• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.05a
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• pp.96-102
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• 2001

High intensity vibro-acoustic testing is the appropriate method for flight qualification testing of space flight vehicle which must ensure the acoustic environment of launch. Growing demand for satellites and launch vehicles in korea has resulted in a recent increase in the demand for high intensity vibro-acoustic test facility. The test facility is designed to provide an acoustic environment of 152 ㏈( re 20 ${\mu}$Pa) overall sound pressure level over the band width of 30 Hz to 10,000 Hz in the reverberant chamber. The reverberant chamber has a volume of 1,000 ㎥ with interior dimensions of 8.7m${\times}$l0m${\times}$12m, which can accommodate not only satellites but also launch vehicle payload fairing. Korea Aerospace Research Institute and Korean industries have been carrying out the development of the reverberant chamber and auxiliary devices, such as automatic control system, monitoring/safety device, and jet nozzle, etc. This paper presents the detailed description of High Intensity Acoustic Chamber of KARI, which will be the first and unique testing facility in Korea.

• Journal of Aerospace System Engineering
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• v.15 no.1
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• pp.86-94
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• 2021

PCB-based deployable solar panel is mainly used for CubeSat due to its lightweight and easy of electrical connection. However, as the size of solar panel increases, there is a limit to ensuring the structural safety of solar cells due to excessive dynamic displacement under launch vibration environment. In previous mechanical designs, for the minimization of dynamic deflection, panel stiffness is increased by applying additional stiffeners made of various materials such as aluminum or composite. However, it could have disadvantages for CubeSat design requirements due to limited mass and volumes. In this study, a high-damping 6U solar panel was proposed. It had superior damping characteristic with a multi-layered stiffener laminated with viscoelastic acrylic tapes. Basic characteristics of this solar panel were measured through free-vibration tests. Design effectiveness of the solar panel was validated through qualification-level launch vibration test. Based on test results, vibration characteristics of a typical PCB solar panel and the high-damping laminated solar panel were predicted and a comparative analysis was performed.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.5
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• pp.383-390
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• 2020

Wedge locks have been widely used for spaceborne electronics for mounting or removal of a printed circuit board (PCB) during integration, test and maintenance process. However, it can basically provide a mechanical constraint on the edge of the board. Thus, securing a fatigue life of solder joint for electronic package by limiting board deflection becomes difficult as the board size increases. Previously, additional stiffeners have been applied to reduce the board deflection, but the mass and volume increases of electronics are unavoidable. To overcome the aforementioned limitation, we proposed an application of multi-layered PCB sheet with viscoelastic adhesive tapes to implement high-damping capability on the board. Thus, it is more advantageous in securing the fatigue life of package under launch environment compared with the previous approach. The basic characteristics of the PCB with the multi-layered sheet was investigated through free-vibration tests at various temperatures. The effectiveness of the proposed design was validated through launch vibration test at qualification level and fatigue life prediction of electronic package based on the test results.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.11 no.5
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• pp.796-805
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• 2000

A 30GHz band low noise amplifier module, which has linear gain of 30dB and noise figure of 2.6dB, for 30GHz satellite communication transponder was developed by use of MMIC and thin film MIC technologies. Two kinds of MMIC circuits were used for the low noise amplifier module, the first one is ultra low noise MMIC circuit and the other is wideband and high gain MMIC circuit. The pHEMT technology with 0.15$mu extrm{m}$ of gate length was applied for MMIC fabrication. Thin film microstrip lines on alumina substrate were used to interconnect two MMIC chips, and the thick film bias circuit board were developed to provide the stabilized DC bias. The input interface of the low noise amplifier module was designed with waveguide type to receive the signal from antenna directly, and the output port was adopted with K-type coaxial connector for interface with the frequency converter module behind the low noise amplifier module. Space qualified manufacturing processes were applied to manufacture and assemble the low noise amplifier module, and space qualification level of environment tests including thermal and vibration test were performed for it. The developed low noise amplifier was measured to show 30dB of minimum gain, $\pm$0.3dB of gain flatness, and 2.6dB of maximum noise figure over the desired operating frequency range from 30 to 31 GHz.