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Application of an Input Shaping Method for Reduction of Residual Vibration in the Wafer Positioning Robot  

Ahn, Tae-Kil (Dept. of Automotive Engineering, Hoseo University)
Yim, Jae-Chul (Structural/RLDA Lab. Team, GM Korea Co.)
Kim, Seong-Kun (Dept. of Automotive Engineering, Hoseo University)
Kim, Kug Weon (Dept. of Mechanical Engineering, Soonchunhyang University)
Publication Information
Journal of the Semiconductor & Display Technology / v.11, no.2, 2012 , pp. 33-38 More about this Journal
The wafer positioning robot in the semiconductor industry is required to operate at high speed for the improvement of productivity. The residual vibration caused by the high speed of the wafer positioning robot, however, makes the life of the robot shorter and the cycle time longer. In this study, the input shaping and the path of the system are designed for the reduction of the residual vibration and the improvement of the cycle time. The followings are the process for the reduction and the improvement; 1) System modeling of the wafer positioning robot, 2) Verification of dynamic characteristics of the wafer positioning robot, 3) Input shaping plan using impulse response reiteration, 4) Simulation test using SIMULINK program, 5) Analysis of result.
Wafer Positioning Robot; Reduction of Residual Vibration; Input Shaping;
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Times Cited By KSCI : 1  (Citation Analysis)
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