• Journal of the Korean Society of Safety
• /
• v.9 no.1
• /
• pp.9-18
• /
• 1994

In this study, we conducted experimental tests to evaluate fracture behaviors of fresh-butt welded metal by Acoustic Emission technique. We selected similar welding and dissimilar welding process, the one welded for SM45C, SS41 and SUS304 of each material, the other for SM45C and SS41, SM45C and SUS304 and SS41 and SUS304. The fracturing processes of weld metal were estimatied through the fracture toughness test with compact tension specimens and fractography analysis. In ASTM test method E-399, type I curves for materials of this study were obtained by load-cod diagram of fracture toughness test. and 5% offset load( $P_{5}$) was estimated as the estimated crack initial load( $P_{Q}$), The estimated crack initial load( $P_{Q}$) of similar welding materials generally lower than base matal, and then SM45C appeared greatly in decreasing rate of PB, SS41 and SUS304 appeared in order. $P_{Q}$ of dissimilar welding materials were lower than the similar welding materials. $P_{Q}$ of welding of SM45C and SS41 appeared in small, SUS304 and SS41 appeared greatly in dissimilar welding materials. In fracture toughness test, AE counts increased before the inflection point of the slope, decreased after that. It was found that increasing of AE counts were due to the microcrack formation at the crack tip near the $P_{5}$ point through AE data. For welding materials in this study, both low and high AE amplitude appeared simulataneously. It was confirmed that the low AE amplotude was due to formation of micro void, micro crack or micro dimple, the high AE amplitude was caused by microvoid coalescence and quasi-cleavage fracture through analyses of fractograpy.apy.apy.apy.

• 한국신재생에너지학회:학술대회논문집
• /
• 2011.05a
• /
• pp.151-151
• /
• 2011

Large amounts of natural gas, mainly methane, in the form of hydrates are stored on continental margins. When gas hydrates are dissociated by any environmental trigger, generation of excess pore pressure due to released free gas may cause sediment deformation and weakening. Hence, damage on offshore structures or submarine landslide can occur by gas hydrate dissociation. Therefore, geotechnical stability of gas hydrate bearing sediments is in need to be securely assessed. However, geotechnical characteristics of gas hydrates bearing sediments including small-strain elastic moduli have been poorly identified. Synthesizing gas hydrate in natural seabed sediment specimen, which is mainly composed of silty-to-clayey soils, has been hardly attempted due to their low permeability. Moreover, it has been known that hydrate loci in pore spaces and heterogeneity of hydrate growth in specimen scale play a critical role in determining physical properties of hydrate bearing sediments. In the presented study, we synthesized gas hydrate containing sediments in an instrumented oedometric cell. Geotechnical and geophysical properties of gas hydrate bearing sediments including compressibility, small-strain elastic moduli, elastic wave, and electrical resistivity are determined by wave-based techniques during loading and unloading processes. Significant changes in volume change, elastic wave, and electrical resistivity have been observed during formation and dissociation of gas hydrate. Experimental results and analyses reveal that geotechnical properties of gas hydrates bearing sediments are highly governed by hydrate saturation, effective stress, void ratio, and soil types as well as morphological feature of hydrate formation in sediments.

• Journal of the Korean Society for Heat Treatment
• /
• v.7 no.1
• /
• pp.44-52
• /
• 1994

In order to investigate the effect of tempring treatment on the mechanical properties of ausformed martensite in Fe-30%Ni-0.35%C alloy, the hardness, yield strength and elongation were examined by tensile test. 1. The strength of deformed austenite in Fe-30%Ni-0.35%C alloy was increased due to the work hardening induced from the dislocation density increased during deformation. The strength of ausformed martensite was increased because of defects inherited from deformed austenite by martensitic transformation. 2. The ductility of ausformed martensite was shown a nearly constant values independent of deformation degrees because of the interaction of multiple factors such as increased retained austenite, formation of void and decrement of twin in ausformed martensite. 3. The strength of ausformed martensite by tempering treatment was shown a little decrement up to $340^{\circ}C$, especially showed remarkable softening resistance in higher deformation degrees. 4. Virgin martensite and ausformed martensite were shown a maximum yield strength by clustering in tempering at $100^{\circ}C$ and above $100^{\circ}C$, yield strength was very small decreased due to the decrement of solute carbon by the destruction of clustering. 5. The decomposition of retained austenite was not shown up to $450^{\circ}C$ in ausformed martensite with tempering treatment, and the matrix was rapidly softening because of the decomposition of martensite and the formation of reversed austenite with tempering above $400^{\circ}C$.

• Korean Journal of Metals and Materials
• /
• v.48 no.1
• /
• pp.8-18
• /
• 2010

This study aimed at investigating quasi-static and dynamic torsional deformation behavior of three API X70 and X80 linepipe steels. Quasi-static and dynamic torsional tests were conducted on these steels. having different grain sizes and volume fractions of acicular ferrite and polygonal ferrite, using a torsional Kolsky bar. The test data were then compared via microstructures and adiabatic shear band formation,. The dynamic torsional test results indicated that the steels rolled in the single phase region had higher maximum shear stress than the steel rolled in the two phase region, because the microstructures of the steel rolled in the single phase region were composed mainly of acicular ferrites. In the X80 steel rolled in the single phase region, the increased dynamic torsional properties could be explained by a decrease in the overall effective grain size due to the presence of acicular ferrite having smaller effective grain size. The possibility of adiabatic shear band formation was analyzed from the energy required for void initiation and variation in effective grain size.

