As(x.<=.0.15) grown by liquid-phase epitaxy (Liquid-phase epitaxy로 성장시킨 A $I_x$Ga${1-x}$As(x.<=.0.15)의 photoreflectance)

  • 배인호;김인수;이철욱;최현태;김말문;김상기
    • Electrical & Electronic Materials
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    • v.7 no.4
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    • pp.300-305
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    • 1994
  • We determined the alloy composition of the liquid-phase epitaxy(LPE) grown $Al_{x}$G $a_{1-x}$ As by the photoreflectance(PR), and observed the variation of PR signal by changing the condition of annealing and thickness of epilayer. As the measuring temperature was decreased, the broadening parameter was decreased, and the amplitude of PR signal was increased. When the temperature of annealing was increased, the surface carrier concentration was decreased and then the shape and amplitude of PR signal were affected by the surface electric field. The structure change was observed when the specimen was annealed for long time at a high temperature. We found that the surface electric field increased when the thickness of epilayer was decreased by etching, because the band bending was increased by the decreased of the width of depletion layer....

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The Evaluation Technique of Surface Region using Backward-Radiated Ultrasound (후방 복사된 초음파를 이용한 표면 지역의 평가 기술)

  • Kwon, S.D.
    • Journal of the Korean Society for Nondestructive Testing
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    • v.16 no.4
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    • pp.241-250
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    • 1997
  • The velocity dispersion of surface acoustical wave(SAW) of Si layer/mesh Au/Si substrate was measured by the frequency analysis technique of backward radiation at liquid/solid interface. The difference of backward radiation patterns depending on used transducers (2, 5, 10MHz) confirmed that the backward radiation phenomenon was caused by the energy radiation from SAW generated in surface region. An ultrasonic goniometer was constructed to measure continuously the angular dependence of backscattered intensity. The angular dependences of backward radiation(5MHz) were measured for Ni layer/Al substrate specimens that were bonded by epoxy involving different content of Cu powder. It was known that the width and pattern of backward radiation had informations such as the velocity dispersion, bonding quality and structure of surface region.

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Evaluation on the Applicability of Refractory Coatings to Metal Mold for Cast Iron (주철금형주조용 도형재의 적용성 평가)

  • Seo, Kum-Hee;Kim, Ki-Young;Moon, Byung-Moon
    • Journal of Korea Foundry Society
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    • v.32 no.3
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    • pp.144-149
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    • 2012
  • A series of refractory mold coatings were applied to cast iron specimens, and their resistances to wear and spalling were investigated. Tests were carried out with own made measures, and also a calculation was tried for the comparison of a part of results like spalling. Worn width by scrubbing the indenter on the coating layer increased significantly at high temperature. Temperature increasing rate across the specimen when the coating side was exposed to $1000^{\circ}C$ was in the range of $14.5{\sim}75.8^{\circ}C$/sec mm, and specimens with thicker coating layer showed lower temperature increase. Severe spalling of coated layer was observed after heating the specimen, and it was able to confirm by calculation using a commercial code.