• 제목/요약/키워드: Wet etching time

검색결과 81건 처리시간 0.035초

ZnO와 Al-doped ZnO 박막의 표면 형상과 전기·광학적 특성에 미치는 Wet Etching 시간의 영향 (The Effect of Wet Etching Time on the Surface Roughness and Electrical and Optical Properties of ZnO, and Al-doped ZnO Films)

  • 김민성
    • 한국전기전자재료학회논문지
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    • 제26권3호
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    • pp.194-197
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    • 2013
  • We investigated the effect of etching time on the surface roughness, and electrical and optical properties of ZnO and 2 wt% Al-doped ZnO (AZO) films. The ZnO and AZO films were deposited on glass substrates by RF magnetron sputtering technique. The etching experiment was carried out using a solution of 5% HCl at room temperature. The surface roughness was characterized by Atomic Force Microscopy. The electrical property was measured by Hall measurement system and 4-point probe. The optical property was characterized by UV-vis spectroscopy. After the wet chemical etching, the surface textures were obtained on the surface of the ZnO and AZO films. With the increase of etching time, the surface roughness (RMS) of the films increased and the transmittance of the films was observed to decrease. For the AZO film, a low resistivity of $1.0{\times}10^{-3}\;{\Omega}{\cdot}cm$ was achieved even after the etching.

습식 화학 식각에 의한 다결정 실리콘 웨이퍼의 표면 분석 및 효율 변화 (Surface Analysis and Conversion Efficiency of Multi-crystalline Silicon Solar Cell by Wet Chemical Etching)

  • 박석기;도겸선;송희은;강기환;안형근;한득영
    • 한국태양에너지학회:학술대회논문집
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    • 한국태양에너지학회 2011년도 춘계학술발표대회 논문집
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    • pp.111-115
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    • 2011
  • Surface Texturing is an essential process for high efficiency in multi-crystalline silicon solar cell. In order to reduce the reflectivity, there are two major methods; proper surface texturing and anti-reflection coating. For texturization, wet chemical etching is a typical method for multi-crystalline silicon. The chemical solution for wet etching consists of HF, $NHO_3$, DI and $CH_3COOH$. We carried out texturization by the change of etching time like 15sec, 30sec, 45sec, 60sec and measured the reflectivity of textured wafers. As making the silicon solar cells, we obtained the conversion efficiency and relationship between texturing condition and solar cell characteristics. The reflectivity from 300nm to 1200nm was the lowest with 15 sec texturing time and 60 sec texturing time showed almost same reflectivity as bare one. The 45 sec texturing time showed the highest conversion efficiency.

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스퍼터링 증착 조건에 따른 금속 박막의 습식 식각율 (The Wet Etching Rate of Metal Thin Film by Sputtering Deposition Condition)

  • 허창우
    • 한국정보통신학회논문지
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    • 제14권6호
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    • pp.1465-1468
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    • 2010
  • 습식 식각은 식각용액으로서 화학용액을 사용하는 공정으로 반응물이 기판표면에서 화학반응을 일으켜 표면을 식각하는 과정이다. 습식 식각 시 수${\mu}m$의 해상도를 얻기 위해서는 그 부식액의 조성이나, 에칭시간, 부식액의 온도 등을 고려하여야 한다. 본 실험에서 사용한 금속은 Cr, Al, ITO 로 모두 DC sputter 방법을 사용해서 증착하여 사용하였다. Cr박막은 $1300{\AA}$ 정도의 두께를 사용하였고, ITO (Indium Tin Oxide) 박막은 가시광 영역에서 투명하고 (80% 이상의 transmittance), 저저항 (Sheet Resistance : $50\;{\Omega}/sq$ 이하) 인 박막을 사용하였으며, 신호선으로 주로 사용되는 Al등의 증착조건에 따른 wet etching 특성을 조사하였다.

KOH를 이용한 N-face GaN의 습식 식각으로 인한 표면 변화 (Surface Morphology Variation During Wet Etching of N-face GaN Using KOH)

  • 김택승;한승철;김재관;이지면
    • 대한금속재료학회지
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    • 제46권4호
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    • pp.217-222
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    • 2008
  • Characteristics of etching and induced surface morphology variation by wet-etching of n-face n-type GaN were investigated using KOH solutions. It was observed that hexagonal pyramids were formed on the etched surface regardless of etching conditions. However, the size of the hexagonal pyramids was changed as the etching time and temperature increased, respectively. Initially, as the etching time and concentration of KOH solution increased, the hexagonal pyramid was observed to be dissociated into smaller pyramids. However, as the etching time increased further, the size of the hexagonal pyramids increased again, indicating that the etching of N-face n-type GaN by KOH solutions proceeded through the evolution of hexagonal pyramids, such as formation, dissociation and enlargement of pyramids. Furthermore, it was also observed that there is a correlation between the photoluminescence intensity of the etched surface and the value of root-mean-square roughness. The intensity of PL increased as the roughness value increased due to the enhancement of the extraction efficiency of the generated photons.

