• Title/Summary/Keyword: Warpage Analysis

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The Injection Molding Analysis and The Mold Design for Automotive Plastic Fender (승용차용 플라스틱 펜더의 사출성형해석과 금형설계)

  • 김헌영;김중재;김영주
    • Transactions of Materials Processing
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    • v.6 no.6
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    • pp.489-499
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    • 1997
  • The injection molding process is analyzed to get the information on the mold design parameters and the optimum process conditions for automotive plastic front fender. The gate position, runner size and cooling channel are determined by the estimation of the flow balance, packing time, uniform cooling and shrinkage and warpage in the injection molding analyses. The procedure can be used in the mold design in the early stage when developing plastic parts.

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Warpage analysis of a Door Carrier Plate in the injection molding Considering the characteristics of LFT (LFT소재 특성을 고려한 Door Carrier Plate 변형 해석)

  • You, Ho-Young;Park, Sihwan
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.8
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    • pp.3625-3630
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    • 2013
  • The modularization accomplished a big contribution in cost down and assembly-time shortening and the quality increase. But few improvements were made to this design largely due to the inflexibility of steel. In recent years, door modules made of PP-LFT material is manufactured using injection molding method. As a result, the plastic door modules allow more flexibility of door shape and become lighter. Warpage is generally large in the molded plastic door carrier plate due to the limitation of gate location and the fiber orientation. So after a few test injection the mold compensation processing for the improvement of an assembly characteristic. This research was performed to determine the factors that contribute to warpage for a injection-molded door carrier plate and presented differences in three mesh types of meshing method and its results. as a result we can improve process of tooling modification can reduce process of trial and error.

Thermo-mechanical Behavior Characteristic Analysis of $B^2it$(Buried Bump Interconnection Technology) in PCB(Printed Circuit Board) (인쇄회로기판 $B^2it$(Buried Bump Interconnection Technology) 구조의 열적-기계적 거동특성 해석)

  • Cho, Seung-Hyun;Chang, Tae-Eun
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.2
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    • pp.43-50
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    • 2009
  • Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

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Retardation Analysis of Plastic Optic Lens according to Injection Speed Variation (사출속도 변화에 따른 플라스틱 광학렌즈의 위상차 해석)

  • Park, Soo-Hyun;Kim, Tae-Kyu;Kwak, Tae-Soo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.14 no.2
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    • pp.93-98
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    • 2015
  • This study focuses on simulation technology in the injection molding process for plastic optic lenses. The CAE program 3D TIMON was used to predict retardation, flow patterns and warpage deformation. The results were compared to the results of optic lenses as measured using the WPA-100 retardation measurement device with injection molding CAE for retardation predictions. According to the analysis and measured results, the distributions of retardation between the CAE results and the measurement results were similar. It was also confirmed that varying the injection speed had an effect on the injection pressure, warpage deformation and retardation distribution. As the injection speed increases, the injection pressure also increases and warpage deformation decreases. However, as the injection speed increases, the retardation distribution deteriorates.

Study on Preform Design for Reducing Weight of PET Packaging Bottle (고분자 패키징 용기 중량 절감을 위한 프리폼 설계에 관한 연구)

  • Kim, Jeong-Soon
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.11 no.1
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    • pp.1-6
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    • 2010
  • This study presents the preform injection molding and the blow molding of the injection stretch-blow molding process for PET bottles. The numerical analysis of the injection molding and the blow molding of a preform is considered in this paper using CAE with a view to minimize the warpage and the thickness. In order to determine the design parameters and processing conditions in injection/blow molding, it is very important to establish the numerical model with physical phenomenon. In this study, a three dimensional model has been introduced for the purpose and flow simulations of filling, post-filling and cooling process are carried out. The simulations resulted in the warpage in good agreement with the measurements. Also, from the result of numerical analysis, we appropriately predicted the warpage, deformation and thickness distribution along the product walls.

A Study on Compressor Seal for Automotive Air-conditioner using Polymer Resin (고분자 수지를 이용한 자동차 에어컨용 압축기의 씰에 관한 연구)

  • 정태형;하영욱
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2002.04a
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    • pp.22-27
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    • 2002
  • The existing compressor steel seal used in automotive air-conditioner has the problem of oil leakage and the deterioration in shielding performance, due to the abrasion and the corrosion of the material. A new type of polymer resin seal is studied in the research. The polymer resin seal has the characteristics of high anti-abrasiveness and anti-corrosiveness, which can overcome the deflects of the steel seal. In addition, the seal needs lower manufacturing cost and is appropriate to mass production, because it is made by the injection molding method requiring no mechanical processing. The profile generation program for seal mold has been developed using the gradient method, and the molding characteristics of the seal have analyzed through the flow analysis and the warpage analysis. The program has been verified by comparing the analysis results with the measured data of the test product. The research might be said to provide the basic method to produce the polymer resin seals with various types and dimensions.

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A Study on Compressor Seal for Automotive Air-conditioner using Polymer Resin (고분자 수지를 이용한 자동차 에어컨용 압축기의 씰에 관한 연구)

  • 정태형;하영욱
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.5
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    • pp.81-87
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    • 2002
  • The existing compressor steel seal used in automotive air-conditioner has the problem of oil leakage and deterioration in shielding performance, due to the abrasion and corrosion of the material. A new type of polymer resin seal studied in this research has the characteristics of high anti-abrasiveness and anti-corrosiveness, which can oversome the defects of the steel seal. In addition, the seal needs lower manufacturing cost and is appropriate to mass production, because it is made by the injection molding method requiring no mechanical processing. The profile generation program for seal mold has been developed using the gradient method, and the molding characteristics of the seal have analyzed through the flow analysis and the warpage analysis. The program has been verified by comparing the analysis results with the measured data of the test product. The research might be said to provide the basic method to produce the polymer resin seals with various types and dimensions.

Time Reduction for Package Warpage Optimization based on Deep Neural Network and Bayesian Optimization (심층신경망 및 베이지안 최적화 기반 패키지 휨 최적화 시간 단축)

  • Jungeon Lee;Daeil Kwon
    • Journal of the Microelectronics and Packaging Society
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    • v.31 no.3
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    • pp.50-57
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    • 2024
  • Recently, applying a machine learning to surrogate modeling for rapid optimization of complex designs have been widely researched. Once trained, the machine learning surrogate model can predict similar outputs to Finite Element Analysis (FEA) simulations but require significantly less computing resources. In addition, combined with optimization methodologies, it can identify optimal design variable with less time requirement compared to iterative simulation. This study proposes a Deep Neural Network (DNN) model with Bayesian Optimization (BO) approach for efficiently searching the optimal design variables to minimize the warpage of electronic package. The DNN model was trained by using design variable-warpage dataset from FEA simulation, and the Bayesian optimization was applied to find the optimal design variables which minimizing the warpage. The suggested DNN + BO model shows over 99% consistency compared to actual simulation results, while only require 15 second to identify optimal design variable, which reducing the optimization time by more than 57% compared to FEA simulation.