• Title/Summary/Keyword: Vapor Deposition Process

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Thermal and Mechanical Properties of a N2 Doped Porous 3C-SiC Thin Film (질소가 도핑된 다공질 3C-SiC 박막의 열적, 기계적 특성)

  • Kim, Kang-San;Chung, Gwiy-Sang
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.8
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    • pp.651-654
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    • 2010
  • This paper describes the thermal and mechanical properties of doped thin film 3C-SiC and porous 3C-SiC. In this work, the in-situ doped thin film 3C-SiC was deposited by using atmospheric pressure chemical vapor deposition (APCVD) method at $120^{\circ}C$ using single-precursor hexamethyildisilane: $Si_2(CH_3)_6$ (HMDS) as Si and C precursors. 0~40 sccm $N_2$ gas was used as doping source. After growing of doped thin film 3C-SiC, porous structure was achieved by anodization process with 380 nm UV-LED. Anodization time and current density were fixed at 60 sec and 7.1 mA/$cm^2$, respectively. The thermal and mechanical properties of the $N_2$ doped porous 3C-SiC was measured by temperature coefficient of resistance (TCR) and nano-indentation, respectively. In the case of 0 sccm, the variations of TCR of thin film and porous 3C-SiC are similar, but TCR conversely changed with increase of $N_2$ flow rate. Maximum young's modulus and hardness of porous 3C-SiC films were measured to be 276 GPa and 32 Gpa at 0 sccm $N_2$, respectively.

Removal of Polymer residue on Graphene by Plasma treatment

  • Yun, Hye-Ju;Jeong, Dae-Seong;Lee, Geon-Hui;Sim, Ji-Ni;Lee, Jeong-O;Park, Jong-Yun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.375.2-375.2
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    • 2016
  • 그래핀(Graphene)은 원자 한 층 두께의 얇은 특성에 기인하여 우수한 투과도(~97.3%)를 나타내며, 높은 전자 이동도($200,000cm^2V^{-1}s^{-1}$)로 인하여 전기 전도도가 우수한 2차원 전자소재이다. 또한 유연하고 우수한 기계적 물성을 가지고 있어 실제로 다양한 소자에서 활용되고 있다. 그래핀을 이용하여 다양한 소자로 응용하기 위한 과정 중 하나인 포토리소그래피 공정(Photolithography process)은 원하는 패턴을 만들기 위해 제작하고자 하는 기판 위에 포토레지스트(Photoresist)를 코팅하는 과정을 거치게 된다. 하지만 이러한 과정은 소자 제작에 있어서 포토레지스트 잔여물을 남기게 된다. 그래핀 위에 남은 포토레지스트 잔여물은 그래핀의 우수한 전기적 특성을 저하시켜 소자특성에 불이익을 주게 된다. 본 연구에서는 수소 플라즈마를 이용하여 그래핀 위에 남은 중합체(Polymer) 잔여물을 제거한다. 사용한 그래핀은 화학 기상 증착법(Chemical vapor deposition)을 이용하여 성장시켰으며, PMMA(Poly(methyl methacrylate))를 이용하여 이산화규소(silicon dioxide) 기판에 전사하였다. 그래핀의 손상 없이 중합체 잔여물을 제거하기 위해 플라즈마 처리시간을 15초부터 1분까지 늘려가며 연구를 진행하였으며, 플라즈마 처리 시간에 따른 중합체 잔여물의 제거 정도와 그래핀의 보존 여부를 확인하기 위해 라만 분광법(Raman spectroscopy)과 원자간력현미경(Atomic force microscopy)을 사용하였다. 본 연구 결과를 통해 간단한 플라즈마 처리로 보다 나은 특성의 그래핀 소자를 얻게 됨으로써, 향상된 특성을 가진 그래핀 소자로 산업적 응용 가능성을 높일 수 있을 것이라 생각된다.

