• Title/Summary/Keyword: Wet processes

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Estimating Temporal and Spatial Variation of Sediment Transport Processes using a Distributed Catchment Model (분포형 유역모델을 이용한 유사 운반과정의 시·공간적 변동 해석)

  • Koo, Bhon K.;Cho, Jae-Heon
    • Journal of Korean Society on Water Environment
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    • v.23 no.6
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    • pp.872-880
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    • 2007
  • For effective management of sediment-related diffuse pollution, it is of utmost importance to estimate spatial variation of sediment transport processes within a catchment. A mathematical model can play a critical role in estimating sediment transport processes at the catchment scale provided that the model structure is appropriate for representing major sediment transport processes of the catchment of interest. This paper introduces a distributed catchment model River Basin Water Quality Simulator (RBWQS) and presents some results of its application to a small rural catchment in Korea. The model has been calibrated and validated for a wet period using hourly hydrographs and sediment concentrations observed at the catchment outlet. Based on the model simulation results, the spatial variation of sediment transport processes across the catchment and the effects of paddy fields and small reservoirs on hydrology and sediment transport have been analyzed at the catchment scale.

Fabrication Processes of Interconnection Systems for Bare Chip Burn-In Tests Using Epitaxial Layer Growth and Etching Techniques of Silicon (실리콘 에피층 성장과 실리콘 에칭기술을 이용한 Bare Chip Burn-In 테스트용 인터컨넥션 시스템의 제조공정)

  • 권오경;김준배
    • Journal of the Korean institute of surface engineering
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    • v.28 no.3
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    • pp.174-181
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    • 1995
  • Multilayered silicon cantilever beams as interconnection systems for bare chip burn-in socket applications have been designed, fabricated and characterized. Fabrication processes of the beam are employing standard semiconductor processes such as thin film processes and epitaxial layer growth and silicon wet etching techniques. We investigated silicon etch rate in 1-3-10 etchant as functions of doping concentration, surface mechanical stress and crystal defects. The experimental results indicate that silicon etch rate in 1-3-10 etchant is strong functions of doping concentration and crystal defect density rather than surface mechanical stress. We suggested the new fabrication processes of multilayered silicon cantilever beams.

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Manufacturing SiNx Extreme Ultraviolet Pellicle with HF Wet Etching Process (HF 습식 식각을 이용한 극자외선 노광 기술용 SiNx)

  • Kim, Ji Eun;Kim, Jung Hwan;Hong, Seongchul;Cho, HanKu;Ahn, Jinho
    • Journal of the Semiconductor & Display Technology
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    • v.14 no.3
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    • pp.7-11
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    • 2015
  • In order to protect the patterned mask from contamination during lithography process, pellicle has become a critical component for Extreme Ultraviolet (EUV) lithography technology. According to EUV pellicle requirements, the pellicle should have high EUV transmittance and robust mechanical property. In this study, silicon nitride, which is well-known for its remarkable mechanical property, was used as a pellicle membrane material to achieve high EUV transmittance. Since long silicon wet etching process time aggravates notching effect causing stress concentration on the edge or corner of etched structure, the remaining membrane is prone to fracture at the end of etch process. To overcome this notching effect and attain high transmittance, we began preparing a rather thick (200 nm) $SiN_x$ membrane which can be stably manufactured and was thinned into 43 nm thickness with HF wet etching process. The measured EUV transmittance shows similar values to the simulated result. Therefore, the result shows possibilities of HF thinning processes for $SiN_x$ EUV pellicle fabrication.

Preparation and Properties of Ni-Zn Ferrite by Coprecipitation Method (공침법에 의한 Ni-Zn Ferrite의 제조 및 물성연구)

  • Jung Goo Eun;Koh Jae Gui
    • Korean Journal of Materials Research
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    • v.14 no.5
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    • pp.338-342
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    • 2004
  • Ni-Zn ferrite powder was obtained by wet method that was to be coprecipitated the metal nitrates, Fe($NO_3$)$_3$$9H_2$O, Ni($NO_3$)$_2$$6H_2$O, Zn($NO_3$)$_2$$6H_2$O to make a high permeability material. The composition of the ferrite powder was $Fe_2$$O_3$ 52 mol%, NiO 14.4 mol%, ZnO 33.6 mol%. Ni-Zn ferrite powder was compounded by precipitating metal nitrates with NaOH in vessel at the synthetic temperature of $90^{\circ}C$ for 8 hours. Calcination temperature and sintering temperature were $700^{\circ}C$ and $1150^{\circ}C$$1250^{\circ}C$, respectively, for 2 hours. And the other ferrite powder was also prepared by the wet ball milling that was to be mixed the metal oxides as same as the above chemical composition. We studied the properties of the powder and the electromagnetic characteristics of the sintered cores obtained from there two different processes. Wet direct process produced smaller particle size with narrower distribution of the size and more purified ferrite whose sintered cores had high permeability and high magnetization.

