• Journal of Advanced Marine Engineering and Technology
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• v.39 no.8
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• pp.801-806
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• 2015

The experimental analysis of a crevice-type vapor chamber heat pipe (CVCHP) is investigated. The heat source of the CVCHP is a high-power light-emitting diode (LED). The CVCHP, which exhibits a bubble pumping effect, is used for heat dissipation in a high-heat-flux system. The working fluid is R-141b, and its charging ratio was set at 60 vol.% of the vapor chamber in a heat pipe. The total thermal conductivity of the falling-liquid-film-type model, which was a modified model, was 24% larger than that of the conventional model in the LED package. Flow visualization results indicated that bubbles grew larger as they combined. These combined bubbles pushed the working fluid to the top, partially wetting the heat-transfer area. The thermal resistance between the vapor chamber and tube in the modified design decreased by approximately 32%. The overall results demonstrated the better heat dissipation upon cooling of the high-power LED package.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.2
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• pp.96-101
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• 2016

The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.1
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• pp.15-21
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• 2015

The purpose of this paper is to analyze thermal characteristics of the heat sinks to maximize the thermal diffusivity for LED floodlight. The 2 kind of samples were prepared by vapor chamber manufacturing technology using the heat pipe principle. It was analyzed the maximum temperature reduction effect and the thermal diffusion from the heat source depending on the types of chambers with 3 kind of working fluids. As a result, it was confirmed that thermal conductivity 23% increased, GVC-R type than IVC-R type.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.12
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• pp.1107-1116
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• 2004

In this paper, the effects of diverse parameters on the operation of loop heat pipe (LHP), such as particle diameter of sintered porous wick, wick porosity, vapor line diameter, thickness of wick and heating capacity were investigated by a theoretical analysis. A LHP has a wick only in its evaporator for the circulation of working fluid, and utilizes a porous wick structure of which pore size is very small to obtain a large capillary force. The working fluid is water and the material of sintered porous wick is copper. For these different parameters, capillary pressure, pressure drop in wick, pressure drops and temperature distribution were analyzed by a theoretical design method of LHP.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.12
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• pp.1079-1085
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• 2010

A steady-state analytical model was presented for a loop heat pipe (LHP) with an evaporator that has a flat geometry. On the basis of a series of reviews of the relevant literature, a sequence of calculations was proposed to predict the temperatures and pressures at each important part of the LHP: the evaporator, liquid reservoir (compensation chamber), liquid line, vapor line, and condenser. The analysis of the evaporator, which is the only part in the LHP that has a capillary structure, was emphasized. Thin-film theory is applied to account for the pressure and temperature in the region adjacent to the liquid-vapor interface in the evaporator. The present study introduced a unique method to estimate the liquid temperature at the interface. Relative freedom was assumed in the configuration of a condenser with a simplified liquid-vapor interface. Our steady-state model was validated by experimental results available in the literature. The relative error was within 3% on the absolute temperature scale, and reasonable agreement was obtained.

• Electronics and Telecommunications Trends
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• v.38 no.6
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• Resources Recycling
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• v.9 no.4
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• pp.28-36
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• 2000

This study describes to analyze the characteristics for separation and recovery of both the dried particles and the purified solvent from the waste solvent through the vaporization process by the continuous and instantaneous vacuum drying system. The vacuum drying system for the waste solvents recovery consists of a feeding pump, a double pipe heat exchanger, a vacuum spray chamber, and a condenser. The vacuum drying system heats the waste solvent to the vapor in the double pipe heat exchanger and the expanded vapor is sprayed at the end of the tube. The vaporized solvent in the condenser are recovered. The particles in the waste solvent are separated and dried from the vapor in the vacuum spray chamber. Performance evaluation of the vacuum drying system was conducted using the mixture of the dried pigment particles and benzene or alkylbenzene as test samples. For the mixture of 10 wt% pigment particles an 90% benzene, the recovery efficiency of benzene was 88% with the purity of 99% and the recovery efficiency of dried particles was 94% with the moisture of 1.1 wt%. The size of pigment particles was decreased from $6.5\mu\textrm{m}$ to $5.6\mu\textrm{m}$ in diameter due to high speed spraying and dispersion in the vacuum drying system during drying process. Therefore, the vacuum drying system showed to be an effective method for separating particles and solvent in the waste solvent.