• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.27 no.6
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• pp.733-739
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• 2009

Recently it is being increased rapidly to install magnetic marker and RFID tag on the underground utility lines before backfilling to ensure effective it's management. However, due to changes an attitude and damages of sensors. By pressure and vibration during soil compacting, detecting rate is significantly reduced as well as it allows to use only one line of various pipes since it has an unique frequency. Also it is required too long time to reach to target point with an non-accurate navigational GPS receiver and hard to update existing data base with a manual input of new data in the field. To improve these problems, the researcher developed the field management system that apply with ball typed self-levelling marker which is free from the changes of attitude for sensors during compaction as well as has various radio frequency applicable to many kind of pipes and ensure fast positioning to target point using an incorporated system with PDA based DGPS receiver which allows loading a field GIS software and RFID detector. Further, it provides with viewing all of RFID data on the DGPS receiver screen directly and also input new data to existing data base in the field automatically.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.