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The effect of film morphology by bar-coating process for large area perovskite solar modules

  • Ju, Yeonkyeong;Kim, Byeong Jo;Lee, Sang Myeong;Yoon, Jungjin;Jung, Hyun Suk
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.416-416
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    • 2016
  • Organic-inorganic metal halide perovskite solar cells have received attention because it has a number of advantages with excellent light harvesting, high carrier mobility, and facile solution processability and also recorded recently power conversion efficiency (PCEs) of over 20%. The major issue on perovskite solar cells have been reached the limit of small area laboratory scale devices produced using fabrication techniques such as spin coating and physical vapor deposition which are incompatible with low-cost and large area fabrication of perovskite solar cells using printing and coating techniques. To solution these problems, we have investigated the feasibility of achieving fully printable perovskite solar cells by the blade-coating technique. The blade-coating fabrication has been widely used to fabricate organic solar cells (OSCs) and is proven to be a simple, environment-friendly, and low-cost method for the solution-processed photovoltaic. Moreover, the film morphology control in the blade-coating method is much easier than the spray coating and roll-to-roll printing; high-quality photoactive layers with controllable thickness can be performed by using a precisely polished blade with low surface roughness and coating gap control between blade and coating substrate[1]. In order to fabricate perovskite devices with good efficiency, one of the main factors in printed electronic processing is the fabrication of thin films with controlled morphology, high surface coverage and minimum pinholes for high performance, printed thin film perovskite solar cells. Charge dissociation efficiency, charge transport and diffusion length of charge species are dependent on the crystallinity of the film [2]. We fabricated the printed perovskite solar cells with large area and flexible by the bar-coating. The morphology of printed film could be closely related with the condition of the bar-coating technique such as coating speed, concentration and amount of solution, drying condition, and suitable film thickness was also studied by using the optical analysis with SEM. Electrical performance of printed devices is gives hysteresis and efficiency distribution.

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HFCVD법을 이용한 대면적 BDD(Boron Doped Diamond) 전극 개발

  • An, Na-Yeong;Park, Cheol-Uk;Lee, Jeong-Hui;Lee, Yu-Gi;Choe, Yong-Seon;Lee, Yeong-Gi
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.168-168
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    • 2016
  • BDD(Boron Doped Diamond) 전극은 전위창이 넓고, 다른 불용성 전극에 비해 산소발생과전압이 높아 물을 전기화학적인 방법으로 처리하는 영역에 있어 매우 효과적일 뿐만 아니라, 전통적인 불용성 전극에 비해 전극 표면에서 수산화 라디칼(-OH)과 오존(O3)의 발생량이 월등히 높아 수처리용 전극으로서의 유용성이 매우 높다. 따라서 BDD 전극을 수처리용 전극에 사용하는 경우 수산화 라디칼(-OH)과 오존(O3), 과산화수소(H2O2) 등과 같은 산화제의 생성은 물론이고, 염소(Cl2)가 포함되어 있는 전해액에서는 차아염소산(HOCl)이나 차아염소산이온(OCl-)과 같은 강력한 산화제가 발생되어 전기화학적 폐수처리, 전기화학적 정수처리, 선박평형수 처리 등의 분야에 널리 활용될 수 있다. 본 연구에서는 상온 및 상압에서 운전이 가능하고 난분해성 오염물질 제거 효과가 뛰어난 전기화학적 고도산화공정(Electrochemical Advanced Oxidation Process, EAOP)에 적합한 대면적의 BDD 전극을 개발하고 자 하였다. 이러한 BDD 전극의 성막 방법으로는 필라멘트 가열 CVD, 마이크로파 플라즈마 CVD, DC 플라즈마 CVD 등이 널리 알려져 있는데 최근에는 설비의 투자비가 비교적 저렴하고, 대면적의 기판처리가 용의한 필라멘트 가열 화학기상증착법(Hot Filament Chemical Vapor Deposition, HFCVD)이 상업적으로 각광을 받고 있다. 따라서 본 연구에서는 HFCVD 방법을 이용하여 반응 가스의 투입비율, BDD 박막의 두께, 기판의 재질 등에 따른 여러 가지 성막 조건들을 검토하여 $100{\times}100mm$ 이상의 대면적 BDD 전극을 개발하였다. Fig. 1은 본 연구를 통하여 얻어진 BDD 전극의 표면 및 단면 SEM이다.

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Nanocomposite-Based Energy Converters for Long-Range Focused Ultrasound Treatment

