• Title/Summary/Keyword: Vacuum degree

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Study of Chromium thin films deposited by DC magnetron sputtering under glancing angle deposition at low working pressure

  • Bae, Kwang-Jin;Ju, Jae-Hoon;Cho, Young-Rae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.181.2-181.2
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    • 2015
  • Sputtering is one of the most popular physical deposition methods due to their versatility and reproducibility. Synthesis of Cr thin films by DC magnetron sputtering using glancing angle deposition (GLAD) has been reported. Chromium thin films have been prepared at two different working pressure($2.0{\times}10-2$, 30, $3.3{\times}10-3torr$) on Si-wafer substrate using magnetron sputtering with glancing angle deposition (GLAD) technique. The thickness of Cr thin films on the substrate was adjusted about 1 mm. The electrical property was measured by four-point probe method. For the measurement of density in the films, an X-ray reflectivity (XRR) was carried out. The sheet resistance and column angle increased with the increase of glancing angle. However, nanohardness and density of Cr thin films decreased as the glancing angle increased. The measured density for the Cr thin films decreased from 6.1 to 3.8 g/cc as the glancing angle increased from $0^{\circ}$ to $90^{\circ}$ degree. The low density of Cr thin films is resulted from the isolated columnar structure of samples. The evolution of the isolated columnar structure was enhanced at the conditions of low sputter pressure and high glancing angle. This GLAD technique can be potentially applied to the synthesis of thin films requiring porous and uniform coating such as thin film catalysts or gas sensors.

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Study on Cutting Processing Characteristic of Ti alloy (Ti 합금의 절삭 가공특성에 관한 연구)

  • 반재삼;이경원;김규하;조규종
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.1017-1020
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    • 2002
  • The pure Ti is taken annealing process for one hour at 90$0^{\circ}C$. The pure Ti is sufficient for ASTM B348 Grade2. The rolling mill roll the Ti-8Ta-3Nb(wt%) which became vacuum melting in arc furnace until the length is about 45mm and the thickness is about 6.05mm. Then it is made 6mm$\times$6mm$\times$44mm by wire cutting with EDM and it is made ∮ 6mm by rough cutting with the general purpose lathe. The machining accuracy of implant parts in the dental and medical science are decided by dimension, shpe, straightness, surface roughness. It is difficult to cut for the Ti alloy. It is caused problems of straight degree and surface roughness to the Ti alloy have many cases which length is smaller than diameter in cutting. Total 24 specimens different kind of 4 alloies are used in experiment to gain a cutting property. According to the cutting velocity, cutting depth, cutting temperature, feed and clearance angle experiments are performed. Conclusively it is expected that cutting depth of 0.5mm, feed velocity of 0.07mm/rev and cutting velocity of 80m/min could make a suitable result.

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A Novel Large Area Negative Sputter Ion Beam source and Its Application

  • Kim, Steven
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.73-73
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    • 1999
  • A large area negative metal ion beam source is developed. Kinetic ion beam of the incident metal ions yields a whole nucleation and growth phenomena compared to the conventional thin film deposition processes. At the initial deposition step one can engineer the surface and interface by tuning the energy of the incident metal ion beams. Smoothness and shallow implantation can be tailored according to the desired application process. Surface chemistry and nucleation process is also controlled by the energy of the direct metal ion beams. Each individual metal ion beams with specific energy undergoes super-thermodynamic reactions and nucleation. degree of formation of tetrahedral Sp3 carbon films and beta-carbon nitride directly depends on the energy of the ion beams. Grain size and formation of polycrystalline Si, at temperatures lower than 500deg. C is obtained and controlled by the energy of the incident Si-ion beams. The large area metal ion source combines the advantages of those magnetron sputter and SKIONs prior cesium activated metal ion source. The ion beam source produces uniform amorphous diamond films over 6 diameter. The films are now investigated for applications such as field emission display emitter materials, protective coatings for computer hard disk and head, and other protective optical coatings. The performance of the ion beam source and recent applications will be presented.

