• Journal of the Korea Institute of Military Science and Technology
• /
• v.11 no.2
• /
• pp.101-108
• /
• 2008

This study attempted to develop the technology by gaseous ozone for decontaminating building affected by a model of biological weapon agent(Bacillus subtilis spores) instead of Bacillus anthracis spore. The use of ozone is attractive method from a practical point of view of decontamination procedure since it has strong oxidation power but no residue after application. We examined the disinfection efficiency of gaseous ozone to Bacillus subtilis spores which suspension was sprayed on different material surfaces and dried. Three different types of gaseous ozone was applied : dry ozone, dry ozone with humidified air, and water bubbled wet ozone. Dry ozone(1500ppm) failed to achieve any significant inactivation for 2hrs. However, six log reduction of B. subtilis spore was achieved within 30min by 1500ppm of water bubbled wet ozone. This result shows the noticeable inactivation efficiency by gaseous ozone compared with previous studies. Good performance by wet ozone was also found for military material surface.(i.e. : gas mask hood, protective garments, army peinted metal surface).

• Journal of the Korean Vacuum Society
• /
• v.6 no.1
• /
• pp.9-19
• /
• 1997

The reaction mechanisms of dry cleaning with UV-excited chlorine radical for Zn, Fe and Ti trace contaminants on the Si wafer have been studied by SEM, AFM and XPS analyses in this work. The patterned Zn, Fe and Ti films were deposited on the Si wafer surface by thermal evaporation and changes in the surface morphology after dry cleaning with $Cl_2$and UV/$Cl_2$at $200^{\circ}C$ were studied by optical microscopy and SEM. In addition, changes in the surface roughness of Si wafer with the cleaning was observed by AFM. The chemical bonding states of the Zn, Fe and Ti deposited silicon surface were observed with in-line XPS analysis. Zn and Fe were easily cleaned in the form of volatile zinc-chloride and iron-chloride as verified by the surface morphology changes. Ti which forms involatile oxides was not easily removed at room temperature but was slightly removed by UV/$Cl_2$at elevated temperature of $200^{\circ}C$. It was also found that the surface roughness of the Si wafer increased after $Cl_2$and UV/$Cl_2$cleaning. Therefore, the metallic contaminants on the Si wafer can be easily removed at lower temperature without surface damage by a continuous process using wet cleaning followed by UV/$Cl_2$dry cleaning.

• Transactions on Electrical and Electronic Materials
• /
• v.1 no.1
• /
• pp.6-11
• /
• 2000

The hydrogen plasma treatment of silicon wafers in the reactive ion-etching mode was studied for the application to silicon-on-insulator wafers which were prepared using the wafer bonding technique. The chemical reactions of hydrogen plasma with surface were used for both surface activation and removal of surface contaminants. As a result of exposure of silicon wafers to the plasma, an active oxide layer was found on the surface. This layer was rendered hydrophilic. The surface roughness and morphology were examined as functions of the plasma exposing time and power. In addition, the surface became smoother with the shorter plasma exposing time and power. The value of initial surface energy estimated by the crack propagation method was 506 mJ/㎡, which was up to about three times higher as compared to the case of conventional direct using the wet RCA cleaning method.

• Korean Chemical Engineering Research
• /
• v.43 no.1
• /
• pp.27-32
• /
• 2005

We propose an effective and environmentally friendly dry stripping method using a supercritical carbon dioxide ($SCCO_2$) system modified by a single and multiple cosolvents to remove ion-implanted photoresist and residue from a wafer surface at three different temperatures (97, 148, $200^{\circ}C$) and pressures (200, 300, 400 bar). After high dose of ion implantation the photoresist was not easily removed by using pure $SCCO_2$, but swollen. The $SCCO_2$ system modified by single cosolvents and multiple cosolvents mixed with aprotic solvents could not effectively remove the heavy organics, but swell them. However, the $SCCO_2$ system modified with multiple cosolvent (5%, v/v) composed of DMSO and DIW showed high removal efficiency for ion-implanted photoresists at $97^{\circ}C$ and 200 bar for 30 min (about 80%). In this study it has been shown that the dry stripping method using $SCCO_2$ system modified with multiple cosolvents could replace either plasma ashing or acid and solvent wet bench method and dramatically reduce accompanied chemical usage and disposal.