A Study of $SrTiO_3$ Synthesis by Direct Wet Process ($SrTiO_3$의 습식 직접 합성법)

  • 이종근;이경희;이병하
    • Journal of the Korean Ceramic Society
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    • v.21 no.2
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    • pp.165-173
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    • 1984
  • It is desirable to establish reliable synthetic methods for electro-ceramic materials. To synthesize $SrTiO_3$ in this study direct solid state reactions and wet chemical processes were used. Previous study of $SrTiO_3$ synthesis included oxalated-method($SrTiO(C_2O_4)_2$.$4H_2O$) co-precipitation$(SrCO_3+TiO(OH)_2)$ and direct solid state reaction$(SrCO_3+TiO(OH)_2)$ The methods in question lead to intermediate inclusion during the reactions and less controllable in particle sizes of $SrTiO_3$. To obtain highly pure $SrTiO_3$ so-called "direct wet process method" was added in this investigation. In the study the "direct wet process" was for the first time applied to synthesize chemically pure and fine particle $SrTiO_3$. $SrCl_2$ and $TiCl_4$<\ulcornerTEX> at KOH solution at room temperature to 10$0^{\circ}C$ precipitated $SrTiO_3$ The particle size increased as temperature increased.mperature increased.

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Development and Analysis of Dry Forming System for Innovation of Papermaking Technology

  • Kim, Jong-Min;Lee, Hak-Lae;Youn, Hye-Jung;Hwang, Min-Gu
    • Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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    • 2006.06b
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    • pp.181-190
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    • 2006
  • This study was conducted to develop dry forming technology and evaluate the properties of dry formed paper made from Hw-BKP. A dry forming mold (DFM) was developed to observe the phenomena of dry forming and evaluate the properties of formed papers. To upgrade the DFM a dry forming system (DFS) was developed. This DFS was designed to improve the formation of dry formed papers and enhance the productivity of dry forming. Dry forming gave papers with greater bulk and opacity than wet forming. Tensile strength of dry formed paper was greater than that of conventional wet formed handsheet when they were made from the same dry disintegrated fibers. But tensile strength of conventional wet formed handsheet made from beaten fiber was much greater than that of dry formed paper made from dry disintegrated fibers. When solvent dried beaten fibers were used in dry forming, the tensile strength of dry formed papers reached 73.5% of the wet formed handsheets made from beaten fiber. It showed that dry forming has a significant potential in improving strength properties when proper preparation of fibers and appropriate humidification, pressing, and drying processes are employed.

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Genetic Control of Asexual Sporulation in Fusarium graminearum

  • Son, Hokyoung;Kim, Myung-Gu;Chae, Suhn-Kee;Lee, Yin-Won
    • 한국균학회소식:학술대회논문집
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    • 2014.10a
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    • pp.15-15
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    • 2014
  • Fusarium graminearum (teleomorph Gibberella zeae) is an important plant pathogen that causes head blight of major cereal crops such as wheat, barley, and rice, as well as causing ear and stalk rot on maize worldwide. Plant diseases caused by this fungus lead to severe yield losses and accumulation of harmful mycotoxins in infected cereals [1]. Fungi utilize spore production as a mean to rapidly avoid unfavorable environmental conditions and to amplify their population. Spores are produced sexually and asexually and their production is precisely controlled. Upstream developmental activators consist of fluffy genes have been known to orchestrate early induction of condiogenesis in a model filamentous fungus Aspergillus nidulans. To understand the molecular mechanisms underlying conidiogenesis in F. graminearum, we characterized functions of the F. graminearum fluffy gene homologs [2]. We found that FlbD is conserved regulatory function for conidiogenesis in both A. nidulans and F. graminearum among five fluffy gene homologs. flbD deletion abolished conidia and perithecia production, suggesting that FlbD have global roles in hyphal differentiation processes in F. graminearum. We further identified and functionally characterized the ortholog of AbaA, which is involved in differentiation from vegetative hyphae to conidia and known to be absent in F. graminearum [3]. Deletion of abaA did not affect vegetative growth, sexual development, or virulence, but conidium production was completely abolished and thin hyphae grew from abnormally shaped phialides in abaA deletion mutants. Overexpression of abaA resulted in pleiotropic defects such as impaired sexual and asexual development, retarded conidium germination, and reduced trichothecene production. AbaA localized to the nuclei of phialides and terminal cells of mature conidia. Successful interspecies complementation using A. nidulans AbaA and the conserved AbaA-WetA pathway demonstrated that the molecular mechanisms responsible for AbaA activity are conserved in F. graminearum as they are in A. nidulans. F. graminearum ortholog of Aspergillus nidulans wetA has been shown to be involved in conidiogenesis and conidium maturation [4]. Deletion of F. graminearum wetA did not alter mycelial growth, sexual development, or virulence, but the wetA deletion mutants produced longer conidia with fewer septa, and the conidia were sensitive to acute stresses, such as oxidative stress and heat stress. Furthermore, the survival rate of aged conidia from the F. graminearum wetA deletion mutants was reduced. The wetA deletion resulted in vigorous generation of single-celled conidia through autophagy-dependent microcycle conidiation, indicating that WetA functions to maintain conidia dormancy by suppressing microcycle conidiation in F. graminearum. In A. nidulans, FlbB physically interacts with FlbD and FlbE, and the resulting FlbB/FlbE and FlbB/FlbD complexes induce the expression of flbD and brlA, respectively. BrlA is an activator of the AbaA-WetA pathway. AbaA and WetA are required for phialide formation and conidia maturation, respectively [5]. In F. graminearum, the AbaA-WetA pathway is similar to that of A. nidulans, except a brlA ortholog does not exist. Amongst the fluffy genes, only fgflbD has a conserved role for regulation of the AbaA-WetA pathway.