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A Study on the Optimum Bonding Preparation Condition of Single Crystal Superalloy (단결정 초내열합금의 재결정 방지를 위한 접합 전처리 조건에 관한 연구)

  • 김대업
    • Journal of Welding and Joining
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    • v.19 no.2
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    • pp.191-199
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    • 2001
  • The oxidation and recrystallization behaviors of Ni-base single crystal superalloy, CMSX-2 were investigated to determine the condition of the preparation for transient liquid phase (TLP) bonding operations. The faying surfaces of CMSX-2 were worked by the shot peening, fine cutting and mechanical polishing treatments and the degree of working of treated surfaces was evaluated by the hardness test and X-ray diffraction method CMSX-2 was heat-treated at 1,173∼1.589k for 3.6ks in vacuum of 4mPa. The mechanically polished surface was slightly oxidized after heat treatment even in the vacuum atmosphere of 4mPa. The thickness of an oxide film increased with increasing the heating temperature and the surface roughness of the faying surface. Recrystallization occurred at the surface after heat treatment at above 1,423K when the hardness was increased more than Hv600 by the shot peening treatment while the mechanically polished or fine cut surfaces didn't recrystallized. Based on these results, it was clearfied that the mechanically polishing with fine abrasive grit could be used for the preparation of faying surface of CMSX-2 before bonding operation.

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Role of gas flow rate during etching of hard-mask layer to extreme ultra-violet resist in dual-frequency capacitively coupled plasmas

  • Gwon, Bong-Su;Lee, Jeong-Hun;Lee, Nae-Eung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.132-132
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    • 2010
  • In the nano-scale Si processing, patterning processes based on multilevel resist structures becoming more critical due to continuously decreasing resist thickness and feature size. In particular, highly selective etching of the first dielectric layer with resist patterns are great importance. In this work, process window for the infinitely high etch selectivity of silicon oxynitride (SiON) layers and silicon nitride (Si3N4) with EUV resist was investigated during etching of SiON/EUV resist and Si3N4/EUV resist in a CH2F2/N2/Ar dual-frequency superimposed capacitive coupled plasma (DFS-CCP) by varying the process parameters, such as the CH2F2 and N2 flow ratio and low-frequency source power (PLF). It was found that the CH2F2/N2 flow ratio was found to play a critical role in determining the process window for ultra high etch selectivity, due to the differences in change of the degree of polymerization on SiON, Si3N4, and EUV resist. Control of N2 flow ratio gave the possibility of obtaining the ultra high etch selectivity by keeping the steady-state hydrofluorocarbon layer thickness thin on the SiON and Si3N4 surface due to effective formation of HCN etch by-products and, in turn, in continuous SiON and Si3N4 etching, while the hydrofluorocarbon layer is deposited on the EUV resist surface.

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Low Cost, Large Area Nanopatterning via Directed Self-Assembly

  • Kim, Sang-Uk
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.24-25
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    • 2011
  • Molecular self-assembly has several advantages over other nanofabrication methods. Molecular building blocks ensure ultrafine pattern precision, parallel structure formation allows for mass production and a variety of three-dimensional structures are available for fabricating complex structures. Nevertheless, the molecular interaction for self-assembly generally relies on weak forces such as van der Waals force, hydrogen bonding, or hydrophobic interaction. Due to the weak interaction, the structure formation is usually slow and the degree of ordering is low in a self-assembled structure. To promote self-assembly, directed assembly methods employing prepatterned substrates or external fields have been developed and gathered a great deal of technological attention as a next generation nanofabrication process. In this presentation a variety of directed assembly methods for soft nanomaterials including block copolymers, peptides and carbon nanomaterials will be introduced. Block copolymers are representative self-assembling materials extensively utilized in nanofabrication. In contrast to colloid assembly or anodized metal oxides, various shapes of nanostructures, including lines or interconnected networks, can be generated with a precise tunability over their shape and size. Applying prepatterned substrates$^{1,2}$ or introducing thickness modulation$^3$ to block copolymer thin films allowed for the control over the orientational and positional orderings of self-assembled structures. The nanofabrication processes for metals, semiconductors$^4$, carbon nanotubes$^{5,6}$, and graphene$^{6,7}$ templating block copolymer self-assembly will be presented.