• Journal of Periodontal and Implant Science
• /
• v.32 no.3
• /
• pp.615-630
• /
• 2002

Various long-term studies have shown that titanium implants as abutments for different types of prostheses have become a predictable adjunct in the treatment of partially or fully edentulous patients. The continuous exposure of dental implants to the oral cavity with all its possible contaminants creates a problem. A lack of attachment, together with or caused by bacterial insult, may lead to peri-implantitis and eventual implant failure. Removal of plaque and calculus deposits from dental titanium implants with procedures and instruments originally made for cleaning natural teeth or roots may cause major alterations of the delicate titanium oxide layer. Therefore, the ultimate goal of a cleaning procedure should be to remove the contaminants and restore the elemental composition of the surface oxide without changing the surface topography and harming the surrounding tissues. Among many chemical and mechanical procedure, air-powder abrasive have been known to be most effective for cleaning and detoxification of implant surface. Most of published studies show that the dental laser may be useful in the treatment of pen-implantitis. $CO_2$ laser and Soft Diode laser were reported to kill bacteria of implant surface. The purpose of this study was to obtain clinical guide by application these laser to implant surface by means of Non-contact Surface profilometer and X-ray photoelectron spectroscopy(XPS) with respect to surface roughness and atomic composition. Experimental rough pure titanium cylinder models were fabricated. All of them was air-powder abraded for 1 minute and they were named control group. And then, the $CO_2$ laser treatment under dry, hydrogen peroxide and wet condition or the Soft Diode laser treatment under Toluidine blue O solution condition was performed on the each of the control models. The results were as follows: 1. Mean Surface roughness(Ra) of all experimental group was decreased than that of control group. But it wasn't statistically significant. 2. XPS analysis showed that in the all experimental group, titanium level were decreased, when compared with control group. 3. XPS analysis showed that the level of oxygen in the experimental group 1, 3($CO_2$ laser treatment under dry and wet condition) and 4(Soft Diode laser was used under toluidine blue O solution) were decreased, when compared with control group. 4. XPS analysis showed that the atomic composition of experimental group 2($CO_2$ laser treatment under hydrogen peroxide) was to be closest to that of control group than the other experimental group. From the result of this study, this may be concluded. Following air-powder abrasive treatment, the $CO_2$ laser in safe d-pulse mode and the Soft Diode laser used with photosensitizer would not change rough titanium surface roughness. Especially, $CO_2$ laser treatment under hydrogen peroxide gave the best results from elemental points of view, and can be used safely to treat peri-implantitis.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.03a
• /
• pp.101-101
• /
• 2003

Al 박막의 화학증착(CVD)과 Al-Cu 합금박막의 물리증착(PVD)을 조합하는 CVD-PVD Al 공정은 수평방향의 배선과 수직방향의 via를 동시에 형성할 수 있으므로 공정단순화 및 생산원가절감 측면에서 장점이 있어서 DRAM 둥의 반도체 소자의 배선공정으로 매우 유망하다[1]. 본 연구에서는 CVD-PVD Al 공정을 이용하여 초고집적소자의 Al via와 Al 배선을 동시에 형성할 때 층간절연막의 영향을 조사하고 그 원인을 규명하였다. Al CVD를 위한 원료기체로는 dimethylaluminum hydride [($CH_3$)$_2$AlH]를 사용하였고 PVD는 38$0^{\circ}C$에서 실시하였다 층간절연막에 따른 CVD-PVD Al의 via hole 매립특성을 조사한 결과, high-density plasma(HDP) CVD oxide의 경우에는 via hole 매립특성이 우수하였으나, hydrogen silscsquioxane (HSQ)의 경우에는 매립특성이 우수하지 않아서 via 저항이 불균일 하였다. 이는 via 식각 후 wet cleaning 과정에서 HSQ에 흡수된 수분이 lamp를 이용한 degassing 공정에 의해서 완전히 제거되지 않아 CVD-PVD 공정 중에 탈착되어 Al reflow에 나쁜 영향을 미치기 때문으로 판단된다. CVD-PVD 공정 전에 40$0^{\circ}C$, $N_2$ 분위기에서 baking하여 HSQ 내의 수분을 충분히 제거함으로써 via 매립특성을 향상시킬 수 있었다. CVD-PVD Al 공정은 aspect ratio 10:1 이상의 via hole도 완벽하게 매립할 수 있었고 이에의해 제조된 Al 배선은 기존의 W plug 공정에 의해 제조된 배선에 비해 낮은 via 저항을 나타내었다.

• Journal of the Korean Society of Clothing and Textiles
• /
• v.37 no.3
• /
• pp.348-356
• /
• 2013

Denim washing is processed with different washing techniques such as stone washing, chemical washing, sand washing, and bio washing. Cellulase bio washing can meet environmental regulations that enhance and rectify problems associated with traditional decolorization techniques; however, stone washing needs to be added to the processing because it produces a low decolorization effect. There is also the problem of additional strength reduction. To prevent these problems, a new enzyme for bio washing is required. This study examines the optimum laccase treatment conditions on denim and evaluated the characteristics of laccase-treated denims to establish a database of eco-friendly new decolorization process on denim using a new laccase enzyme. The results show that the optimum conditions of laccase on denim are a pH of 4.0, $30^{\circ}C$, 7% (o.w.f.), and 6 hours in 10 mM of buffer concentration. UV absorbance and HPLC identified isatin coexist with anthranilic acid in solution after laccase treatment on denim. Results of the surface color, the surface morphology and the tensile strength indicate that laccase treatment shows an excellent decolorization effect without fiber damage. The wet cleaning fastness and the perspiration fastness also improved.

