• 반도체디스플레이기술학회지
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• 제20권4호
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• pp.146-150
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• 2021

Plasma information based virtual metrology (PI-VM) that predicts wafer-to-wafer etch rate variation after wet cleaning of plasma facing parts was developed. As input parameters, plasma information (PI) variables such as electron temperature, fluorine density and hydrogen density were extracted from optical emission spectroscopy (OES) data for etch plasma. The PI-VM model was trained by stepwise variable selection method and multi-linear regression method. The expected etch rate by PI-VM showed high correlation coefficient with measured etch rate from SEM image analysis. The PI-VM model revealed that the root cause of etch rate variation after the wet cleaning was desorption of hydrogen from the cleaned parts as hydrogen combined with fluorine and decreased etchant density and etch rate.

• 대한인간공학회지
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• 제30권3호
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• pp.427-435
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• 2011

Objective: The objective of this study was to evaluate a work of building cleaners using the ergonomic methods. Background: Previous studies about cleaning worker describe typical physical demands of this work. They found that the most significant risk factors associated with the physical work of cleaners are static loads and repetitive movements and high output of force. Method: A head of ergonomics estimation was work analysis(define of combined task, work tool, work time and frequency of combined task) and posture analysis of worker. Results: The results showed that combined task of building cleaners was classification sweeping, mopping(wet), mopping(oil), moving barrels/carts, dumping trash bags, scrubbing, arrangement of cleaning tool, arrangement of circumferential, moving of cleaning tool, and waiting. The work time of combined task such as mopping(wet) and scrubbing indicated high ratio. The posture analysis of building cleaners indicated high value in bending of the head, lower arm, and hands. Conclusion: The findings appear to indicate that building cleaner were related to high risk of work-related musculoskeletal disorders. So, building cleaner would be required an interventional strategy, improvement of cleaning tools and working environment. Application: If ergonomics rule can be integrated into existing cleaning tools and work environments, the risk of occupational injuries will be reduced.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2003년도 추계학술발표회초록집
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• pp.63-63
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• 2003

• 고문화
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• 66호
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• pp.87-112
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• 2005

Stain removal on ivory has been, for a long time, considered an undesirable treatment in conservation field because ivory is hygroscopic and anisotropic, having different physical properties in different directions. Cyclododecane, which sublimes at room temperature, has been investigated for its use in conservation field since 1995, as a reversible temporary consolidant, sealing agent or coating, water repellent, and barrier layer. This research aims to remove stains on ivory, temporarily protecting the none-stained area or painted area from methanol, acetone or the aqueous cleaning system using cyclododecane as a hydrophobic sealing agent. This research also aims to obtain information regarding whether cyclododecane can be safely and effectively used on archaeological wet ivory. Melted cyclododecane and saturated solutions of cyclododecane in mineral spirits, and hexanes were applied to ivory samples. Application methods, working properties of cyclododecane on ivory, and effect of cyclododecane coating on moisture content of wet ivory were evaluated. The sealing layer formed by molten cyclododecane or by saturated cyclododecane solution in hexane or saturated cyclododecane solution in mineral spirits did not form a secure contact with the surface of the highly polished ivory. The sealing formed with two different layers, in which saturated cyclododecane solution in hexane was applied initially and then molten cyclododecane was applied over the first layer, was found to securely protect the painted area. When the wet samples were kept in 100% RH environments for a month, active mold growths were observed except in the samples sealed with molten cyclododecane. In conclusion, cyclododecane was an efficient hydrophobic sealing agent to protect painting area while cleaning stains on ivory. It also prevented mold growing on wet ivory and wet bone. Evenness of cyclododecane film on ivory will be determined in UV light. Analytical techniques will include visual observation, polarized light microscopy, Scanning Electron Microscope, and Gas Chromatography.

• 한국레이저가공학회지
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• 제4권3호
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• pp.22-29
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• 2001

A development of new surface clwaning technol ogies such as laser and aerosol in paeallel with the improvement of conventional wet mwthods becomes more essential in semiconductor industry due the confrontation of new challenges such as significant device shrink, environmental foralum inum do not work for copper as a new interconnection material, and more effective cleaning tools are required with decreasing the feature size less than 0.13 ㎛ as well as increasing the wafer size from 200 ㎜ to 300 ㎜. In this article, various cleaning techniques increasing laser cleaning are compared methodolgically hi order to understand their unique characteristics such as advantages and disadvantages according to the current clean ing issues. In particular, the current state of art of laser technique for semiconductors md prospects as a try cleaning method are described.