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A Study on the Fabrication of the Lateral Accelerometer using SOG(Silicon On Glass) Process (SOG(Silicon On Glass)공정을 이용한 수평형 미소가속도계의 제작에 관한 연구)

  • Choi, Bum-Kyoo;Chang, Tae-Ha;Lee, Chang-Kil;Jung, Kyu-Dong;Kim, Jong-Pal
    • Journal of Sensor Science and Technology
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    • v.13 no.6
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    • pp.430-435
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    • 2004
  • The resolution of the accelerometer, fabricated with MEMS technology is mainly affected by mechanical and electrical noise. To reduce mechanical noise, we have to increase mass of the structure part and quality factor related with the degree of vacuum packaging. On the other hand, to increase mass of the structure part, the thickness of the structure must be increased and ICP-RIE is used to fabricate the high aspect ratio structure. At this time, footing effect make the sensitivity of the accelerometer decreasing. This paper presents a hybrid SOG(Silicon On Glass) Process to fabricate a lateral silicon accelerometer with differential capacitance sensing scheme which has been designed and simulated. Using hybrid SOG Process, we could make it a real to increase the structural thickness and to prevent the footing effect by deposition of metal layer at the bottom of the structure. Moreover, we bonded glass wafer to structure wafer anodically, so we could realize the vacuum packaging at wafer level. Through this way, we could have an idea of controlling of quality factor.

A study on wear damage of SKD11 steel material for a cutting mold jig (SKD11 절단금형치구용 소재의 마모손상에 관한 연구)

  • Nam, Ki-Woo;Kim, Cheol-Su;Ahn, Seok-Hwan
    • Journal of Power System Engineering
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    • v.20 no.5
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    • pp.5-13
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    • 2016
  • This study is on wear damage of the material for a molding machine that be used at finally cutting of metal beam made in roll forming process of vehicle bump beam process line. SKD11 steel was used with the material for cutting mold jig. In the cutting mold jig, Ti diffusion heat treatment after vacuum heat treatment was carried out for upgrade of surface hardness and anti-wear. Also, the heat treatments by various methods were performed to compare the wear damage degree against above the existing heat treatment. Wear loss and friction coefficient were obtained from wear test. And, micro Vickers hardness values were compared with damaged parts or not of cutting mold jig. Micro Vickers hardness value appeared higher at the undamaged part by Ti diffusion heat treatment. The micro Vickers hardness well followed a two-parameter Weibull probability distribution.

Statistical Analysis of Microhardness Variations in Plasma Sprayed $Cr_3C_2-NiCr$ Coatings

  • Li, Jianfeng;Huang, jingqi;Ding, Chuanxian
    • Journal of the Korean Vacuum Society
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    • v.7 no.s1
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    • pp.171-178
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    • 1998
  • The microstructure and properties of plasma-sprayed coatings depend on a great number of spraying parameters, random factors, which lead to vibration in these spraying parameters, may in some degree influence the microstructure and properties of the coatings. Therefore, the property values appear certain distributions, and the description and comparison of the properties of plasma-sprayed coatings should be performed employing statistical analysis. In this paper, $Cr_3C_2$-Nicr coatings of different thickness were sprayed onto stainless steel using atmosphere plasma system and adopting three kinds of gun translation speeds. Then the microhardness measurements were performed on polished surface of the coatings. Forty readings were taken and statistically analyzed by calculating the characteristic values, estimating and comparing the means, and assessing whether they belonged to the Normal or Weibull Distribution. This study has found that statistical analysis could discriminate influence of spraying parameters and coating design on microhardness of the $Cr_3C_2$-Nicr coatings from random vibration, which showed that the microharness of the $Cr_3C_2$-Nicr coatings were related to gun translation speed coating thickness.

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Characteristics of Polymer irradiated by Low energy Ion Beam

  • sung Han;Yoon, Ki-Hyun;Jung, Hyung-Jin;Koh, Seok-Keun
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.109-109
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    • 1999
  • Recently, low energy ion beam irradiation has been adopted for surface modification. Low energy ion beam irradiation has many advantages in polymer engineering such as weak damage, good adhesion, noticeably-enhanced wettability(less than 15 degree), good reproducibility and so on. In this experiment, chemical reactions between free radicals and environment gas species have been investigated using angle-resolved XPS and TRIM code. In the case of low ion beam energy (around 1 keV), energy loss in polymer is mainly originated from atomic collisions instead of electronic interference. Atomic collisions could generated displaced atoms and free radicals. Cold cathode-ion source equipped with 5cm convex grid was used in an O2 environment. Base and working pressure were 5$\times$10-6 and 2.3$\times$10-4 Torr. Flow rates of argon and oxygen were fixed at 1.2 and 8 sccm. target materials are polyethylene polyvinyidenefluoride and polytetrafluoroethylene.

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