• 센서학회지
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• 제21권1호
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• pp.34-38
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• 2012

We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ${\mu}m$, a width of 200 ${\mu}m$, a thickness of 10 ${\mu}m$, and a pitch of 650 ${\mu}m$ for $11{\times}11$ BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.

• International Journal of Precision Engineering and Manufacturing
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• 제4권4호
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• pp.51-56
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• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 금형가공 심포지엄
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• pp.180-186
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• 2002

The simulated die-casting process in which the traditional plaster casting process is combined with Rapid Prototyping technology is being used to produce Al, Mg, and Zn die-casting prototypes. Unlike in the die-casting process, molten metal in the conventional plaster casting process is fed via a gravity pour into a mold and the mold does not cool as quickly as a die-casting mold. The plaster castings have much larger and grosser grain structure as compared as the die-castings and the thin walls of the plaster mold cavity may not be completely fillet Because of lower mechanical properties induced by the large grain structure and incomplete Idling, the conventional plaster casting process is not suitable for the trial die-casting Process. In this work, an enhanced trial die-casting process has been developed in which molten metal in the plaster mold cavity is vibrated and pressurized simultaneously. Patterns for the casting are made by Rapid Prototyping technologies and then plaster molds, which have runner system, are made using these patterns. Imparted pressurized vibration to molten metal has made grain structure of castings much finer and improved fluidity of the molten metal enough to obtain complete filling at thin walls which can not be filled in the conventional plaster casting process.

• 방사성폐기물학회지
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• 제20권3호
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• pp.269-278
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• 2022

The buffer is a critical barrier component in an engineered barrier system, and its purpose is to prevent potential radionuclides from leaking out from a damaged canister by filling the void in the repository. No experimental parameters exist that can describe the buffer expansion phenomenon when Kyeongju bentonite, which is a buffer candidate material available in Korea, is exposed to groundwater. As conventional experiments to determine these parameters are time consuming and complicated, simple swelling pressure tests, numerical modeling, and machine learning are used in this study to obtain the parameters required to establish a numerical model that can simulate swelling. Swelling tests conducted using Kyeongju bentonite are emulated using the COMSOL Multiphysics numerical analysis tool. Relationships between the swelling phenomenon and mechanical parameters are determined via an artificial neural network. Subsequently, by inputting the swelling tests results into the network, the values for the mechanical parameters of Kyeongju bentonite are obtained. Sensitivity analysis is performed to identify the influential parameters. Results of the numerical analysis based on the identified mechanical parameters are consistent with the experimental values.

• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.63-69
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• 2007

Cu 비아를 이용한 MEMS 센서의 스택 패키지용 interconnection 공정을 연구하였다. Ag 페이스트 막을 유리기판에 형성하고 관통 비아 홀이 형성된 Si 기판을 접착시켜 Ag 페이스트 막을 Cu 비아 형성용 전기도금 씨앗층으로 사용하였다. Ag 전기도금 씨앗층에 직류전류 모드로 $20mA/cm^2$와 $30mA/cm^2$의 전류밀도를 인가하여 Cu 비아 filling을 함으로써 직경 $200{\mu}m$, 깊이 $350{\mu}m$인 도금결함이 없는 Cu 비아를 형성하는 것이 가능하였다. Cu 비아가 형성된 Si 기판에 Ti/Cu/Ti metallization 및 배선라인 형성공정, Au 패드 도금공정, Sn 솔더범프 전기도금 및 리플로우 공정을 순차적으로 진행함으로써 Cu 비아를 이용한 MEMS 센서의 스택 패키지용 interconnection 공정을 이룰 수 있었다.

• Corrosion Science and Technology
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• 제18권2호
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• pp.39-48
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• 2019

The feasibility of using benzotriazole (BTAH) to inhibit pitting corrosion in the sprinkler copper tubes was investigated by filling the tubes with BTAH-water solution in 829 households at an eight-year-old apartment complex. The water leakage rate was reduced by approximately 90% following BTAH treatment during 161 days from the previous year. The leakage of one of the two sprinkler copper tubes was investigated with optical microscopy, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectroscopy, and X-ray diffraction analysis to determine the formation of Cu-BTA film inside the corrosion pits. All the inner components of the corrosion pits were coated with Cu-BTA films suggesting that BTAH molecules penetrated the corrosion products. The Cu-BTA film was about 2 nm in thickness at the bottom of a corrosion pit. A layer of CuCl and $Cu_2O$ phases lies under the Cu-BTA film. This complex structure effectively prevented the propagation of corrosion pits in the sprinkler copper tubes and reduced the water leakage.

