• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.980-986
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated

• 대한기계학회논문집A
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• 제21권9호
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• pp.1531-1540
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• 1997

Mordern industrial society pursues unmanned system and automation of manufacturing process. Abreast with this tendensy, production of goods which requires advanced accuracy is increasing as well. According to this, the work sensing time of dressing by monitoring and diagnosing the condition of grinding, which is th representative way in accurate manufacturing, is an important work to prevent serious damages which affect grinding process or products by wearing grinding wheel. Computer vision system was composed, so that grinding wheel surface was acquired by CCD camera and the change of cutting edge ratio was measured. Then we used automatic thresholding technique from histogram as a way of dividing grinding cutting edge from grinding surface. As a result, we are trying to approach unmanned system and automation by deciding more accurate time of dressing and by visualizing behavior of grinding wheel by making use of computer vision.

• 대한기계학회논문집A
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• 제21권3호
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• pp.430-438
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• 1997

Deburring and edge finishing technology as the final process of machining operation is required for manufacturing of advanced precise conponents. But, deburring is considered as a difficult problem on going to the high efficient production and automation in the FMS. Removal of burr couldn't have a standard of its definition because of its various shapes, dimensions and properties and mostly depends on manual treatment. Especially, deburring for cross hole inside is very difficult owing to its shape passing through out perpendicular to a main hole. The electrochemical method is suggested as its solution in practical aspect. Therefore, electrochemical deburring technology needs to be developed for the high efficiency and automation of internal deburring in the cross hole. In this study, the new process in the eliminating burr inside cross hole, electrochemical deburring by the wheel electroplated with Cubic-Boron-Nitrade abrasives, is suggested. Its deburring mechanism is described and machining performances is investigated. Also, CBN electroplated wheel is designed and manufactured and then characteristics of electrochemical deburring are investigated through experiments. Overall electrochemical deburring performance against burr inside cross hole is examined in the various power sources such as peak current and direct current.

• 한국기계가공학회지
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• 제17권1호
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• pp.1-7
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• 2018

We aimed to develop a high quality 3.5 ton class swing reducer by studying the efficiency improvement of the reducer through the optimum design and performance evaluation of the assembled, high efficiency, lightweight 3.5 ton swing reducer. Based on the optimal design of the worm and worm wheel, the optimal manufacturing method of the worm wheel, the optimized casing design, and the optimum design of the output pinion, Respectively. Therefore, in this paper, to improve the efficiency of the worm gear reducer system, we will develop the manufacturing technology and verify the mass production by combining the manufacturing process design, processing and assembling technology according to the optimization design. We have conducted research to realize mass production by product verification such as product efficiency, reliability and durability according to optimal design of worm gear reducer.

• Advances in environmental research
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• 제2권1호
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• pp.1-8
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• 2013

There is a significant demand to make various dissolved gases in water. However, the conventional aeration method shows low gas mass transfer rate and gas utilization efficiency. In this study, a novel rotating wheel entraining gas method was developed for making high dissolved $O_2$ and $O_3$ in water. It produced higher concentration and higher transfer rate of dissolved $O_2$ and $O_3$ than conventional bubble aeration method, especially almost 100% of gas transfer efficiency was achieved for $O_3$ in enclosed reactor. For application of rotating wheel entraining gas method, aerobic bio-reactor and membrane bio-reactor (MBR) were successfully used for treatment of domestic and pharmaceutical wastewater, respectively; and vacuum ultraviolet $(VUV)/UV+O_3/O_2$ reactors were well used for sterilization in air/water, removal of dust particles and toxic gases in air, and degradation of pesticide residue and sterilization on fruits and vegetables.

• 한국생산제조학회지
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• 제9권2호
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• pp.138-143
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• 2000

The establishment of a practical ultra-precision grinding technique using Diamond and CBN wheels is one of the major key technolo-gies to improve production techniques for machine-to-difficult materials without finishing process such as lapping and polishing. But the special efficient dressing technique for ultra-fine grit type grinding wheels to stabilize the grinding ability was not developed. Recently electrolytic in-process dressing technique is proposed to ultra-fine grit type metal bonded diamond wheels to protrude abra-sives continuously from the tool surface. This technology can be widely used to surface grinding and cylindrical grinding but cannot be used efficiently to internal grinding because of the electrode attachment trouble. This paper describes the effect of interval type electrolytic dressing as proposed newly to cast iron bonded diamond wheel for efficient internal grinding with mirror type high quality ground surface.

• 한국기계가공학회지
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• 제11권2호
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• pp.171-176
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• 2012

So far, carbide insert production technology was carried out using a diamond grinding wheel. This production technology has problem that raise production costs and decrease in productivity. The SIDE PRESS method to solve this problem have been developed. In this paper, the machining characteristics of lateral chip breaker turning inserts produced by the SIDE PRESS method was studied. The cutting force and the resulting surface roughness were measured at various cutting conditions. The experimental results indicate that the chip breaker inserts of three-dimensional geometry is the best cutting performance.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• 한국기계가공학회지
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• 제7권2호
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• pp.45-51
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• 2008

The objective of this study is to develop an automatic object changer unit to improve processing problems existed in the conventional horizontal machining center. In order to perform this objective, a upward and downward traverse unit in which a unit that consists of a motor and reducer, chain and sprocket wheel, and upper and lower base employed in an automatic object changer unit performs sliding contact motion in a frame was designed. To achieve this design, constraint conditions for the upward and downward traverse unit first designed. Then, an operation mechanism was designed and that was introduced as a sum of kinetic energy for the sprocket wheel and upper and lower base based on the moment of inertia, which is the kinetic energy of the converted upward and downward traverse unit in the side of the reducer. In addition, The work required to rotate the converted upward and downward traverse unit in the side of the reducer by one revolution can be calculated using the sum of work that is required in the sprocket wheel and upper and lower base that is a part of the upward and downward traverse unit. Furthermore, the converted equation of motion in the side of the motor can be introduced using the equation of motion using the converted upward and downward traverse unit in the side of the motor. Then, Then, a proper motor can be determined using predetermined specifications employed in the motor and several parameters in the upward and downward traverse unit in order to verify such predetermined specifications. Also, a design of a horizontal traverse unit that performs sliding motion on a upward and downward traverse unit and simulation that verifies the results of this design are required as a future study.

• 한국정밀공학회지
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• 제21권10호
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.