  • Lee, Seung Jin;Heo, Jeongmin;Song, Ju Ho;Thakur, Ujwal;Park, Hui Joon;Baac, Hyoung Won
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.369-369
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    • 2016
  • A nanostructure composite is a highly suitable substance for photoacoustic ultrasound generation. This allows an input laser beam (typically, nanosecond pulse duration) to be efficiently converted to an ultrasonic output with tens-of-MHz frequency. This type of energy converter has been demonstrated by using a carbon nanotube (CNT)-polydimethylsiloxane (PDMS) composite film that exhibit high optical absorption, rapid heat transition, and mechanical durability, all of which are necessary properties for high-amplitude ultrasound generation. In order to develop the CNT-PDMS composite film, a high-temperature chemical vapor deposition (HTCVD) method has been commonly used so far to grow CNT and then produce a CNT-PDMS composite structure. Here, instead of the complex HTCVD, we use a mixed solution of hydrophobic multi-walled CNT and dimethylformamid (DMF) and fabricate a solution-processed CNT-PDMS composite film over a spherically concave substrate, i.e. a focal energy converter. As the solution process can be applied over a large area, we could easily fabricate the focal transmitter that focuses the photoacoustic output at the moment of generation from the CNT-PDMS composite layer. With this method, we developed photoacoustic energy converters with a large diameter (>25 mm) and a long focal length (several cm). The lens performance was characterized in terms of output pressure amplitude for an incident pulsed laser energy and focal spot dimension in both lateral and axial. Due to the long focal length, we expect that the new lens can be applied for long-range ultrasonic treatment, e.g. biomedical therapy.

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Decomposition Characteristics of PFCs for Various Plasma Discharge Methods in Dielectric Barrier Discharge (DBD 반응기에서 플라즈마 방전형태에 따른 PFCs 가스의 분해 특성)

  • Kim, Kwan-Tae;Kim, Yong-Ho;Cha, Min-Suk;Song, Young-Hoon;Kim, Seock-Joon;Ryu, Jeong-In
    • Journal of Korean Society for Atmospheric Environment
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    • v.20 no.5
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    • pp.625-632
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    • 2004
  • Perfluorocompounds ($PFC_s$), such as tetrafluoromethane ($CF_4$) and hexafluoroethane ($C_2F_6$), have been widely used as plasma etching and chemical vapor deposition (CVD) gases for semiconductor manufacturing processes. Since these $PFC_s$ are known to cause a greenhouse effect intensively, there has been a growing interest in reducing $PFC_s$ emissions. Among various $CF_4$ decomposing techniques, a dielectric barrier discharge (DBD) is considered as one of a promising candidate because it has been successfully used for generating ozone ($O_3$) and decomposing nitrogen oxide (NO). Firstly, optimal concentration of oxygen for $CF_4$ decomposition was found to figure out how many primary and secondary reactions are associated with DBD process. Secondary, to find effective discharge method for $CF_4$ decomposition, a streamer and a glow mode in DBD are experimentally compared, which includes (i) coaxialcylinder DBD, (ii) DBD reactor packed with glass beads. and (iii) a glow mode operation with a helium gas. The test results showed that optimal concentration of oxygen was ranged 500 ppm~1% for treating 500 ppm of $CF_4$ and helium glow discharge was the most efficient one to decompose $CF_4$.

The Fabrication by using Surface MEMS of 3C-SiC Micro-heaters and RTD Sensors and their Resultant Properties

  • Noh, Sang-Soo;Seo, Jeong-Hwan;Lee, Eung-Ahn
    • Transactions on Electrical and Electronic Materials
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    • v.10 no.4
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    • pp.131-134
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    • 2009
  • The electrical properties and the microstructure of nitrogen-doped poly 3C-SiC films used for micro thermal sensors were studied according to different thicknesses. Poly 3C-SiC films were deposited by LPCVD (low pressure chemical vapor deposition) at $900^{\circ}C$ with a pressure of 4 torr using $SiH_2Cl_2$ (100%, 35 sccm) and $C_2H_2$ (5% in $H_2$, 180 sccm) as the Si and C precursors, and $NH_3$ (5% in $H_2$, 64 sccm) as the dopant source gas. The resistivity of the poly SiC films with a 1,530 ${\AA}$ thickness was 32.7 ${\Omega}-cm$ and decreased to 0.0129 ${\Omega}-cm$ at 16,963 ${\AA}$. The measurement of the resistance variations at different thicknesses were carried out within the $25^{\circ}C$ to $350^{\circ}C$ temperature range. While the size of the resistance variation decreased when the films thickness increased, the linearity of the resistance variation improved. Micro heaters and RTD sensors were fabricated on a $Si_3N_4$ membrane by using poly 3C-SiC with a 1um thickness using a surface MEMS process. The heating temperature of the SiC micro heater, fabricated on 250 ${\mu}m$${\times}$250 ${\mu}m$ $Si_3N_4$ membrane was $410^{\circ}C$ at an 80 mW input power. These 3C-SiC heaters and RTD sensors, fabricated by surface MEMS, have a low power consumption and deliver a good long term stability for the various thermal sensors requiring thermal stability.

