• Proceedings of the IEEK Conference
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• summer
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• pp.343-347
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• 2004

High oxidation temperature of SiC shows a tendency of carbide formation at the interface which results in poor MOSFET transfer characteristics. Thus we developed oxidation processes in order to get low interface charge densities. N-type 6H-SiC MOS capacitors were fabricated by different oxidation processes: dry, wet, and dry­reoxidation. Gate oxidation and Ar anneal temperature was $1150^{\circ}C.$ Ar annealing was performed after gate oxidation for 30 minutes. Dry-reoxidation condition was $950^{\circ}C,$ H2O ambient for 2 hours. Gate oxide thickness of dry, wet and dry-reoxidation samples were 38.0 nm, 38.7 nm, 38.5 nm, respectively. Mo was adopted for gate electrode. To investigate quality of these gate oxide films, high frequency C- V measurement, gate oxide leakage current, and interface trapped charge densities (Dit) were measured. The interface trapped charge densities (Dit) measured by conductance method was about $4\times10^{10}[cm^{-1}eV^{-1}]$ for dry and wet oxidation, the lowest ever reported, and $1\times10^{11}[cm^{-1}eV^{-1}]$ for dry-reoxidation

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.395-400
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• 2005

Nano-scale fabrication of silicon substrate based on the use of atomic force microscopy (AFM) was demonstrated. A specially designed cantilever with diamond tip, allowing the formation of damaged layer on silicon substrate by a simple scratching process, has been applied instead of conventional silicon cantilever for scanning. A thin damaged layer forms in the substrate at the diamond tip-sample junction along scanning path of the tip. The damaged layer withstands against wet chemical etching in aqueous KOH solution. Diamond tip acts as a patterning tool like mask film for lithography process. Hence these sequential processes, called tribo-nanolithography, TNL, can fabricate 2D or 3D micro structures in nanometer range. This study demonstrates the novel fabrication processes of the micro cantilever and diamond tip as a tool for TNL using micro-patterning, wet chemical etching and CVD. The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano machining tool.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.39-46
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• 2006

Nano-scale fabrication of silicon substrate based on the use of atomic force microscopy (AFM) was demonstrated. A specially designed cantilever with diamond tip, allowing the formation of damaged layer on silicon substrate by a simple scratching process, has been applied instead of conventional silicon cantilever for scanning. A thin mask layer forms in the substrate at the diamond tip-sample junction along scanning path of the tip. The mask layer withstands against wet chemical etching in aqueous KOH solution. Diamond tip acts as a patterning tool like mask film for lithography process. Hence these sequential processes, called tribo-nanolithography, TNL, can fabricate 2D or 3D micro structures in nanometer range. This study demonstrates the novel fabrication processes of the micro cantilever and diamond tip as a tool for TNL using micro-patterning, wet chemical etching and CVD. The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano machining tool.

• Proceedings of the Korea Water Resources Association Conference
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• 2008.05a
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• pp.624-628
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• 2008

Two-dimensional flow analysis is a way to provide good estimates for complex flow features in flow around islands and obstructions, flow at confluence and flow in braided channel. One of difficult problems to develop a two-dimensional hydraulic model is to analyze dry and wet area in river channel. Dry/wet problem can be encountered in river and coastal engineering problems, such as flood propagation, dam break analysis, tidal processes and so on. The objective of this study is to develop an accurate and robust two-dimensional finite element method with dry/wet technique in complex natural rivers. The dry/wet technique with Deforming Grid Method was developed in this study. The Deforming Grid Method was used to construct new mesh by eliminating of dry nodes and elements. The eliminated nodes and elements were decided by considering of the rising/descending velocity of water surface elevation. Several numerical simulations were carried out to examine the performance of the Deforming Grid Method for the purpose of validation and verification of the model in rectangular and trapezoidal channel with partly dry side. The application results of the model were displayed reasonable flow distribution.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.37 no.4 s.112
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• pp.32-37
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• 2005

To Increase the productivity of a paper machine, the maximization of the machine speed is a kind of simple way As the machine speed increases, more intense wet pressing is required to persist the outlet consistency of press part and reduce the water removal of dryer part. With more intense pressing, there are concerns that the quality of paper will be affected. This study was carried out to evaluate the influence of wet-pressing on internal structure of paper, The nip pressure at the first and third nip in triple nip press was controlled. Paper structures, strength properties and pore properties were evaluated. As a result, first nip pressure more strongly influenced the paper structural properties than third nip pressure in triple nip pressing condition. Because of the high water content and low wet-web strength of paper web in first nip, increasing the first nip pressure induced the incipient crushing of wet-web and then caused a potential of web break during the following coating or printing processes.

