• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.4
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• pp.580-586
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• 2021

The CAT methodology is a numerical analysis technique using CAE. Recently, a methodology of applying artificial intelligence techniques to a simulation has been studied. A previous study compared the deformation results according to the injection molding process using a machine learning technique. Although MLP has excellent prediction performance, it lacks an explanation of the decision process and is like a black box. In this study, data was generated using Autodesk Moldflow 2018, an injection molding analysis software. Several Machine Learning Algorithms models were developed using RapidMiner version 9.5, a machine learning platform software, and the root mean square error was compared. The decision-tree showed better prediction performance than other machine learning techniques with the RMSE values. The classification criterion can be increased according to the Maximal Depth that determines the size of the Decision-tree, but the complexity also increases. The simulation showed that by selecting an intermediate value that satisfies the constraint based on the changed position, there was 7.7% improvement compared to the previous simulation.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.43-48
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• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.21-26
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• 2013

This study presents new analysis method to predict bending behavior of packaging substrate structure by comparing finite element method simulation and measured curvature using 3D scanner. Packaging substrate is easily bent and deflected while undergoing various processes such as curing of prepreg and copper pattern plating. We prepare specimens with various conditions and measure contours of each specimen and compute the residual stresses on deposited films using analytical solution to find the principle of bending. Core and prepreg in packaging substrate are made up of resin and bundles of fiber which exist orthogonally each other. Anisotropic material properties cause peculiar bending behavior of packaging substrate. We simulate the bending deflection with finite element method and verify the simulated deflection with measured data. The plating stress of electrodeposited copper is about 58 MPa. The curing stresses of solder resist and prepreg are about 13 MPa and 6.4 MPa respectively in room temperature.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.9
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• pp.3815-3821
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• 2012

The LCD frame is an important part which supports the BLU of medium/large sized TFT-LCD. To produce it efficiently, it is necessary to achieve the molding process improvement from 1 cavity to 2 cavity system. Because 2 cavity mold is compact and its hot-runner zone is broadened, it is difficult to control the temperature on the mold. In this study, injection molding analysis on the frame in 2 cavity process with FEA(Finite Element Analysis) software is carried out to estimate its quality. The calculated injection molding pressures and maximum deflection in 1 and 2 cavity processes are 41.13 MPa and 1.62 mm, 40.49 MPa and 1.66 mm respectively. The measured maximum flexure load and surface roughness of the left and right frame of 2 cavities are 209 N and 0.08 ${\mu}m$, 193 N and 0.10 ${\mu}m$ while those in 1 cavity are 140 N and 0.13 ${\mu}m$. Thermal image shows that the maximum standard deviation of the temperature on left and right side of 2 cavity mold is $1.23^{\circ}C$. The simulation and measurement results show that the quality of the frame in 2 cavity injection molding process as a whole is not worse than that of 1 cavity system. But maximum flexure loads of the frame in 2 cavity process are far greater than that in 1 cavity process.