• 한국금형공학회:학술대회논문집
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• 한국금형공학회 2008년도 하계 학술대회
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• pp.69-73
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• 2008

본 연구에서는 고분자 플라스틱 부품의 친환경 외장성형공법인 Insert Film 사출성형공법중 첫 번째 공정인 진공성형공정에서 진공금형의 표면온도 균일화 기술에 대해 연구를 수행하였다. 진공금형의 온도분포 균일화를 위한 금형설계 및 설계된 금형에 대한 온도분포 평가를 위한 ANSYS를 이용한 유한요소열해석을 수행하였으며, 이때 정상상태 및 과도상태를 함께 평가하였다. 설계 결과를 바탕으로 금형을 제작하였으며, 생산성을 고려하여 4캐비티로 제작된 금형에 대해 금형표면의 온도분포 평가실험을 수행하였다. 또한 금형내 캐비티 온도센서 및 제어시스템을 설치하여 진공금형표면 온도분포가 항상 일정하게 유지될 수 있도록 금형시스템을 개발하였다. 결과적으로 일정한 온도범위의 금형표면온도제어가 가능하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.374-374
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• 2010

Charge transfer mechanism of poly(4,4'-aminotriphenylene hexafluoroisopropylidenediphthalimide) (TP6F PI) which exhibits bistable ON and OFF switching has been studied using photoemission electron spectroscopy (PES) and near-edge x-ray absorption fine structure (NEXAFS). Here, we demonstrate novel set-up in which holes are injected by photoemission process instead of direct charge carrier injection via metal electrode. The accumulated charges on the PI surface in the OFF state abruptly flow across the PI film when the bias voltage of a back electrode reaches a specific value, indicating that the film is changed to the ON state. Core level and x-ray absorption spectra probed at charge injection region via photoemission process do not show any evidences implying structural modification of TP6F PI during the phase change. Whereas, in valence band spectra, the highest occupied molecular orbital (HOMO) is shifted toward Fermi level, responsible for improved hole-mobility of TP6F PI of ON state.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.219-219
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• 2013

The effect of an electron blocking layer (EBL) on V-I curves in GaN/InGaN multiple quantum well is investigated. For the first time, we found that curves were intersected at 3.012 V and analyzed the reason for intersection. The forward voltage in LEDs with an p-AlGaN EBL is larger than without p-AlGaN EBL at low injection current because the Mg doping efficiency for p-GaN layer was higher than that of p-AlGaN layer. However, the forward voltage in LEDs with an p-AlGaN EBL is smaller than without p-AlGaN EBL at high injection current because the carriers overflow from the active layer when injection current increases in LEDs without p-AlGaN EBL and in case of LED with p-AlGaN EBL, the carriers are blocked by EBL.

• 한국진공학회지
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• 제20권5호
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• pp.374-380
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• 2011

니켈촉매 막을 증착시킨 산화규산 기판위에 아세틸렌기체와 수소기체를 원료로 육불화황기체를 첨가기체로 탄소코일을 증착하였다. 육불화황이 투입되는 단계에 따라 성장된 탄소코일의 특성(형성 밀도, 형상)을 조사하였다. 육불화황을 연속적으로 주입하였을 경우 선형, 마이크로크기 코일, 나노크기 코일, 그리고 파동형 나노크기 코일 등 다양한 형태의 탄소코일들이 성장하였다. 하지만, 탄소코일 초기 증착단계에서 1분정도의 짧은시간 동안 육불화황을 주입한 경우 나노크기의 탄소코일 형상만을 대부분 얻을 수 있었다. 탄소코일 합성반응시간이 1분 정도 지체된 후의 단계에서 짧은시간 동안의 육불화황 주입은 코일형상 제어를 저해하였다. 따라서, 육불화황의 주입 시간과 주입단계가 탄소 코일의 형상을 결정하는 중요한 요인임을 알 수 있었다.