Origin of Decreasing the Dielectric Constant and the Effect of Ionic Polarization (유전상수가 낮아지는 원인과 이온 분극의 효과)

  • Oh, Teresa
    • Journal of the Korean Vacuum Society
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    • v.18 no.6
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    • pp.453-458
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    • 2009
  • SiOC film was deposited by the chemical vapor deposition using BTMSM and oxygen mixed precursor. The characteristic of SiOC film varied with increasing of the gas flow rate ratios. The dielectric constant was obtained by C-V measurement using the structure of metal/SiOC film/Si. The space effect due to the steric hindrance between alkyl group at terminal bond of Si-$CH_3$ made the pores, and increased the thickness. However, the SiOC film due to the lowering of the polarization decreased the thickness and then decreased the dielectric constant. After annealing process, the dielectric constant decreased because of the evaporation of the OH or $H_2O$ sites. The thickness was related to the lowering of the dielectric constant by the reduction of the polarization and the thickness decreased with the decrease of the dielectric constant. The refractive index was in inverse proportion to thickness. The trends of the thickness and refractive index did not change after annealing.

Swift Synthesis of CVD-graphene Utilizing Conduction Heat Transfer

  • Kim, Sang-Min;Mag-isa, Alexander E.;Oh, Chung-Seog;Kim, Kwang-Seop;Kim, Jae-Hyun;Lee, Hak-Joo;Yoon, Jonghyuk;Lee, Eun-Kyu;Lee, Seung-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.652-652
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    • 2013
  • The conventional thermal chemical vapor deposition (CVD) setup for the graphene synthesis has mainly used convective heat transfer in order to heat a catalyst (e.g. Cu) up to $1,000^{\circ}C$. Although the conventional CVD has been so far widely accepted as the most appropriate candidate enabling mass-production of high-quality graphene, this method has stillremained under the standard for the commercialization largely due to the poor productivity arisen out of the required long processing time. Here, we introduced a fast and efficient synthetic route toward CVD-graphene. Unlike the conventional CVD using convection heat transfer, we adopted a CVD setup utilizing conduction heat transfer between Cu catalyst and rapid heating source. The high thermal conductive nature of Cu and the employed rapid heating source led to the remarkable reduction in processing timeas compared to the conventional convection based CVD (Fig. 1A), moreover, the synthesized graphene was turned out to have comparable quality to that synthesized by the conventional CVD (Fig. 1B). For the optimization of the conduction based CVD process, the parametric studies were thoroughly performed using through Raman spectroscopy and electrical sheet resistance measurement. Our approach is thought to be worth considerable in order to enhance productivity of the CVD graphene in the industry.

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Fabrication and Characteristics of Lateral Type Field Emitter Arrays

  • Lee, Jae-Hoon;Kwon, Ki-Rock;Lee, Myoung-Bok;Hahm, Sung-Ho;Park, Kyu-Man;Lee, Jung-Hee
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.2 no.2
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    • pp.93-101
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    • 2002
  • We have proposed and fabricated two lateral type field emission diodes, poly-Si emitter by utilizing the local oxidation of silicon (LOCOS) and GaN emitter using metal organic chemical vapor deposition (MOCVD) process. The fabricated poly-Si diode exhibited excellent electrical characteristics such as a very low turn-on voltage of 2 V and a high emission current of $300{\;}\bu\textrm{A}/tip$ at the anode-to-cathode voltage of 25 V. These superior field emission characteristics was speculated as a result of strong surface modification inducing a quasi-negative electron affinity and the increase of emitting sites due to local sharp protrusions by an appropriate activation treatment. In respect, two kinds of procedures were proposed for the fabrication of the lateral type GaN emitter: a selective etching method with electron cyclotron resonance-reactive ion etching (ECR-RIE) or a simple selective growth by utilizing $Si_3N_4$ film as a masking layer. The fabricated device using the ECR-RIE exhibited electrical characteristics such as a turn-on voltage of 35 V for $7\bu\textrm{m}$ gap and an emission current of~580 nA/l0tips at anode-to-cathode voltage of 100 V. These new field emission characteristics of GaN tips are believed to be due to a low electron affinity as well as the shorter inter-electrode distance. Compared to lateral type GaN field emission diode using ECR-RIE, re-grown GaN emitters shows sharper shape tips and shorter inter-electrode distance.