• Title/Summary/Keyword: Void formation

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An Experimental Study on the Effect of Capillary Pressure on the Void Formation in Resin Transfer Molding Process (수지이동 성형공정에서 기공형성에 미치는 모세관압의 영향에 관한 실험적 연구)

  • 이종훈;김세훈;김성우;이기준
    • The Korean Journal of Rheology
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    • v.10 no.4
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    • pp.185-194
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    • 1998
  • Flow-induced voids during resin impregnation and poor fiber wetting give serious effects on the mechanical properties of composites in resin transfer molding process. In order to better understand the characteristics of resin flow and to investigate the mechanism of void formation, flow visualization experiment for the resin impregnation was carried out on plain weaving glass fiber mats using silicon oils with various viscosity values. The permeability and the capillary pressure for the fiber mats of different porosities were obtained by measuring the penetration length of the resin with time and with various injection pressure. At low porosity and low operating pressure, the capillary pressure played a significant role in impregnation process. Video-assisted microscopy was used in taking the magnified photograph of the flow front of the resin to investigate the effect of the capillary pressure on the void formation. The results showed that the voids were formed easily when the capillary pressure was relatively high. No voids were detected above the critical capillary number of 2.75$\times$$10^{-3}, and below the critical number the void content increased exponentially with decrease of the capillary number. The content of void formed was independent of the viscosity of the resin. For a given capillary number, the void content reduced with the lower porosity of the fiber mat.

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A Study of Kirkendall Void Formation and Impact Reliability at the Electroplated Cu/Sn-3.5Ag Solder Joint (전해도금 Cu와 Sn-3.5Ag 솔더 접합부의 Kirkendall void 형성과 충격 신뢰성에 관한 연구)

  • Kim, Jong-Yeon;Yu, Jin
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.1
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    • pp.33-37
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    • 2008
  • A noticeable amount of Kirkendall voids formed at the Sn-3.5Ag solder joint with electroplated Cu, and that became even more significant when an additive was added to Cu electroplating bath. With SPS, a large amount of voids formed at the $Cu/Cu_3Sn$ interface of the solder joint during thermal aging at $150^{\circ}C$. The in-situ AES analysis of fractured joints revealed S segregation on the void surface. Only Cu, Sn, and S peaks were detected at the fractured $Cu/Cu_3Sn$ interfaces, and the S peak decreased rapidly with AES depth profiling. The segregation of S at the $Cu/Cu_3Sn$ interface lowered interface energy and thereby reduced the free energy barrier for the Kirkendall void nucleation. The drop impact test revealed that the electrodeposited Cu film with SPS degraded drastically with aging time. Fracture occurred at the $Cu/Cu_3Sn$ interface where a lot of voids existed. Therefore, voids occupied at the $Cu/Cu_3Sn$ interface are shown to seriously degrade drop reliability of solder joints.

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Shear wave velocity of sands subject to large strain triaxial loading

  • Teachavorasinskun, Supot;Pongvithayapanu, Pulpong
    • Geomechanics and Engineering
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    • v.11 no.5
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    • pp.713-723
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    • 2016
  • Shear wave velocities of three selected sandy soils subject to drained triaxial compression test were continuously measured using the bender elements. The shear wave velocity during isotropic compression, as widely recognized, increased as confining pressure increased and they were correlated well. However, during drained shearing, the mean effective stress could no further provide a suitable correlation. The shear wave velocity during this stage was almost constant with respect to the mean effective stress. The vertical stress was found to be more favorable at this stage (since confining stress was kept constant). When sample was attained its peak stress, the shear wave velocity reduced and deviated from the previously existed trend line. This was probably caused by the non-uniformity induced by the formation of shear band. Subsequently, void ratios computed based on external measurements could not provide reasonable fitting to the initial stage of post-peak shear wave velocity. At very large strain levels after shear band formation, the digital images revealed that sample may internally re-arrange itself to be in a more uniform loose stage. This final stage void ratio estimated based on the proposed correlation derived during pre-peak state was close to the value of the maximum void ratio.

Effect of Dopants on Cobalt Silicidation Behavior at Metal-oxide-semiconductor Field-effect Transistor Sidewall Spacer Edge

  • Kim, Jong-Chae;Kim, Yeong-Cheol;Kim, Byung-Kook
    • Journal of the Korean Ceramic Society
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    • v.38 no.10
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    • pp.871-875
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    • 2001
  • Cobalt silicidation at sidewall spacer edge of Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) with post annealing treatment for capacitor forming process has been investigated as a function of dopant species. Cobalt silicidation of nMOSFET with n-type Lightly Doped Drain (LDD) and pMOSFET with p-type LDD produces a well-developed cobalt silicide with its lateral growth underneath the sidewall spacer. In case of pMOSFET with n-type LDD, however, a void is formed at the sidewall spacer edge with no lateral growth of cobalt silicide. The void formation seems to be due to a retarded silicidation process at the LDD region during the first Rapid Thermal Annealing (RTA) for the reaction of Co with Si, resulting in cobalt mono silicide at the LDD region. The subsequent second RTA converts the cobalt monosilicide into cobalt disilicide with the consumption of Si atoms from the Si substrate, producing the void at the sidewall spacer edge in the Si region. The void formed at the sidewall spacer edge serves as a resistance in the current-voltage characteristics of the pMOSFET device.

