• The Korean Journal of Mycology
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• v.2 no.1
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• pp.7-14
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• 1974

These experiments were conducted to learn the antibiosis of microfloral organisms in the casing soil to Mycogone perniciosa, and interactions between M. perniciosa and Agaricus bisporus. The results obtained were as follows: 1. In vitro tests, the development of M. perniciosa was suppressed from the unidentified microfloral organisms in the casing soil. All the infected sporophores of A. bisporus occurred within an area applied with spore suspension of M. perniciosa as spot treatment and no infected ones in the area around the spot treated under cropping conditions. 2. In vitro tests, although the antagonistic relationship between M. perniciosa and A. bisporus was somewhat different in varying the kind of media, A. bisporus ultimately overgrew the colony of M. perniciosa. When spore inoculation of M. perniciosa was applied on the surface of grain spawn of A. bisporus and the mid layer of casing soil under cropping conditions, no infected sporophores were produced, whereas the infected sporophores were only produced on casing soil inoculated on the surface of casing soil with spore suspension.

• Journal of the Korean Recycled Construction Resources Institute
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• v.5 no.4
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• pp.375-381
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• 2017

Recently, due to the increasing of interest about the eco-friendly concrete, it is being increased to use concretes containing by-products of industry such as fly ash, ground granulated blast furnace slag, silica fume, and etc. Especially, these are well known for improving the resistance to reinforcement corrosion in concrete and decreasing chloride ion penetration. The purpose of this experimental research is to evaluate the resistance to corrosion of reinforcement and critical chloride content of high volume fly ash concrete(HVFAC) which is replaced with fly ash for approximately 50% cement content. For this purpose, corrosion monitoring of reinforcement by half cell potential method was carried out for the cylindrical test specimens that the upper of reinforcement in concrete was exposed to detect the time of corrosion initiation for reinforcement. It was observed from the test result that the the time of corrosion initiation for reinforcement of HVFAC by the accelerated corrosion tests increased 1.2~1.3 times than plain concrete and the critical chloride contents of plain concrete and HVFAC were found to range $0.80{\sim}1.20kg/m^3$, $0.89{\sim}1.60kg/m^3$, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.75-81
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• 2017

The effects of KOH pretreatment and annealing conditions on the interfacial adhesion and the reliability between epoxy resin and polyimide substrate in the flexible printed circuit board were quantitatively evaluated using $180^{\circ}$ peel test. The initial peel strength of the polyimide without the KOH treatment was 29.4 g/mm and decreased to 10.5 g/mm after 100hrs at $85^{\circ}C/85%$ R.H. temperature/humidity treatment. In case of the polyimide with annealing after KOH treatment, initial peel strength was 29.6 g/mm and then maintained around 27.5 g/mm after $85^{\circ}C/85%$ R.H. temperature/humidity treatment. Systematic X-ray photoelectron spectroscopy analysis results showed that the peel strength after optimum annealing after KOH treatment was maintained high not only due to effective recovery of the polyimide damage by the polyimide surface treatment process, but also effective removal of metallic ions and impurities during various wet process.

• Korean Journal of Soil Science and Fertilizer
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• v.41 no.4
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• pp.239-246
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• 2008

This research tried to find out the optimum fabrication method of calcined clay granules comprising zeolite. Kaolin clay and natural zeolite powder were used as raw materials of calcined clay, and silica stone powder was used for controlling the porosity of the granules. The granulation was performed with two kinds of granulators: a pan granulator and a high-shear mixer granulator. Various granules were fabricated by the mixing ratios and the rotation speeds of the granulators, and were heated from 400 to $700^{\circ}C$ at $100^{\circ}C$ interval. The crushing strength, pore size distribution, and CEC of the granules were measured. The evaluation method for the resistance of granules to human treading was created and the tests were conducted at dry and wet conditions. The resistance and crushing strength improved in proportion to the rotation speed of the granulator and the heating temperature, but the CEC decreased. The pellet made by the pan granulator did not have the strength against treading upon heating to below $700^{\circ}C$, but the pellet made by the high-shear mixer granulator endured the treading test upon heating to over $500^{\circ}C$

• Toxicological Research
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• v.29 no.4
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• pp.263-278
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• 2013