• 소성∙가공
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• 제30권1호
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• pp.35-42
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• 2021

Magnesium alloys are used in electronic devices such as laptops due to their lightweight features as well as vibration absorption and electromagnetic shielding properties. However, the precision of electronics is limited by the large number of small and precise ribs, the cost-effective manufacture of which requires appropriate technology. Plate forging is an efficient manufacturing process that can address these challenges. In this study, plate forging of magnesium alloys was investigated specifically for the fabrication of laptop cover. The plate forging process with back-pressure was used for near-net shape formation. Finite element analysis was used to select appropriate variables for back-pressure formation to generate ribs of various sizes and shapes without defects. The reliability of the analysis was verified to manufacture the prototype. The effect of back-pressure can be verified via fabrication of prototypes as well as structure and forming analysis based on finite element method. The process design factor of back-pressure increases formability without defects of under-filling and flow-through. Moreover, the tensile strength was maintained even after high temperature plate forging at 370 ℃, and the elongation was improved.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.47-47
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• 2011

There have been numerous efforts to enhance the efficiency of light-emitting diodes (LEDs) by using low dimensional structures such as quantum dots (QDs), wire (QWRs), and wells (QWs). We demonstrate QD/QWR/QW hybrid structured LEDs by using nano-scaled pyramid structures of GaN with ~260 nm height. Photoluminescence (PL) showed three multi-peak spectra centered at around 535 nm, 600 nm, 665 nm for QWs, QWRs, and QDs, respectively. The QD emission survived at room temperature due to carrier localization, whereas the QW emission diminished from 10 K to 300 K. We confirmed that hybrid LEDs had zero-, one-, and two-dimensional behavior from a temperature-dependent time-resolved PL study. The radiative lifetime of the QDs was nearly constant over the temperature, while that of the QWs increased with increasing temperature, due to low dimensional behavior. Cathodoluminescence revealed spatial distributions of InGaN QDs, QWRs, and QWs on the vertices, edges, and sidewalls, respectively. We investigated the blue-shifted electroluminescence with increasing current due to the band-filling effect. The hybrid LEDs provided broad-band spectra with high internal quantum efficiency, and color-tunability for visible light-emitting sources.

• Nuclear Engineering and Technology
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• 제38권1호
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• pp.99-108
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• 2006

SNU-RCCS is a water pool type RCCS (Reactor Cavity Cooling System) developed for VHTR (Very High Temperature Reactor) application by SNU (Seoul National University). Since radiation heat transfer is the major process of passive heat removal in a RCCS, it is important to determine the precise emissivity of the reactor vessel. Review studies have used a constant emissivity in the passive heat removal analysis, even though the emissivity depends on many factors such as temperature, surface roughness, oxidation level, wavelength, direction, atmosphere conditions, etc. Therefore, information on the emissivity of a given material in a real RCCS is essential in order to properly analyze the radiation heat transfer in a VHTR. The objectives of this study are to develop a method for compensation of the factors affecting the emissivity measurement using an infrared thermometer and to estimate the true emissivity from the measured emissivity via the developed method, especially in the SNU-RCCS environment. From this viewpoint, we investigated factors such as the attenuation effect of the window, filling gas, and the effect of background radiation on the emissivity measurements. The emissivity of the vessel surface of the SNU-RCCS facility was then measured using a sight tube. The background radiation was subsequently removed from the measured emissivity by solving a simultaneous equation. Finally, the calculated emissivity was compared with the measured emissivity in a separate emissivity measurement device, yielding good agreement with the emissivity increase with vessel temperature in a range of 0.82 to 0.88.

• 한국재료학회지
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• 제24권4호
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• pp.186-193
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• 2014

A thin Cu seed layer for electroplating has been employed for decades in the miniaturization and integration of printed circuit board (PCB), however many problems are still caused by the thin Cu seed layer, e.g., open circuit faults in PCB, dimple defects, low conductivity, and etc. Here, we studied the effect of heat treatment of the thin Cu seed layer on the deposition rate of electroplated Cu. We investigated the heat-treatment effect on the crystallite size, morphology, electrical properties, and electrodeposition thickness by X-ray diffraction (XRD), atomic force microscope (AFM), four point probe (FPP), and scanning electron microscope (SEM) measurements, respectively. The results showed that post heat treatment of the thin Cu seed layer could improve surface roughness as well as electrical conductivity. Moreover, the deposition rate of electroplated Cu was improved about 148% by heat treatment of the Cu seed layer, indicating that the enhanced electrical conductivity and surface roughness accelerated the formation of Cu nuclei during electroplating. We also confirmed that the electrodeposition rate in the via filling process was also accelerated by heat-treating the Cu seed layer.