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The Improvement of Wet Strength Properties of Sheet by N-Chlorocarbamoylethylation (N-chlorocarbamoylethyl화에 의한 sheet의 습윤강도 향상효과)

  • Jeong, Myung-Joon;Jo, Byoung-Muk;Oh, Jung-Soo
    • Journal of the Korean Wood Science and Technology
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    • v.27 no.3
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    • pp.63-72
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    • 1999
  • For the purpose of improving the wet strength properties of paper, cellulosic fibers were modified by the processes of carbarmoylethylation and N-chlorocarbamoylethylation. Carbamoylethylated cellulose was prepared by the reaction of acrylamide with cellulosic fibers under the alkali catalyst, and N-chlorocarbamoylethylated cellulose was prepared by the addition of sodium hypochlorite into the carbamoylethylated cellulose. In carbamoylethylation reaction, the conditions of NaOH concentration, temperature and acrylamide addition rate were considered to be important factors. An initial reactivity and degree of substitution(DS) in carbamoylethylation of cellulosic fibers were effective according to increasing the addition rates of alkali, acrylamide and the temperature condition of $40^{\circ}C$. The effective wet strength properties by N-chlorocarbamoylethylation of cellulosic fibers were indicated under the conditions of DS 0.06. The wet strength of sheet was improved to 85% at the 100% basis of dry strength. From the photograph of scanning electron microscopy, fiber cuttings on the edge of sheet sample used in tensile strength testing were found in the N-chlorocarbamoylethylated sheet, due to the improvement of fiber bonding strength. The hypochlorite treatment was effective in the recycling of N-chlorocarbamoylethylated sheet, and was reduced the wet strength of sheet to be able to reslush.

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The Effect of Surface Roughness according to Machining Conditions of Test Specimen for Precision Micro-milling Machining (미세정밀밀링 가공을 위한 검사시편의 가공조건에 따른 표면거칠기에 대한 영향 분석)

  • Sim, Min-Seop;Kim, Dong-Hyeon;Lee, Choon-Man
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.1
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    • pp.49-55
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    • 2015
  • Recently, many researchers and industry are looking for ways to decrease the use of lubricants because of economical and environmental reasons. One of the lubrication technologies is the MQL method. This study presents a research of MQL and Wet milling processes of Al 6061 material. For this experiment, the test specimen is suggested, and various machining conditions are applied. And, shape of micro-pattern which has been recently spotlighted is included in the test specimen. In order to compare MQL with Wet machining, several milling experiments were carried out, varying feed rate, cutting speed, depth of cut, etc. Finally, the surface roughness results of machining tests according to the process conditions were measured. It is expected that the results of machining experiments can be used to predict the surface roughness of various MQL milling processes.

Fabrication of Single Crystal Silicon Micro-Tensile Test Specimens and Thin Film Aluminum Markers for Measuring Tensile Strain Using MEMS Processes (MEMS 공정을 이용한 단결정 실리콘 미세 인장시편과 미세 변형 측정용 알루미늄 Marker의 제조)

  • 박준식;전창성;박광범;윤대원;이형욱;이낙규;이상목;나경환;최현석
    • Transactions of Materials Processing
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    • v.13 no.3
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    • pp.285-289
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    • 2004
  • Micro tensile test specimens of thin film single crystal silicon for the most useful structural materials in MEMS (Micro Electro Mechanical System) devices were fabricated using SOI (Silicon-on-Insulator) wafers and MEMS processes. Dimensions of micro tensile test specimens were thickness of $7\mu\textrm{m}$, width of 50~$350\mu\textrm{m}$, and length of 2mm. Top and bottom silicon were etched using by deep RIE (Reactive Ion Etching). Thin film aluminum markers on testing region of specimens with width of $5\mu\textrm{m}$, lengths of 30~$180\mu\textrm{m}$ and thickness of 200 nm for measuring tensile strain were fabricated by aluminum wet etching method. Fabricated side wall angles of aluminum marker were about $45^{\circ}~50^{\circ}$. He-Ne laser with wavelength of 633nm was used for checking fringed patterns.