• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• Journal of the Korean Geotechnical Society
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• v.24 no.8
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• pp.99-109
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• 2008

The standard consolidation tests using the incremental loading technique test (IL) were performed on remolded normal consolidation and undisturbed clay samples to find out the effects of plastic index and loading period on consolidation in this study. The remolded samples used were prepared by mixing Gunsan-Samangum clay with bentonite so that they may have plasticity indexes of 15, 30, 45, and 60%, respectively. The undisturbed clay samples were collected from Inchon, Kwangyang, and Uoolsan. The samples were tested at the condition of 4 different loading periods (1, 2, 4, and 8 days). Settlement, coefficient of consolidation, compression index, secondary compression index, and pore water pressure characteristics were investigated from the plastic index and loading period aspects, and the compression index, coefficient of consolidation, and secondary compression index were formulated in terms of the plastic index and loading. To verify the applicability of proposed equations, the settlements obtained from Terzaghi's theory, modified Cam-Clay model (elasto-plastic model), and the Sekiguchi model (elasto-viscoplastic mode) were compared with the test results. The comparison indicates that the Sekiguchi model incorporating the secondary consolidation characteristic well predicts the results.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.29 no.4D
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• pp.491-497
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• 2009

This paper presents the results of accelerated pavement tests (APT) that simulate permanent deformation (rutting) of asphalt concrete pavements under different temperatures and loading courses. Also, finite element (FE) analysis has been conducted to predict the test results. Test section for APT is the same as one of test sections at Korea Expressway Corporation test road and is subjected to a constant moving dual tire wheel load of APT at three different temperatures: 30, 40, $50^{\circ}C$. The moving wheel is applied at different loading courses within a 75cm wide wheel path to account for traffic wandering. Also, the effect of wandering on permanent deformation development is investigated numerically with three wandering schemes. In this study, ABAQUS is adopted to model APT pavement section with plain stain elements and creep strain rate model is used to take into account viscoplastic stain of asphalt concrete mixtures, and elastic layer properties are back-calculated from FWD measurements. Plus, the effect of boundary condition and subgrade on FE permanent deformation predictions is investigated. A full FE model that accounted for subgrade provided more realistic rut depth predictions, indicating subgrade has contributed to surface rutting.