• 한국정밀공학회지
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• 제12권9호
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• pp.74-85
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• 1995

The purpose of this paper is to evaluate the grade of WA vitrified and resinoid bond grinding wheels by the sue of AE measuring system. When the manufactured 48 kinds of specimens were scratched by the method of OKOSHI'S grade test, the relationship between the amount of bit scratch depth of grinding wheel specimens and the character- istics of AE signals, and the relationship of AE counts and grade were considered as fololws; (1) The higher the grades are AE cumlulative event counts N and AE event count rate n, the smaller the values tend to be. But A $E_{rms}$is in reverse. (2) In the case of same grade, the smaller the grain size is, the higher the value of AE cumulative event counts N and A $E_{rms}$is results of comparison and observation. The grinding wheel with lower elasticity and with higher percentage of pore detected higher value of AE cumula- tive event counts N than with higher elasticity and lower percentage of pore. But A $E_{rms}$ is in reverse. (3) AE cumulative event counts N and bit scratch depth h have normally one to one correspondence. (4) It can be expected that quantitative evaluations of grade by using AE have been carried out by the wave observation of AE signal in line with the relationship between load speed of bit and AE cumulative event counts N & AE event count rate n.' AE event count rate n.ate n.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.199-200
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• 2010

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.43-47
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• 2002

In this study, through the experimental results of grinding ratio, grinding force and surface roughness with the obtained wear amount of diamond wheel and ceramic material during the grinding process, the following conclusions could be found. In the case of $Si_3N_4$, the wear of diamond wheel is large while the grinding force is stable and the range of change in surface roughness is small. for the case of $AL_2O_3$ and $ZrO_3$, while the wear of diamond wheel is getting smaller, the grinding force is increasing but the value of surface roughness is decreasing. For grinding with the vitrified bond wheel, it seems that the self-sharpening can be found for $Si_3N_4$ and the glazing effect of the cutting edge for $AL_2O_3$ and $ZrO_3$.

• 한국공작기계학회논문집
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• 제12권5호
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• pp.8-14
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• 2003

The characteristics of grinding and wear behavior of diamond wheel for grinding ceramic materials was investigated in this study. In case of $Si_3N_4$, the wear of wheel was large, the finding force was relatively stable and the fluctuation of surface roughness n small. On the other hand in case of $Al_2O_3$ and $ZrO_2$, the wear of wheel and surface roughness were decreasing, the grinding force was increasing. During grinding with vitrified bond wheel, $Si_3N_4$ shows renewal of cutting edge while $Al_2O_3$ and $ZrO_2$ show glazing phenomenon of cutting grains. We have found that it possible to observe the behavior of grinding wheel by grinding ratio, grinding resistance, surface roughness and cutting edge ratio. Through the grinding experiments, it was found that grinding life of diamond wheel is 20 times for $Si_3N_4$, and 40 times fir $Al_2O_3$ and $ZrO_2$.

• 한국정밀공학회지
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• 제26권9호
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• pp.58-63
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• 2009

Silicon carbide (SiC) has been used for many engineering applications because of their high strength at high temperatures and high resistances to chemical degradation. SiC is very useful especially for a glass lens mold whose components demanded to the machining with good surface finish and low surface damage. The performance and reliability of optical components are strongly influenced by the surface damage of SiC during grinding process. Therefore, the severe process condition optimization shall be necessary for the highly qualified SiC glass lens mold. Usually the major form of damage in grinding of SiC is a crack occurs at surface and subsurface. The energy introduced in the layers close to the surface leads to the formation of these cracks. The experimental studies have been carried out to get optimum conditions for grinding of silicon carbide. To get the required qualified surface finish in grinding of SiC, the selection of type of the wheel is also important. Grinding processes of sintered SiC work-pieces is carried out with varying wheel type, depth of cut and feed using diamond wheel. The machining result of the surface roughness and the number of flaws, have been analyzed by use of surface profilers and SEM.