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Analysis of CD stud welding process and defects (CD 스터드 용접공정의 해석 및 결함 분석)

  • O, Hyeon-Seok;Yu, Jung-Don
    • Proceedings of the KWS Conference
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    • 2005.11a
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    • pp.55-57
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    • 2005
  • In this study, modeling of the CD stud welding system was conducted considering mechanical and electrical components. The electrical components such as arc resistance, cable resistance, capacitance, internal resistance and cable inductance were found to affect the output waveform significantly. The calculated results showed food agreements with the experiment results within 20% error. The main defect of CD stud welding with 1010 steel stud and SS400 steel plate was the void trapped between stud and base metal. The effect of the spring force and stud tip size on void formation was investigated.

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Transverse Flow and Process Modeling on the Polymer Composite with 3-Dimensionally Stitched Woven Fabric

  • Lee, Geon-Woong;Lee, Sang-Soo;Park, Min;Kim, Junkyung;Soonho Lim
    • Macromolecular Research
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    • v.10 no.4
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    • pp.194-203
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    • 2002
  • In resin infusion process(RIP), the fiber and the resin are in contact with each other for an impregnation step and often results in flow-induced defects such as poor fiber wetting and void formation. Resin flow characteristics in transverse direction and process modeling for woven fabric were studied, and the process modeling was applied to the manufacturing of hybrid composite materials. This study also considered the compressibility of woven fabrics in a series of compression force, and it was fitted well to an elastic model equation. Void formation was varied with the processing conditions in the stage of manufacturing composites using RIP. It was concluded from this study that proper combination of pressure build-up and dynamic heating condition makes important factor for flow-induced composite processing.

Distribution of Grown-in Defects in the Fast-pulled Czochralski-silicon Single Crystals (고속 인상 초크랄스키 실리콘 단결정에서 성장 결함 분포)

  • 박봉모;서경호;오현정;이홍우;유학도
    • Korean Journal of Crystallography
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    • v.14 no.2
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    • pp.84-92
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    • 2003
  • The fast pulling is easy to modify the distribution of grown-in defects toward fine size, which can be readily removed by additional treatment. In this experiment, The fast pulled crystals with high pulling late over 1.0 mm/min were grown and their grown-in defect distributions were investigated. In our recent developments in the growth of Cz-Si, it could be found that the cooling rate in a specific temperature range and the uniformity of temperature gradient at solid/liquid interface are more important for the formation of grown-in defect than the pulling rate itself. We analyzed these cooling rates and temperature gradients for the various fast pulled crystals and compared them to the observed formation behavior of the grown-in defects. The effective factor (Ω) for the void defect formation was introduced and it could explain the radial distribution of void defects in the fast-pulled crystals effectively.

Analysis of Keyhole Formation and Stability in Laser Spot Welding (레이저 점 용접의 키홀 발생과 안정성에 대한 해석)

  • 고성훈;이재영;유중돈
    • Journal of Welding and Joining
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    • v.20 no.4
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    • pp.484-490
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    • 2002
  • The formation and stability of stationary laser weld keyholes were investigated using a numerical simulation. The effect of multiple reflections in the keyhole was estimated using the ray tracing method, and the free surface profile, flow velocity and temperature distribution were calculated numerically. In the simulation, the keyhole was formed by the displacement of the melt induced by evaporation recoil pressure, while surface tension and hydrostatic pressure opposed cavity formation. A transition mode having the geometry of the conduction mode with keyhole formation occurred between the conduction and keyhole modes. At laser powers of 500W and greater, the protrusion occurred on the keyhole wall, which resulted in keyhole collapse and void formation at the bottom. Initiation of the protrusion was caused mainly by collision of upward and downward flows due to the pressure components, and Marangoni flow had minor effects on the flow patterns and keyhole stability.bility.

Effect of Void Formation on Strength of Cemented Material (고결 지반 내에 형성된 공극이 강도에 미치는 영향)

  • Park, Sung-Sik;Choi, Hyun-Seok;Kim, Chang-Woo
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.30 no.2C
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    • pp.109-117
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    • 2010
  • Gas hydrate dissociation can generate large amounts of gas and water in gas hydrate bearing sediments, which may eventually escape from a soil skeleton and form voids within the sediments. The loss of fine particles between coarse particles or collapse of cementation due to water flow during heavy or continuous rainfall may form large voids within soil structure. In this study, the effect of void formation resulting from gas hydrate dissociation or loss of some particles within soil structure on the strength of soil is examined. Glass beads with uniform gradation were used to simulate a gas hydrate bearing or washable soil structure. Glass beads were mixed with 2% cement ratio and 7% water content and then compacted into a cylindrical sample with five equal layers. Empty capsules for medicine are used to mimic large voids, which are bigger than soil particle, and embedded into the middle of five equal layers. The number, direction, and length of capsules embedded into each layer vary. After two days curing, a series of unconfined compression tests is performed on the capsule-embedded cemented glass beads. Unconfined compressive strength of cemented glass beads with capsules depends on the volume, direction and length of capsules. The volume and cross section formed by voids are most important factors in strength. An unconfined compressive strength of a specimen with large voids decreases up to 35% of a specimen without void. The results of this study can be used to predict the strength degradation of gas hydrate bearing sediments in the long term after dissociation and loss of fine particles within soil structure.