• Development and Reproduction
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• v.17 no.4
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• pp.389-397
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• 2013

FGF9/16/20 signaling pathway specify the developmental fates of notochord, mesenchyme, and neural cells in ascidian embryos. Although a conserved Ras/MEK/Erk/Ets pathway is known to be involved in this signaling, the detailed mechanisms of regulation of FGF signaling pathway have remained largely elusive. In this study, we have isolated Hr-Erf, an ascidian orthologue of vertebrate Erf, to elucidate interactions of transcription factors involved in FGF signaling of the ascidian embryo. The Hr-Erf cDNA encompassed 3110 nucleotides including sequence encoded a predicted polypeptide of 760 amino acids. The polypeptide had the Ets DNA-binding domain in its N-terminal region. In adult animals, Hr-Erf mRNA was predominantly detected in muscle, and at lower levels in ganglion, gills, gonad, hepatopancreas, and stomach by quantitative real-time PCR (QPCR) method. During embryogenesis, Hr-Erf mRNA was detected from eggs to early developmental stage embryos, whereas the transcript levels were decreased after neurula stage. Similar to the QPCR results, maternal transcripts of Hr-Erf was detected in the fertilized eggs by whole-mount in situ hybridization. Maternal mRNA of Hr-Erf was gradually lost from the neurula stage. Zygotic expression of Hr-Erf started in most blastomeres at the 8-cell stage. At gastrula stage, Hr-Erf was specifically expressed in the precursor cells of brain and mesenchyme. When MEK inhibitor was treated, embryos resulted in loss of Hr-Erf expression in mesenchyme cells, and in excess of Hr-Erf in a-line neural cells. These results suggest that zygotic Hr-Erf products are involved in specification of mesenchyme and neural cells.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.5269-5279
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• 2014

The cause of defects in the PCB SMT assembly is mostly solder paste deposits. Conventional inspection methods for solder paste deposits suffer from slow speed, low reliability and high cost. Therefore, this paper proposes a method for calculating the height and region of solder paste on PCB using the 3D profiles without measuring the 2D image. The solder paste region is detected by the phase difference in the measurement points and the average phase on the whole surface of PCB. The high reliable height of the solder paste region is computed by the average of the measurement points' phase with repeatability and reliability. The experimental results revealed improvements of 17% in inspection time and 29% repeatability in the height calculation of the solder paste region, resulting in a high speed and less expensive system.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.3
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• pp.41-50
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• 2009

The flash memory has many advantages such as low power consumption, strong shock resistance, fast I/O and non-volatility. And it is increasingly used in the mobile storage device. Many researchers are studying the YAFFS, NAND flash file system, which is widely used in the embedded device. However, the existing YAFFS has two problems. First, it takes long time to mount the YAFFS file system because it scans whole spare areas in all pages. Second, the cleaning policy of the YAFFS does not consider the wear-leveling so that it cannot guarantee the duration of data completely. In order to solve these problems, this paper proposes a new content-based YAFFS that consists of a mounting time reduction technique and a content-cleaning policy by using content-based block management. The proposed method only scans partial spare areas of some special pages and provides the block swapping which enables the wear-leveling of data blocks. We performed experiments to compare the performance of the proposed method with those of the JFFS2 system and YAFFS system. Experimental results show that the proposed method reduces the average mounting time by 82.2% comparing with JFFS2 and 42.9% comparing with YAFFS. Besides, it increases the life time of the flash memory by 35% comparing with the existing YAFFS whereas no overheat is added.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.29 no.1
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• pp.84-91
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• 1996

Heat flux of the East China Sea was estimated with the bulk method, the East China mount based on the marine meteorological data and cloud amount data observed by a satellite. Solar radiation is maximum in May and minimum in December. Its amount decreases gradually southward during the winter half year (from October to March), and increases northward during the summer half year (from April to September) due to the influence of Changma (Baiu) front. The spatial difference of long-wave radiation is relatively small, but its temporal difference is quite large, i.e., the value in February is about two times greater than that in July. The spatial patterns of sensible and latent heat fluxes reflect well the effect of current distribution in this region. The heat loss from the ocean surface is more than $830Wm^{-2}$ in winter, which is five times greater than the net radiation amount during the same period, The annual net heat flux is negative, which means heat loss from the sea surface, in the whole region over the East China Sea. The region with the largest loss of more than $400Wm^{-2}$ in January is observed over the southwestern Kyushu. The annual mean value of solar radiation, long-wave radiation, sensible and latent heat fluxes are estimated $187Wm^{-2},\;-52Wm^{-2},\;-30Wm^{-2}\;and\;-137Wm^{-2}$, respectively, consequently the East China Sea losses the energy of $32Wm^{-2}(2.48\times10^{13}W)$. Through the heat exchange between the air and the sea, the heat energy of $0.4\times10^{13}W$ is supplied from the air to the sea in A region (the Yellow Sea), $2.1\times10^{13}W$ in B region (the East China Sea) and $1.7\times10^{13}W$ in C region (the Kuroshio part), respectively.