• Bulletin of the Korean Chemical Society
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• 제18권7호
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• pp.737-740
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• 1997

The influence of cyclic treatments with H2O2/DIW (1 : 10) and HF/DIW (1 : 100) on the roughness of silicon surface in the wet chemical processing was investigated by atomic force microscopy (AFM). During the step of the SC-1 cleaning, there is a large increase in roughness on the silicon surface which will result in the poor gate oxide breakdown properties. The roughness of the silicon wafer after the SC-1 cleaning step was reduced by cyclic treatments of hydrogen peroxide solution and hydrofluoric acid solution instead of HF-only cleaning. AFM images after each step clearly illustrated that the average roughness of silicon surface after three times treatments with H2O2 and HF solutions was reduced by 10 times compared with that after the SC-1 cleaning step.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2005년도 춘계학술발표대회 및 제8회 신소재 심포지엄 논문개요집
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• pp.56-56
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• 2005

• 한국식품위생안전성학회지
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• 제38권4호
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• pp.228-235
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• 2023

본 연구에서는 식품 제조시설 및 조리도구의 표면을 대상으로 식품알레르겐인 땅콩을 제거하기 위해 다양한 습식세척법을 평가하였다. 습식세척은 식품알레르겐 또는 잔류물질을 세척하는데 매우 효과적인 방법이며 식품 시설 또는 접촉 표면으로 사용되는 스테인리스, 나무, 플라스틱에 대해 온수로 5분간 불림 후 세척솔과 세척용제를 이용한 세척효과는 스테인리스> 유리> 플라스틱> 나무 순으로 확인되었다. 접촉 표면이 거친 나무는 끼임 등에 의해 세척효과가 낮게 나타났으며 표면의 세척효과를 높이기 위해 온수(50℃±2)로 5분간 불림 후 세척솔과 차아염소산 나트륨으로 세척하였을 때 나무표면으로부터 땅콩 알레르겐 제거에 효과가 큰 것으로 확인되었다. 식품 제조시설 및 조리도구의 표면에 따라 땅콩 알레르겐 세척효과는 달리 확인되어 본 연구에 사용된 재질과 세척용제 이외에 대해서도 추가의 연구는 필요하다. 식품안전현대화법에서 식품알레르기 표시 제도 및 식품알레르기 교차오염 예방 등에 관한 관리가 요구되고 있는 상황에서 식품 제조시설 및 조리도구 표면에 존재하는 식품알레르겐에 의한 교차오염의 예방과 관리는 필요할 것으로 생각된다. 본 연구 결과는 일반적인 세척 후에도 제조시설 및 도구의 표면에 땅콩 알레르겐의 잔류가능성을 제시하였고, 식품제조시설에서 취급하고 있는 땅콩 알레르겐의 세척 및 저감과 적절한 재질의 시설 및 도구 선정에 기초자료로 활용될 수 있을 것으로 판단된다.

• 반도체디스플레이기술학회지
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• 제22권2호
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• pp.17-23
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• 2023

In semiconductor manufacturing processes, a cleaning process is important that can remove sub-micron particles. Conventional wet cleaning methods using chemical have limits in removing nano-particles. Thus, physical forces of a mechanical vibration up to 1 MHz frequency, was tried to aid in detaching them from the substrates. In this article, we developed a 1 MHz quartz megasonic for a bare wafer cleaning using finite element analysis. At first, a 1 MHz megasonic prototype was manufactured. Using the results, a main product which can improve a particle removal performance, was analyzed and designed. The maximum impedance frequency was 992 kHz, which agreed well with the experimental value of 986 kHz (0.6% error). Acoustic pressure distributions were measured, and the result showed that maximum / average was 400.0~432.4%, and standard deviation / average was 46.4~47.3%. Finally, submicron particles were deposited and cleaned for the assessment of the system performance. As a result, the particle removal efficiency (PRE) was proved to be 92% with 11 W power. Reflecting these results, the developed product might be used in the semiconductor cleaning process.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 D
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• pp.2649-2650
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• 2001

In this paper, the minimization of particle wit introduction of face to face to face type in cleaning. Easy input and change of parameter Monitoring function of process data in process function of 3 moving axis. Return Tank for Chem : cal solution.