바이오센서로의 응용을 위한 수직 배열된 탄소나노튜브의 식각처리 (Etching Treatment of Vertically Aligned Carbon Nanotubes for the Application to Biosensor)

  • 최은창;박용섭;최원석;홍병유
    • 한국전기전자재료학회논문지
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    • 제21권7호
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    • pp.594-598
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    • 2008
  • The metal catalyst particles which there is as impurities on a tip part of carbon nanotube (CNT) are not good to apply it to a nano-electronic device. It was very important the opening of CNT-tip to fix a target bio material and a material to accept in CNT in a biosensor, so we performed $HNO_3$ wet etching to remove the metal catalyst particle which there was on a tip part of CNT grown up in the study and observed the opened CNT-tip with etching time. We synthesized the CNTs using a HF-PECVD method and choses the CNT length of 700 nm for the application of nano-electronic device such as a biosensor etc.. We observed the opened CNT-tip with wet etching times of $HNO_3$ (10, 30, 60 min). From the results, we observed that the CNT-tip was opened with the increase of wet etching time lively. In case of CNTs etched during 60 min, we confirmed that there was not the ratio of Ni included in CNTsI as catalyst. Conclusively, in the case of CNT etched for 60 minutes, it is completely good for application of a biosensor and, in addition, the metal-free CNTs will contribute to the application of other nanoelectronic devices.

태양전지용 ZnO:Al 박막의 wet etching 에 따른 특성 변화

  • 정유섭;김상모;김경환
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.235-236
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    • 2008
  • Wet etched ZnO:Al films for thin film solar cells were prepared by Facing Target sputtering(FTS) method. Wet etching has been used to produce a rough TCO surface that enables light trapping in the absorber. The ZnO:Al films for thin film solar cells were etched by HCl 0.5%. The etching performance of ZnO:Al films can be tuned by changing etching time. The etched ZnO:Al films compared to a smooth ZnO:Al thin film structure. From the results, the lowest resistivity of deposited films was $5.67\times10^{-4}$ [$\Omega$-cm] and the transmittance of all ZnO:Al thin films were over 80% in visible range.

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광택기 제조를 목적으로 한 스퍼터링을 이용한 Mo 증착과 불산 습식 식각 특성 연구 (A Study on the Mo Sputtering and HF Wet Etching for the Fabrication of Polisher)

  • 김도형;이호덕;권상직;조의식
    • 반도체디스플레이기술학회지
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    • 제16권4호
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    • pp.16-19
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    • 2017
  • For the economical and environmental-friendly fabrication of polisher, Mo mask layer were sputtered on glass substrate instead of Cr mask material. Mo mask layers were sputtered by pulsed-DC sputtering and Photoresist patterns were formed on Mo mask layer for different develop times and optimized. After Mo mask layer were patterned and exposed glass was wet etched by HF solution for different etching times, the remaining Mo mask was stripped by using Al etchant. Develop time of 30 sec and HF wet etching time of 3 min were selected as optimized process condition and applied to the fabrication of polisher.

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Organic Acid-Based Wet Chemical Etching of Amorphous Ga-Doped Zinc Oxide Films on Glass and PET substrates

  • Lee, Dong-Kyoon;Lee, Seung-Jung;Bang, Jung-Sik;Park, Mun-Gi;Yang, Hee-Sun
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.1408-1411
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    • 2009
  • This paper describes organic acid-based wet chemical etching behaviors of amorphous Ga-doped zinc oxide (GZO) thin film sputter-deposited at low temperature (room temperature). Wet etch parameters such as etching time, temperature, and etchant concentration are investigated for formic and citric acid etchants, and their effects on the etch rate, etch residue and the feature of edge line are compared.

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DPSS UV Laser와 습식 식각을 이용한 금형강 미세 가공 (Micromachining for plastic mold steel using DPSS UV laser and wet etching)

  • 민경익;김재구;조성학;최두선;황경현
    • 한국레이저가공학회지
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    • 제12권3호
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    • pp.1-6
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    • 2009
  • This paper describes the method for the fabrication of micro dot array on a plastic mold steel using DPSS (diode pumped solid-states) UV laser and wet etching process. We suggest the process of the ablation of a photoresist (PR) coated on plastic mold steel and wet etching process using solutions of various concentrations of $FeCl_3$, $HNO_3$ in water as etchant. This method makes it possible to fabricate metallic roller mold because the microstructures are directly fabricated on the metal surface. In the range of operating conditions studied, $17\;{\mu}J$ laser pulse energy and 50 ms laser exposure time, an etchant containing 40wt% $FeCl_3$, 5wt% $HNO_3$ and etch time for 45 s gave the $10\;{\mu}m$ of micro dot pattern on plastic mold steel.

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Selective Chemical Wet Etching of Si0.8Ge0.2/Si Multilayer

  • Kil, Yeon-Ho;Yang, Jong-Han;Kang, Sukil;Jeong, Tae Soo;Kim, Taek Sung;Shim, Kyu-Hwan
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제13권6호
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    • pp.668-675
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    • 2013
  • We investigate the effect of the ageing time and etching time on the etching rate of SiGe mixed etching solution, namely 1 vp HF (6%), 2 vp $H_2O_2$ (30%) and 3 vp $CH_3COOH$ (99.8%). For this etching solution, we found that the etch rate of SiGe layer is saturated after the ageing time of 72 hours, and the selectivity of $Si_{0.8}Ge_{0.2}$ layer and Si layer is 20:1 at ageing time of 72 hours. The collapse was appeared at the etching time of 9min with etching solution of after saturation ageing time.