• 반도체디스플레이기술학회지
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• 제11권2호
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• pp.33-38
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• 2012

The wafer positioning robot in the semiconductor industry is required to operate at high speed for the improvement of productivity. The residual vibration caused by the high speed of the wafer positioning robot, however, makes the life of the robot shorter and the cycle time longer. In this study, the input shaping and the path of the system are designed for the reduction of the residual vibration and the improvement of the cycle time. The followings are the process for the reduction and the improvement; 1) System modeling of the wafer positioning robot, 2) Verification of dynamic characteristics of the wafer positioning robot, 3) Input shaping plan using impulse response reiteration, 4) Simulation test using SIMULINK program, 5) Analysis of result.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2005년도 추계학술대회논문집
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• pp.559-563
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• 2005

The wafer positioning robot used in the semiconductor industry is required to operate at high speed for the improvement of productivity. However, the residual vibration produced by the high speed of the wafer positioning robot makes the life of the robot shorter and the cycle time longer. In this study, the input shaping and the path of the system are designed for the reduction of the residual vibration and the optimization of the cycle time. The followings are the process for the reduction and the optimization; 1)System modeling of wafer positioning robot, 2)Verification of dynamic characteristic of wafer positioning robot, 3)Input shaping plan using impulse response reiteration, 4)Simulation test using simulink, 6)Analysis of result.

• 한국정밀공학회지
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• 제33권7호
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• pp.579-586
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• 2016

This paper describes kinematic analysis of a 6-degrees-of-freedom (DOF) ultra-precision positioning stage based on a flexure hinge. The stage is designed for processes which require ultra-precision and high load capacities, e.g. wafer-level precision bonding/assembly. During the initial design process, inverse and forward kinematic analyses were performed to actuate the precision positioning stage and to calculate workspace. A two-step procedure was used for inverse kinematic analysis. The first step involved calculating the amount of actuation of the horizontal actuation units. The second step involved calculating the amount of actuation of the vertical actuation unit, given the the results of the first step, by including a lever hinge mechanism adopted for motion amplification. Forward kinematic analysis was performed by defining six distance relationships between hinge positions for in-plane and out-of-plane motion. Finally, the result of a circular path actuation test with respect to the x-y, y-z, and x-z planes is presented.