• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2001년도 추계학술강연 및 발표대회
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• pp.16-16
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• 2001

• 한국분말재료학회지
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• 제10권3호
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• pp.181-185
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• 2003

Resistance sintering under ultra-high pressure if developed to fabricate W-Cu composite containing 5 to 80v/o copper. The consolidation was carried out under pressure of 6 to 8 GPa and input power of 18 to 23 kW for 50 seconds. The densification effect and microstructure of these W-Cu composites are investigated. The effect of W particle size on ,sintering density was also studied. The micro hardness was measured to evaluate the sintering effect.

• 한국분말재료학회지
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• 제16권4호
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• pp.268-274
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• 2009

For the purpose of obtaining basic information on the development of lead-free materials, a high density composites (a) W-Cu, (b) W-Sn (c)W-Cu-Sn and (d) W-Cu-Ni were fabricated by the P/M method. The particle size of used metal powders were under 325 mesh, inner size of compaction mould was $\phi8$ mm, and compaction pressure was 400 MPa. A High density composite samples were sintered at a temperature between $140^{\circ}C$ and $1050^{\circ}C$ for 1 hour under Ar atmosphere. The microstructure, phase transformation and physical properties of the sintered samples were investigated. As the results, the highest relative density of 95.86% (10.87 g/$cm^3$) was obtained particularly in the sintered W-Cu-Sn ternary system sample sintered at 450 for 1hr. And, Rockwell hardness (HRB) of 70.0 was obtained in this system.

• 한국분말재료학회지
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• 제9권5호
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• pp.329-335
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• 2002

Recently, the fabrication process of the W-Cu nanocomposite powders has been studied to improve the sinterability through the mechanical alloying and reduction of W and Cu oxide mixtures. In this study. the W-Cu composites were produced by mechanochemical process (MCP) using $WO_3-CuO$ mixtures with two different milling types of low and high energy, respectively. These ball-milled mixtures were reduced in $H_2$ atmosphere. The ball-milled and reduced powders were analyzed through XRD, SEM and TEM. The fine W-Cu powder could be obtained by the high energy ball-milling (HM) compared with the large Cu-cored structure powder by the low energy ball-milling (LM). After the HM for 20h, the W grain size of the reduced W-Cu powder was about 20-30 nm.

• 한국분말재료학회지
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• 제4권2호
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• pp.122-132
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• 1997

Nanostructured(NS) W-Cu composite powders of about 20~30 nm grain size were synthesized by mechanical alloying. The properties of NS W-Cu powder and its sintering behavior were investigated. It was shown from X-ray diffraction and TEM analysis that the supersaturated solid solution of Cu in W was not formed by the mechanical alloying of mixed elemental powders, but the mixture of W and Cu particles with nanosize grains, i.e., the nanocomposite powder was attained. Nanocomposite W-20wt%Cu and W-30wt%Cu powders milled for 100 h were sintered to the relative density more than 96% and 98%, respectively, by sintering at 110$0^{\circ}C$ for 1 h in $H_2$. Such a high sinterability was attributed to the high homogeneous mixing and ultra-fine structure of W and Cu phases as well as activated sintering effect by impurity metal introduced during milling.

• Nuclear Engineering and Technology
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• 제54권3호
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• pp.975-983
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• 2022

A four-layered W/Cu functionally graded material (FGM) (W90% + Cu10%/W80% + Cu20%/W70% + Cu30%/W60% + Cu40%, wt.% fraction) and a four-layered diamond/W-Cu FGM (W90% + Cu10%/W80% + Cu20%/W70% + Cu30%/W55% + Cu40% + diamond5%, wt.% fraction) were fabricated by microwave sintering. The thermal conductivity and thermal shock resistance of diamond/W-Cu FGM and W-Cu FGM were investigated. The morphologies of the diamond particles and different FGMs were analyzed using AFM, SEM, EDS, and TEM. The results show that a 200 nm rough tungsten coating was formed on the surface of the diamond. The density of the tungsten-coated diamond/W-Cu FGM, obtained by microwave sintering at 1200 ℃ for 30 min, was 94.66%. The thermal conductivity of the fourlayered diamond/W-Cu FGM was 220 W·m^-1·K^-1, which is higher than that of the four-layered W/Cu FGM (209 W m^-1 K^-1). This indicates that adding an appropriate amount of tungsten-coated diamond to the high Cu layer W/Cu FGM improves the thermal conductivity of the composite. The diamond/W-Cu FGM sintered at 1200 ℃ for 10 min exhibited better thermal shock resistance than diamond/W-Cu FGM sintered at 1100 ℃ for 10 min.

• 한국분말재료학회지
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• 제11권1호
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• pp.43-49
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• 2004

The electrical and thermal conductivity of W-Cu composites were investigated as a function of the W-particle size and W-W contiguity. Powder mixtures were prepared by ball milling or mechanical alloying process, and then sintered at various temperatures. The electrical conductivity of sintered composite was increased with decreasing W grain size. Dependence of electrical conductivity on the W grain size was explained by the W-W contiguity concept. The thermal conductivity was increased with increasing the temperature up to $600^{\circ}C$ but decreased at the temperature above $600^{\circ}C$ Also, thermal conductivity value was influenced by the W particle size. Change of thermal conductivity in W-Cu composites was discussed based on the observed microstructural characteristics and theoretical considerations.

• 한국분말재료학회지
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• 제7권3호
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• pp.154-160
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• 2000

In order to enhance sinterability of W-Cu composites used for heat sink materials, mechanical alloying process where both homogeneous mixing of component powders and fine dispersion of minor phase can be easily attained was employed. Nanostructured W-Cu powders prepared by mechanical alloying showed W grain size ranged of 20-50 nm and were able to be efficiently sintered owing to the fine particle size as well as uniform distribution of Cu phase. The thermal properties such as electrical resistivity, coefficient of thermal expansion and thermal conductivity were evaluated as functions of temperature and Cu content. It was found that the coefficient of thermal expansion could be controlled by changing Cu content. The measured electrical resistivities and thermal diffusivities were also varied with Cu content. The thermal conductivities calculated from the values of resistivities and diffusivities showed similar tendency as a function of temperatures. However, this is in contradiction with thermal conductivities of pure W and Cu which decrease with increasing temperature.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2001년도 춘계학술강연 및 발표대회
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• pp.20-20
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• 2001

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1995년도 춘계학술강연 및 발표대회 강연 및 발표논문 초록집
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• pp.14-14
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• 1995