The silkworm extract powder contain 1-deoxynojirimycin (DNJ), a potent ${\alpha}$-glycosidase inhibitor, has therapeutic potency against diabetes mellitus. Therefore, natural products containing DNJ from mulberry leaves and silkworm are consumed as health functional food. The present study was performed to evaluate the safety of the silkworm extract powder, a health food which containing the DNJ. The repeated toxicity studies and gentic toxicity studies of the silkworm extract powder were performed to obtain the data for new functional food approval in MFDS. The safety was evaluated by a single-dose oral toxicity study and a 90 day repeated-dose oral toxicity study in Sprague-Dawley rats. The silkworm extract powder was also evaluated for its mutagenic potential in a battery of genetic toxicity test: in vitro bacterial reverse mutation assay, in vitro chromosomal aberration test, and in vivo mouse bone marrow micronucleus assay. The results of the genetic toxicology assays were negative in all of the assays. The approximate lethal dose in single oral dose toxicity study was considered to be higher than 5000 mg/kg in rats. In the 90 day study, the dose levels were wet at 0, 500, 1000, 2000 mg/kg/day, and 10 animals/sex/dose were treated with oral gavage. The parameters that were monitored were clinical signs, body weights, food and water consumptions, ophthalmic examination, urinalysis, hematology, serum biochemistry, necropsy findings, organ weights, and histopathological examination. No adverse effects were observed after the 90 day administration of the silkworm extract powder. The No-Observed-Adverse-Effect-Level (NOAEL) of silkworm extract powder in the 90 day study was 2000 mg/kg/day in both sexes, and no target organ was identified.

• Journal of the Korean Wood Science and Technology
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• v.36 no.4
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• pp.37-43
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• 2008

The research attempted to develop an eco-friendly wood adhesive based on vegetable oil (soybean oil), the renewable and sustainable natural resources, using ozonification technology for the chemical structure modification. The soybean oils (SBO) were reacted with $O_3$ at the rate of 7.13 g/h for different times, 15 minutes, 30 minutes, 60 minutes, and 120 minutes. Modified chemical structure of the ozonized SBOs were examined by Fourier transform Infrared (FT-IR) spectrum. The FT-IR spectrum of SBO had an absorbance peak at $3010cm^{-1}$ that is the characteristic peak of the unsaturated double bonds. As ozone treatment time increased, the peak of the double bond was disappeared and aldehyde or carboxyl peak appeared at $1700cm^{-1}$. The dry, wet, and cyclic boiling bond strengths of the ozonized SBO mixed with polymeric diphenylmethane-4, 4-diisocyanate (pMDI) were also investigated. In the dry shear test, all strengths met constantly the standard requirement of $7.0kgf/cm^2$ (KS F3101 2006). The bond strengths gradually increased with increasing ozone treatment time. The highest strength showed at 60 minutes ozone treatment and decreased values at 120 minutes. In the cyclic boiling shear test, 30, 60 and 120 minutes exceeded the standard requirement.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2001.04a
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• pp.80-80
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• 2001

제지 공정의 효율적인 운영을 위한 수단으로 보류 및 탈수성의 분석은 매우 중요한 작 업 이 다. 보류 및 탈수 특성 을 평 가하기 위 하여 SR(Shopper-Riegler), CSF(Canadian S Standard Freeness tester) 그리고 원형 수초지기 등의 비난류 상태의 자연탈수 특성 평가 장치와 동적 조건의 감압식 탈수성 분석기 등이 사용되고 있다. 하지만 이것들은 제지 공정 에 보다 더 근접한 탈수 및 보류 특성을 평가하기에는 부족한 점이 있다. 특히 wet-end 첨 가제들의 효능을 보다 정확히 분석하는 것이 불가능하다. 이런 이유로 난류 발생과 감압 탈 수 둥을 유도한 탈수 특성 평가 장치 개발의 필요성이 커지고 있다. R RDA - HSF(Retention Drainage Analyzer- Handsheet Former)는 지료조성, 감압탈수 및 습지의 성형이 자동화되어 보류도와 탈수성, 종이지합 및 강도를 종합 평가 할 수 있는 새 로운 실험실용 초지기이다. 보다 현장에 가까운 초지 조건을 구현하기 위해서 지료의 농도 를 높이고 진공 탈수를 실시함에 따라 기존의 탈수성 분석기나 보류도 측정기의 단점을 보 완하게 되 었다. 본 연 구에 서 는 Canadian Standard Freeness test와 Dynamic Drainage Jar test 및 원 형 수초지기를 활용한 기존의 탈수성, 보류도 분석 결과와 RDA-HSF를 비교하여, 자연 탈수를 이용하는 기존의 탈수 및 보류 설비에 비해 현장 공정을 보다 현실적으로 재현할 수 있는 감압 탈수 초지 설비로서 RDA-HSF의 활용 가능성을 분석하였다. RDA-HSF를 활용한 실험실적 분석을 통해 현장의 상황올 유사하게 재현함에 따라 공정 운영 인자의 변화에 따른 제품의 품질 및 생산효율을 예측할 수 있게 된 바, 보다 효율적 인 공정 관리가 가능할 것으로 기대된다. 안료 입자의 경우 피인쇄체의 표면 공극을 채우고, 비히클의 경우 미세한 공극속으로 침투되어 경화됨으로써 피인쇄체가 지니고 있는 공극량을 감소시커 게 될 것이다. 그리고 피인쇄체의 각종 형태의 공극으로 침투된 잉크의 양에 반비례적으로 피인쇄체의 표변에 잉크가 잔류하게 될 것이다. 따라서 본 연구에서는 여러가지 안료를 사용하여 각각 다른 공극 특성을 지니는 도공지를 제조한 후 이들이 가지는 공극 특성과 잉크의 잔류 거동에 대해 고찰해 보고자 하였다.여 표면 유효층 일부만 오버레이시키며I 주조 및 단조가 불가능한 재료까지도 표면부에 오버레이 시킴으로 서 부품 및 설비의 제조에 있어 재료비의 절감과 제품의 수명이 획기적으로 개선될 수 있다. 그리고 최근에는 도금 빛 용사 둥과 같은 표면처리를 할 경우임의 소재 표면에 도금 및 용 사에 용이한 재료를 오버레이용접시킨 후 표면처리를 함으로써 보다 고품질의 표면층을 얻기위한 시도가 이루어지고 있다. 따라서 국내, 외의 오버레이 용접기술의 적용현황 및 대표적인 적용사례, 오버레이 용접기술 및 용접재료의 개발현황 둥을 중심으로 살펴봄으로서 아직 국내에서는 널리 알려지지 않은 본 기 술의 활용을 넓이고자 한다. within minimum time from beginning of the shutdown.및 12.36%, $101{\sim}200$일의 경우 12.78% 및 12.44%, 201일 이상의 경우 13.17% 및 11.30%로 201일 이상의 유기의 경우에만 대조구와 삭제 구간에 유의적인(p<0.05) 차이를 나타내었다.는 담수(淡水)에서 10%o의 해수(海水)로 이주된지 14일(日) 이후에 신장(腎臟)에서 수축된 것으로 나타났다. 30%o의 해수(海水)에 적응(適應)된 틸라피아의 평균 신사구체(腎絲球體)의 면적은 담수(淡水)에 적응된 개체의 면적보다 유의성있게 나타났다. 해수(海水)에 적응(適應