• Journal of Korean Society for Atmospheric Environment
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• v.14 no.3
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• pp.191-208
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• 1998

Estimations of dry and wet depositions in Korea and the size distributions of yellow sand above Korea have been carried out using the Eulerian aerosol model with the simulated meteorological data from the SNU mesoscale meteorological model. The estimated particle size distribution in Korea shows a bimodal distribution with peak values at 0.6 pm and 7 pm and a minimum at 2 pm in the lower layer However, as higher up, the bimodal distribution becomes an unimodal distribution with a peak value at 4∼5mm. Among the total amount of yellow sand deflated in the source regions , the dry and wet deposition fluxes were about 92%, and about 1.3∼0.5%, repectively, and the rest(5∼6%) is suspended in the air, Most of dust lifted in the air during the clear weather is deposited in the vicinity of the source regions by dry deposition and the rest undergoes the long -range transport with a gradual removal by the wet deposition processes. Over Korean peninsula, the total amount of yellow sand suspended in the air was about 6∼8% of the emissions in the source region and the dry and wet deposition fluxes were about 0.005∼0.7% and 0.003∼0.051% of the total emitted amount, repectively. It is estimated that 2.7∼8.9 mesa-tons of yellow sand is transported annually over the Korean peninsula with the annual mean dry deposition of 2.1∼490 kilo-tons and the annual mean wet deposition of 1.5∼65 kilo-tons.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.39 no.1 s.119
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• pp.8-15
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• 2007

In an effort to develop control strategies for the wet-end of paper machines, dynamic models for retention and formation processes have been developed. The retention process, including headbox total and filler consistencies, white water total and filler consistencies, the basis weight and the ash content of paper, can be modeled from first-principles (mass balances). To include the effect of wet-end chemistry variables, first-pass retention was included as a parameter dependent on operating conditions. In addition, dynamics of formation was simulated by developing an empirical model of formation and coupling with the dynamic models for the retention process. A series of experiments were performed using a pilot paper machine. The experimental results and the model predictions showed relatively good agreement.

• Journal of the Korean institute of surface engineering
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• v.50 no.6
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• pp.523-530
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• 2017

In this study, we developed the h-BN interphase for ceramic matrix composites (CMCs) through a wet chemical coating method, which has excellent price competitiveness and is a simple process as a departure from the existing high cost chemical vapor deposition method. The optimum condition for nitriding an h-BN interphase using boric acid and urea as precursors were derived, and the h-BN interphase coating through a wet method on a carbon preform of 2.5 D was conducted to apply the optimum conditions to the CMCs. In order to control the coating property via the wet coating method, four parameters were investigated such as dipping time of the specimen in the precursor solution, the ratio of boric acid and urea in the precursor, the concentration of solution where the precursor was dissolved, and the cycle of dipping and dry process. The CMCs was fabricated through polymer impregnation and pyrolysis (PIP) processes and a three-point flexural strength test was conducted to verify the role of the coated h-BN interphase.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.12
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• pp.1106-1110
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• 2005

We fabricated (110) silicon hard master by using anisotropic wet etching for embossing. The etching chemical for the silicon wafer was a TMAH $25\%$ solution. The anisotropic wet etching produces a smooth sidewall surface and the surface roughness of the fabricated master is about 3 nm. After spin coating an organic-inorganic sol-gel hybrid material on a silicon substrate, we employed hot embossing technique operated at a low pressure and temperature to form patterns on the silicon substrate by using the fabricated master. We successfully fabricated the multi-mode planar optical waveguides showing low propagation loss of 0.4 dB/cm. The surface roughness of embossed patterns was uniform for more than 10 times of the embossing processes with a single hydrophobic surface treatment of the silicon hard master.

• Journal of Powder Materials
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• v.19 no.3
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• pp.182-188
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• 2012

In this study, fine cathode materials $Ni_3S_2$ and $NiS_2$ were synthesized using the simple, convenient process of mechanical alloying (MA). In order to improve the cell properties, wet milling processes were conducted using low-energy ball milling to decrease the mean particle size of both materials. The cells of Na/$Ni_3S_2$ and Na/$NiS_2$ show a high initial discharge capacity of 425 mAh/g and 577 mAh/g respectively using wet milled powder particles, which is much larger than commercial ones, providing some potential as new cathode materials for rechargeable sodium-ion batteries.