• 한국진공학회지
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• 제9권4호
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• pp.373-378
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• 2000

실리콘 기판 위에서 $TiO_2$와 $Bi_2O_3$의 박막 성장은 반응속도론 측면에서 커다란 차이를 보였지만, $Bi_4Ti_3O_{12}$(BIT) 박막의 성장은 주로 $TiO_2$ 성장 거동에 의해 지배를 받았다. 그 결과 BIT 박막은 bismuth가 부족한 조성을 가지게 되었다. 박막 내에 부족한 bismuth의 양을 보충해줌으로써 이러한 문제점을 해결하고자 펄스 주입 유기 금속 화학 기상 증착(MOCVD) 방법을 사용하였다. 이러한 펄스 주입법에 의해 bismuth의 양은 증가하였고 또한, 박막의 깊이 방향으로의 조성이 균일해졌고 $Bi_4Ti_3O_{12}$과 Si사이의 계면이 향상되었다. 게다가, $Bi_4Ti_3O_{12}$ 박막의 결정성은 크게 향상되었고 누설 전류 밀도는 연속 주입법에 비해 1/2에서 1/3정도 낮아졌다. 시계 방향의 C-V 이력 곡선이 관찰되었고 이로 인해 펄스 주입법에 의해 증착된 $Bi_4Ti_3O_{12}$ 박막은 강유전성에 의해 스위칭이 됨을 알 수 있었다.

• 한국진공학회지
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• 제9권1호
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• pp.7-15
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• 2000

An ECR-PECVD system with the characteristics of high ionization rat다 ability of plasma processing in a wide pressure range and deposition at low temperature was manufactured and characterized for the deposition of thin films. The system consists of a vacuum chamber, sample stage, vacuum gauge, vacuum pump, gas injection part, vacuum sealing valve, ECR source and a control part. The control of system is carried out by the microprocessor and the ROM program. We have investigated the vacuum characteristics of ECR-PECVD system, and also have diagnosed the characteristics of ECR microwave plasma by using the Langmuir probe. From the data of system and plasma characterization, we could confirmed the stability of pressure in the vacuum chamber according to the variation of gas flow rate and the effect of ion bombardment by the negative DC self bias voltage. The plasma density was increased with the increase of gas flow rate and ECR power. On the other hand, it was decreased with the increase of horizontal radius and distance between ECR source and probe. The calculated plasma densities were in the range of 49.7\times10^{11}\sim3.7\times10^{12}\textrm{cm}^{-3}$. It is also expected that we can estimate the thickness uniformity of film fabricated by the ECR-PECVD system from the distribution of the plasma density.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.69-70
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• 2006

We studied increasement of efficiency of Organic Light-emitting Diodes depending on thickness variation of LiF, Material of Electron Injection Layer in structure of ITO/Hole Injection Layer (PTFE)/Hole Transportion Later (TPD)/Emitting Layer (Alq3)/Electron Injection Layer (LiF)/Al. TPD and $Alq_3$ is deposited as rate of 1.3~1.5 [${\AA}/s$] in high vacuum ($5{\times}10^{-6}$ [torr]). In result of these studies, we can know maximum efficiency in 0.7 [nm], thickness of LiF. And samples with electron injection material are increased about 5-fold in maximum efficiency in compare with sample without electron injection material.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.409-410
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• 2008

We studied dielectric properties of Organic Light-emitting Diodes(OLEDs) depending on applied voltage of AF(Amorphous Polytetrafluoroethylene), material of hole injection layer in structure of ITO/hole injection layer (AF)/Al. AF is deposited 5 [nm] as deposition rate of 0.1~0.2 [$\AA$/s] in high vacuum of $5\times10^{-6}$ [Torr]. In result of these studies, we can know dielectric properties of OLEDs. The impedance decreases as the applied voltage increases and the Cole-Cole plots of devices are decreases as the applied voltage increases.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제37회 하계학술대회 초록집
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• pp.148-148
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• 2009

• 한국산업융합학회 논문집
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• 제21권1호
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• pp.1-8
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• 2018

The purpose of this study is to develop a high-strength, high-toughness, thin-walled aluminum shock absorber housing product by applying a high vacuum die casting method to improve internal gas defect and formability. The analysis program dedicated for the casting was used because it was too costly and time-consuming to adopt the gating system design. The final casting plan was designed based on the flow pattern of the material filled into the mold and the result of air pressure and air pocket after the material was completely filled in the mold. Gaty shape was designed as a split type. The runner was designed to have the same shape as the initial inlet curve of the cavity, and the flow of the molten metal was prevented from turbulent flow. The most favorable results were obtained when the injection speed was $V_2=4.0m/s$. Defects on pores were reduced by applying high vacuum level inside the mold.