• Proceedings of the Membrane Society of Korea Conference
• /
• 1996.06a
• /
• pp.149-153
• /
• 1996

반도체 소자 제조 공정이 고 집적화 됨에 따라 습식 세정방법에 의한 세정공정의 중요성이 더욱 증가 되어지고 있으며, 특히 그 중에서 전체 세정공정의 약 절반을 차지하고 있는 Deionised water에 의한 rinsing 공정의 경우 ultrapure water의 quality가 최근 지속적으로 향상이 되어짐에 따라 많은 발전을 자져 왔다. 일반적으로 Deionised water에 함유하고 있는 TOC(total oxidisable components), bacteria, metallic impurity, desolved oxygen cencentration, colloidal material impurity (예를 들면 Silica, oraganic substrate)등은 ultra pure water의 quality를 결정하는데 매우 중요한 factor로 작용하고 있으며, 이러한 불순물들이 반도체 제조공정중 wafer surface에 흡착되어 졌을때 여러형태의 defect들을 유발한다고 알려져 있다. 그러나 pseudommonas, flavobacterlum, alcaligene등의 기 얄려진 bacteria들의 경우 Deionised water를 supply해주는 배관의 Inner surface에 잘 흡착 되지만 고온의 water 혹은 과산화수소수($H_{2}O_{2}$) 를 이용하여 주기적으로 처리 해줌으로 인하여 이에 대한 문제점을 어느정도 최소화 시킬수 있다. 위의 두가지 방법중 전자의 경우 chemical을 사용하지 않고, 유지 및 관리가 간편하며, 용존산소량을 줄일수 있다는 점에서 장점이 있으나, 전 ultra pure water의 system이 열적으로 안정해야 하고 경제적인 문제가 수반하는 단점을 가지고 있다. 후자의 경우, 미량의 과산화수소수 (1~10,000 ppm)를 이용해 처리 해주는 방법의 경우 경제적으로 큰 장점이 있고, 처리가 단순하다는 장점이 있으나 과산화수소수 자체에 포함하고 있는 높은 impurit level, 그리고 처리후 장시간의 flushing time을 가져야 한다는 단점등이 존재 하고 있다.

• Journal of the Korean institute of surface engineering
• /
• v.32 no.3
• /
• pp.428-432
• /
• 1999

As metallic surface has its unique lustrous appearance and optical reflectance in visible range of light, the metallization of plastic surface has been an essential drive toward weight reduction for fuel economy and decorations in transportation industry and has been put into practiced from wet chemical-electrochemial to dry vacuum process in view of an environmental effect. Electron-beam metallization was used in this work with an aim at improving the scratchproof surface hardness of plastic substrate with metallic finish character. Thin film of Al ($1000\AA$) and $SiO_2$($7000\AA$) were metallized on substrate of PC and PMMA and the films were evaluated by pencil test for surface hardness and by cross-cut tape test for adhesion. The ion beam treatment improved around twice as hard as non-treat surface. The ion beam is effect on its hardness and adhesion to surface hardened PC substrate.

• Journal of Industrial and Engineering Chemistry
• /
• v.68
• /
• pp.387-392
• /
• 2018

Various technical approaches and concepts have been proposed to develop conductive super-hydrophobic (SH) surfaces. However, most of these approaches are not usable in practical applications because of insufficient adhesion and cost issues. Additionally, durability and uniformity issues are still in need of improvement. The goal of this research is to produce a large-area conductive SH surface with improved adhesion performance and uniformity. To this end, carbon nanotubes (CNT) with a high aspect ratio and elastomeric polymer were utilized as a conductive filler and matrix, respectively, to form a coating layer. Additionally, nanoscale silica particles were utilized for stable implementation of the conductive SH surface. To improve the adhesion properties between the SH coating layer and substrate, pretreatment of the substrate was conducted by utilizing both wet and dry etching processes to create specific organic functional groups on the substrate. Following pretreatment of the surface, a zirco-aluminate coupling agent was utilized to enhance adhesion properties between the substrate and the SH coating layer. Raman spectroscopy revealed that adhesion was greatly improved by the formation of a chemical bond between the substrate and the SH coating layer at an optimal coupling agent concentration. The developed conductive SH coating attained a high electromagnetic interference (EMI) shielding effectiveness, which is advantageous in self-cleaning EMI shielding applications.