• 한국연소학회:학술대회논문집
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• 2013.06a
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• pp.45-46
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• 2013

Stabilization characteristics of highly $N_2$-diluted $CH_4-O_2$ flame in an axially two-section porous inert medium were experimentally investigated for its application to the waste gas scrubber in semiconductor manufacturing processes. The flame behaviors were observed with respect to the fuel and $N_2$ flow rates and the equivalence ratios. As a result, four kinds of flame behaviors such as stable, flashback crossing the interface, blowout and sudden extinction were observed. It was also found that there exists two flame regime divided by a critical fuel flow rate. In addition, the flame stability was discussed based on the $N_2$ index which means the abatement capacity of our combustor in scrubbing the waste gas from the semiconductor processes.

• 한국연소학회:학술대회논문집
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• 2014.11a
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• pp.139-140
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• 2014

Stabilization characteristics of highly $N_2$-diluted $CH_4-O_2$ flame in an axially two-section porous inert medium were experimentally investigated for its application to the waste gas scrubber in semiconductor manufacturing processes. The flame behaviors were observed with respect to the fuel and $N_2$ flow rates and the equivalence ratios. As a result, four kinds of flame behaviors such as stable, flashback crossing the interface, blowout and sudden extinction were observed.

• Applied Chemistry for Engineering
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• v.29 no.5
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• pp.510-518
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• 2018

Recently, lots of interests have been concentrated on the scrubber system that abates waste gases produced from semiconductor manufacturing processes. An effective design of the thermal decomposition reactor inside a scrubber system is significantly important since it is directly related to the removal performance of pollutants and overall stabilities. In the present study, a computational fluid dynamics (CFD) analysis was conducted to figure out the thermal and flow characteristics inside the reactor of wet scrubber. In order to verify the numerical method, the temperature at several monitoring points was compared to that of experimental results. Average error rates of 1.27~2.27% between both the results were achieved, and numerical results of the temperature distribution were in good agreement with the experimental data. By using the validated numerical method, the effect of the reactor geometry on the heat transfer rate was also taken into consideration. From the result, it was observed that the flow and temperature uniformity were significantly improved. Overall, our current study could provide useful information to identify the fluid behavior and thermal performance for various scrubber systems.

• Applied Chemistry for Engineering
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• v.29 no.1
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• pp.10-17
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• 2018

POU (point of use) scrubbers were applied for the treatment of waste gases including PFCs (perfluorocompounds) exhausted from the CVD (chemical vapor deposition), etching, and cleaning processes of semiconductor and display manufacturing plant. The GWP (global warming potential) and atmosphere lifetime of PFCs are known to be a few thousands higher than that of $CO_2$, and extremely high temperature more than 3,000 K is required to thermally decompose PFCs. Therefore, POU gas scrubbers based on the thermal plasma technology were developed for the effective control of PFCs and industrial application of the technology. The thermal plasma technology encompasses the generation of powerful plasma via the optimization of the plasma torch, a highly stable power supply, and the matching technique between two components. In addition, the effective mixture of the high temperature plasma and waste gases was also necessary for the highly efficient abatement of PFCs. The purpose of this paper was to provide not only a useful technical information of the post-treatment process for the waste gas scrubbing but also a short perspective on R&D of POU plasma gas scrubbers.