• Proceedings of the KIEE Conference
• /
• 2004.07c
• /
• pp.1808-1810
• /
• 2004

This paper describes the discharge characteristics of liquid $SF_6$ (-41$[^{\circ}]$, 1.7[atm]) and $LN_2$ for plane to plane, needle to plane, plane to needle and sphere to plane electrode with gap variations from 1[mm] to 12[mm]. From this result, the breakdown voltage was increased with increasing gap length. Especially, the formation of bubbles by evaporation was observed in spite of non-applying voltage source. A corona is created of the applying voltage from the bubbles on the electrodes applied voltage. We consider it equal mechanism of corona as void exists in solid insulator. The results of liquid $SF_6$ and $LN_2$ discharge characteristics were caused by bubble formed evaporation and applied electric field voltage. Corona was happened to weak bubble and was proceed to new bubble breakdown.

• Proceedings of the Korean Geotechical Society Conference
• /
• 2003.03a
• /
• pp.85-92
• /
• 2003

Generally, ordinary portland cement(OPC) is widely used for grouting to reduce permeability of ground under the foundations of structures. But, it is hard to be injected into the microscopic voids, fissures and crevices in soil or rock formation for the OPC material. Therefore new method what is called MSG(Micro Silica Grouting) has been developed recently to improve the weak point of the OPC material. In this case study, in order to verify performance of the MSG's water cut-off, trial injections were performed in rear of CIP(Cast in Place Pile) on the site A(weathered soil) and B(alluvial soil) that are constructed for the subway No. 9 nowadays. To take the proper grouting method of the MSG in the trial injecting, the injections are carried out for grouting types(constant pressure or fixed Quantity) and grouting methods(1.5shot or 2.0shot) and to confirm the effects of water cut-off and the injection range of the MSG, the tests of permeability and indicator(phenolphthalein) response were performed before and after the injection. Through the tests results, we could affirm the effects of water cut-off of the MSG and the injection range for the weathered and alluvial soil layers near the Han River. Finally we could make sure the application of the MSG method in actual construction under the layers.

• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.4
• /
• pp.81-86
• /
• 2003

Electromigration of Sn-3.5Ag solder bump was investigated using flip chip specimens which consisted of upper Si chip and lower Si substrate. While the resistance of the flip chip sample did not almost change until the time right before the failure, the resistivity increased abruptly at the moment when complete failure of the solder joint occurred in the flip chip sample. At current densities of $3\times 10^4$∼$4\times 10^4$A/$\textrm{cm}^2$, the activation energy for electromigration of the Sn-3.5Ag solder bump was characterized as ∼0.7 eV. Failure of the Sn-3.5Ag solder bump occurred at the solder/UBM interface due to the formation and propagation of voids at cathode side of the solder bump.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.3
• /
• pp.67-74
• /
• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.88-89
• /
• 2009

In this paper, we investigated about wet cleaning effect as deep trench formation methods for Power chip devices. Deep trench structure was classified by two methods, PSU (Poly Stick Up) and Non-PSU structure. In this paper, we could remove residue defect during wet. cleaning after deep trench etch process for non-PSU structure device as to change wet cleaning process condition. V-SEM result showed void image at the trench bottom site due to residue defect and residue component was oxide by EDS analysis. In order to find the reason of happening residue defect, we experimented about various process conditions. So, defect source was that oxide film was re-deposited at trench bottom by changed to hydrophobic property at substrate during hard mask removal process. Therefore, in order to removal residue defect, we added in-situ SCI during hard mask removal process, and defect was removed perfectly. And WLR (Wafer Level Reliability) test result was no difference between normal and optimized process condition.

• Journal of the Korean Society for Heat Treatment
• /
• v.4 no.4
• /
• pp.34-43
• /
• 1991

A small amount of misch metal and/or Zr was added as a dopant to 70.5wt----Cu-26wt----Zn-3.5wt----Al shape memory alloy in order to study the effect of grain refinement and heat treatments on the transformation behavior, stabilization of martensite, and shape memory ability. It was found that the addition of misch metal and Zr was very effective for reducing the grain size. The fracture mode has been changed from intergranular brittle fracture to ductile fracture with void formation and coalescence by the addition of misch metal and Zr. Aging of the ${\beta}$-phase decreases the $M_s$ temperature, but that of the martensite phase increases the $A_s$ temperature. The hysteresis of transformation temperature ${\Delta}T(A_s-M_s)$ has an increasing tendancy by grain refinement. The crystal structure of martensite was identified as monoclinic structure. As the grain size decreased, martensite stabilization more easily occured and the shape, memory ability has been reduced by the grain size refined.