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Korean Journal of Materials Research
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• v.16 no.4
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• pp.225-230
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• 2006

Nanoimprint lithography (NIL) is a novel method of fabricating nanometer scale patterns. It is a simple process with low cost, high throughput and resolution. NIL creates patterns by mechanical deformation of an imprint resist and physical contact process. The imprint resist is typically a monomer or polymer formulation that is cured by heat or UV light during the imprinting process. Stiction between the resist and the stamp is resulted from this physical contact process. Stiction issue is more important in the stamps including narrow pattern size and wide area. Therefore, the antistiction layer coating is very effective to prevent this problem and ensure successful NIL. In this paper, an antistiction layer was deposited and characterized by PECVD (plasma enhanced chemical vapor deposition) method for metal stamps. Deposition rates of an antistiction layer on Si and Ni substrates were in proportion to deposited time and 3.4 nm/min and 2.5 nm/min, respectively. A 50 nm thick antistiction layer showed 90% relative transmittance at 365 nm wavelength. Contact angle result showed good hydrophobicity over 105 degree. $CF_2$ and $CF_3$ peaks were founded in ATR-FTIR analysis. The thicknesses and the contact angle of a 50 nm thick antistiction film were slightly changed during chemical resistance test using acetone and sulfuric acid. To evaluate the deposited antistiction layer, a 50 nm thick film was coated on a stainless steel stamp made by wet etching process. A PMMA substrate was successfully imprinting without pattern degradations by the stainless steel stamp with an antistiction layer. The test result shows that antistiction layer coating is very effective for NIL.

• The Journal of Engineering Geology
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• v.15 no.1
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• pp.41-55
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• 2005

This research is aimed at investigating the ground characterization of the Cheongju granite area using the geophysical methods. Test site was chosen from the building site in Chungbuk University, Chongju, Chungbuk province. Furthermore, geophysical methods are employed on the outcrops in the east to map the distribution of fault and intrusion and reveal the degree of weathering. The subsurface structure mapped from seismic re-fraction survey mainly consists of two units of weathered soil and rock. Threshold of the units were determined on the basis of seismic velocity of 800 m/s, supported from the standard classification table. From the results of standard penetrating test(SPT), these units are found to show medium-high and high density, respectively. Weathering soil is subdivided in unsaturated layer and saturated layer with thresholds of seismic velocity (500 m/s) and resistivity (200 ohm-m). In particular, unsaturated layer is again classified into dry and wet portions using the GPR section. The boundary between unsaturated and saturated weathering soils corresponds to the groundwater table at depth of approximately 5～6.2 m, which is well correlated with the one from drill-core data. However, bedrock is not delineated by geophysical methods. In the GPR section, fault and intrusion observed on the outcrop are revealed not to extend to the building site. With respect to weathering degree, the outcrop characterized by low resistivity and velocity corresponds to the grade of 'completely weathered' from the geotechnical investigations.